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Ballad; William J. Patent Filings

Ballad; William J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ballad; William J..The latest application filed is for "earphone assembly with moisture resistance".

Company Profile
0.6.4
  • Ballad; William J. - Buffalo Grove IL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Earphone assembly with moisture resistance
Grant 9,451,349 - Wickstrom , et al. September 20, 2
2016-09-20
Earphone assembly with moisture resistance
Grant 9,078,064 - Wickstrom , et al. July 7, 2
2015-07-07
Earphone Assembly With Moisture Resistance
App 20140010399 - Wickstrom; Timothy K. ;   et al.
2014-01-09
Earphone assembly with moisture resistance
Grant 8,532,323 - Wickstrom , et al. September 10, 2
2013-09-10
Earphone Assembly With Moisture Resistance
App 20110182455 - Wickstrom; Timothy K. ;   et al.
2011-07-28
Isolating deep canal fitting earphone
Grant 7,477,756 - Wickstrom , et al. January 13, 2
2009-01-13
Electroacoustic system and method of manufacturing thereof
App 20080101640 - Ballad; William J. ;   et al.
2008-05-01
Isolating deep canal fitting earphone
App 20070217642 - Wickstrom; Timothy K. ;   et al.
2007-09-20
Electret assembly
Grant 5,335,286 - Carlson , et al. August 2, 1
1994-08-02

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