Bancod; Ludovico E.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bancod; Ludovico E..The latest application filed is for "semiconductor package and manufacturing method thereof".
- Bancod; Ludovico E. - Chandler AZ
- Bancod; Ludovico E. - Modesto CA
| Patent | Date |
|---|---|
| Semiconductor Package And Manufacturing Method Thereof App 20210217725 - Kim; Jin Seong ; et al. | 2021-07-15 |
| Semiconductor package and manufacturing method thereof Grant 10,872,879 - Kim , et al. December 22, 2 | 2020-12-22 |
| Semiconductor package and manufacturing method thereof Grant 10,163,867 - Kim , et al. Dec | 2018-12-25 |
| Semiconductor Package And Manufacturing Method Thereof App 20180323170 - Kim; Jin Seong ; et al. | 2018-11-08 |
| Semiconductor Package And Manufacturing Method Thereof App 20180138155 - Kim; Jin Seong ; et al. | 2018-05-17 |
| Flex circuit package and method Grant 8,536,462 - Darveaux , et al. September 17, 2 | 2013-09-17 |
| Stackable plasma cleaned via package and method Grant 8,338,229 - Bancod , et al. December 25, 2 | 2012-12-25 |
| Secure digital memory card using land grid array structure Grant 7,485,491 - Miks , et al. February 3, 2 | 2009-02-03 |
| Thin integrated circuit device packages for improved radio frequency performance App 20070176287 - Crowley; Sean T. ; et al. | 2007-08-02 |
| Secure digital memory card using land grid array structure Grant 7,112,875 - Miks , et al. September 26, 2 | 2006-09-26 |
| Leadframe strip having enhanced testability Grant 7,008,825 - Bancod , et al. March 7, 2 | 2006-03-07 |
| Reduced copper lead frame for saw-singulated chip package Grant 6,885,086 - Fogelson , et al. April 26, 2 | 2005-04-26 |
| Saw and etch singulation method for a chip package Grant 6,841,414 - Hu , et al. January 11, 2 | 2005-01-11 |
| Headrest with side supports Grant 5,370,446 - Bancod December 6, 1 | 1994-12-06 |
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