BANG; Hye Min

Patent Applications and Registrations

Patent applications and USPTO patent grants for BANG; Hye Min.The latest application filed is for "multilayer electronic component".

Company Profile

9.9.15

BANG; Hye Min - Suwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multilayer Electronic Component App 20220189700 - LEE; Jang Yeol ; et al.	2022-06-16
Multilayer Capacitor App 20220172895 - LEE; Jang Yeol ; et al.	2022-06-02
Multilayer Capacitor App 20220172899 - LEE; Jang Yeol ; et al.	2022-06-02
Multilayer Capacitor App 20220172898 - LEE; Jang Yeol ; et al.	2022-06-02
Multilayer seed pattern inductor, manufacturing method thereof, and board having the same Grant 11,276,520 - Choi , et al. March 15, 2	2022-03-15
Multilayer Ceramic Electronic Component And Board For Mounting Of The Same App 20210335546 - BANG; Hye Min ; et al.	2021-10-28
Multilayer ceramic electronic component and board for mounting of the same Grant 11,069,481 - Bang , et al. July 20, 2	2021-07-20
Multilayer capacitor Grant 10,861,651 - Lee , et al. December 8, 2	2020-12-08
Chip electronic component and manufacturing method thereof Grant 10,801,121 - Cha , et al. October 13, 2	2020-10-13
Multilayer Seed Pattern Inductor And Manufacturing Method Thereof App 20200194158 - CHOI; Woon Chul ; et al.	2020-06-18
Multilayer seed pattern inductor and manufacturing method thereof Grant 10,614,943 - Choi , et al.	2020-04-07
Multilayer Ceramic Electronic Component And Board For Mounting Of The Same App 20200066451 - BANG; Hye Min ; et al.	2020-02-27
Multilayer ceramic electronic component and board for mounting of the same Grant 10,573,460 - Bang , et al. Feb	2020-02-25
Multilayer Ceramic Electronic Component And Board For Mounting Of The Same App 20190385797 - BANG; Hye Min ; et al.	2019-12-19
Multilayer Capacitor App 20190341190 - LEE; Jong Ho ; et al.	2019-11-07
Multilayer seed pattern inductor, manufacturing method thereof, and board having the same Grant 10,388,447 - Choi , et al. A	2019-08-20
Chip electronic component Grant 10,319,515 - Jung , et al.	2019-06-11
Multilayer Seed Pattern Inductor, Manufacturing Method Thereof, And Board Having The Same App 20190096563 - CHOI; Woon Chul ; et al.	2019-03-28
Chip Electronic Component And Manufacturing Method Thereof App 20180148854 - CHA; Hye Yeon ; et al.	2018-05-31
Chip electronic component and manufacturing method thereof Grant 9,945,042 - Cha , et al. April 17, 2	2018-04-17
Chip Electronic Component App 20160343500 - JUNG; Jung Hyuk ; et al.	2016-11-24
Multilayer Seed Pattern Inductor And Manufacturing Method Thereof App 20160336105 - CHOI; Woon Chul ; et al.	2016-11-17
Multilayer Seed Pattern Inductor, Manufacturing Method Thereof, And Board Having The Same App 20160163444 - CHOI; Woon Chul ; et al.	2016-06-09
Chip Electronic Component And Manufacturing Method Thereof App 20150270053 - CHA; Hye Yeon ; et al.	2015-09-24

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