| Patent | Date |
|---|
Method For Preventing Line Bending During Metal Fill Process
App 20220262640 - Jandl; Adam ; et al. | 2022-08-18 |
Low Resistivity Films Containing Molybdenum
App 20220223471 - THOMBARE; Shruti Vivek ; et al. | 2022-07-14 |
Deposition Of Metal Films
App 20220195598 - Collins; Joshua ; et al. | 2022-06-23 |
Method for preventing line bending during metal fill process
Grant 11,355,345 - Jandl , et al. June 7, 2 | 2022-06-07 |
Atomic layer deposition of tungsten for enhanced fill and reduced substrate attack
Grant 11,225,712 - Collins , et al. January 18, 2 | 2022-01-18 |
Method Of Depositing Tungsten And Other Metals In 3d Nand Structures
App 20210238736 - Butail; Gorun ; et al. | 2021-08-05 |
Self-limiting Growth
App 20200402846 - Collins; Joshua ; et al. | 2020-12-24 |
Low Resistivity Films Containing Molybdenum
App 20200365456 - Thombare; Shruti Vivek ; et al. | 2020-11-19 |
Low resistivity films containing molybdenum
Grant 10,777,453 - Thombare , et al. Sept | 2020-09-15 |
Method For Preventing Line Bending During Metal Fill Process
App 20200144066 - Jandl; Adam ; et al. | 2020-05-07 |
Low Resistivity Films Containing Molybdenum
App 20200075403 - Thombare; Shruti Vivek ; et al. | 2020-03-05 |
Method for preventing line bending during metal fill process
Grant 10,573,522 - Jandl , et al. Feb | 2020-02-25 |
Forming low resistivity fluorine free tungsten film without nucleation
Grant 10,546,751 - Bamnolker , et al. Ja | 2020-01-28 |
Tungsten for wordline applications
Grant 10,529,722 - Danek , et al. J | 2020-01-07 |
Low resistivity films containing molybdenum
Grant 10,510,590 - Thombare , et al. Dec | 2019-12-17 |
Atomic Layer Deposition Of Tungsten For Enhanced Fill And Reduced Substrate Attack
App 20190185992 - Collins; Joshua ; et al. | 2019-06-20 |
Atomic layer deposition of tungsten for enhanced fill and reduced substrate attack
Grant 10,214,807 - Collins , et al. Feb | 2019-02-26 |
Low Resistivity Films Containing Molybdenum
App 20180294187 - Thombare; Shruti Vivek ; et al. | 2018-10-11 |
Forming Low Resistivity Fluorine Free Tungsten Film Without Nucleation
App 20180240675 - Bamnolker; Hanna ; et al. | 2018-08-23 |
Tungsten For Wordline Applications
App 20180219014 - Danek; Michal ; et al. | 2018-08-02 |
Method of forming low resistivity fluorine free tungsten film without nucleation
Grant 9,978,605 - Bamnolker , et al. May 22, 2 | 2018-05-22 |
Tungsten for wordline applications
Grant 9,953,984 - Danek , et al. April 24, 2 | 2018-04-24 |
Method For Preventing Line Bending During Metal Fill Process
App 20180053660 - Jandl; Adam ; et al. | 2018-02-22 |
Atomic Layer Deposition Of Tungsten For Enhanced Fill And Reduced Substrate Attack
App 20170350008 - Collins; Joshua ; et al. | 2017-12-07 |
Method For Depositing Extremely Low Resistivity Tungsten
App 20170133231 - Bamnolker; Hanna ; et al. | 2017-05-11 |
Method Of Forming Low Resistivity Fluorine Free Tungsten Film Without Nucleation
App 20170117155 - Bamnolker; Hanna ; et al. | 2017-04-27 |
Methods of preparing tungsten and tungsten nitride thin films using tungsten chloride precursor
Grant 9,595,470 - Bamnolker , et al. March 14, 2 | 2017-03-14 |
Method for depositing extremely low resistivity tungsten
Grant 9,589,808 - Bamnolker , et al. March 7, 2 | 2017-03-07 |
Tungsten For Wordline Applications
App 20160233220 - Danek; Michal ; et al. | 2016-08-11 |
Methods Of Filling High Aspect Ratio Features With Fluorine Free Tungsten
App 20150348840 - Bamnolker; Hanna ; et al. | 2015-12-03 |
Methods Of Preparing Tungsten And Tungsten Nitride Thin Films Using Tungsten Chloride Precursor
App 20150325475 - Bamnolker; Hanna ; et al. | 2015-11-12 |
Method For Depositing Extremely Low Resistivity Tungsten
App 20150179461 - Bamnolker; Hanna ; et al. | 2015-06-25 |
Reducing defect formation within an etched semiconductor topography
Grant 7,129,178 - Schwarz , et al. October 31, 2 | 2006-10-31 |
Method for and structure formed from fabricating a relatively deep isolation structure
Grant 6,794,269 - Gopalan , et al. September 21, 2 | 2004-09-21 |
Method of forming contact openings
Grant 6,756,315 - Bamnolker , et al. June 29, 2 | 2004-06-29 |
Process for the preparation of microspheres and microspheres made thereby
Grant 6,103,379 - Margel , et al. August 15, 2 | 2000-08-15 |
Ultra-low particle semiconductor cleaner for removal of particle contamination and residues from surface oxide formation on semiconductor wafers
Grant 6,004,399 - Wong , et al. December 21, 1 | 1999-12-21 |
| 