Ball; Michael B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ball; Michael B..The latest application filed is for "methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods".

Company Profile

0.76.49

Ball; Michael B. - Boise ID
Ball; Michael B. - Bosie ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods Grant 7,846,776 - Polinsky , et al. December 7, 2	2010-12-07
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux Grant 7,644,853 - Cobbley , et al. January 12, 2	2010-01-12
System for locating conductive sphere utilizing screen and hopper of solder balls Grant 7,635,079 - Cobbley , et al. December 22, 2	2009-12-22
Method of fabrication of stacked semiconductor devices Grant 7,371,612 - Ball May 13, 2	2008-05-13
Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods App 20080044985 - Polinsky; William A. ; et al.	2008-02-21
Multi-chip stacked devices Grant RE40,061 - Ball February 12, 2	2008-02-12
Apparatus for locating conductive spheres utilizing screen and hopper of solder balls Grant 7,275,676 - Cobbley , et al. October 2, 2	2007-10-02
Method of fabricating a multi-die semiconductor package assembly App 20070117266 - Ball; Michael B.	2007-05-24
Method of fabricating a multi-die semiconductor package assembly Grant 7,166,495 - Ball January 23, 2	2007-01-23
Methods for lead penetrating clamping system Grant 7,131,568 - Ball November 7, 2	2006-11-07
Method of locating conductive spheres utilizing screen and hopper of solder balls Grant 7,105,432 - Cobbley , et al. September 12, 2	2006-09-12
Apparatus of clamping semiconductor devices using sliding finger supports App 20060157532 - Ball; Michael B.	2006-07-20
Method of fabrication of stacked semiconductor devices App 20060121645 - Ball; Michael B.	2006-06-08
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux App 20060027624 - Cobbley; Chad A. ; et al.	2006-02-09
Method of fabrication of stacked semiconductor devices Grant 6,989,285 - Ball January 24, 2	2006-01-24
Apparatus of clamping semiconductor devices using sliding finger supports Grant 6,981,629 - Ball January 3, 2	2006-01-03
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux Grant 6,957,760 - Cobbley , et al. October 25, 2	2005-10-25
Apparatus for routing die interconnections using intermediate connection elements secured to the die face Grant 6,956,294 - Ball October 18, 2	2005-10-18
Using backgrind wafer tape to enable wafer mounting of bumped wafers Grant 6,949,158 - Ball , et al. September 27, 2	2005-09-27
Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed App 20050142835 - Ball, Michael B. ; et al.	2005-06-30
Using backgrind wafer tape to enable wafer mounting of bumped wafers App 20050098887 - Ball, Michael B. ; et al.	2005-05-12
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time Grant 6,886,734 - Ball , et al. May 3, 2	2005-05-03
Angularly offset stacked die multichip device and method of manufacture Grant 6,884,657 - Fogal , et al. April 26, 2	2005-04-26
Method of locating conductive spheres utilizing screen and hopper of solder balls App 20050056681 - Cobbley, Chad A. ; et al.	2005-03-17
Method of locating conductive spheres utilizing screen and hopper of solder balls App 20050056682 - Cobbley, Chad A. ; et al.	2005-03-17
Method of disposing conductive bumps onto a semiconductor device Grant 6,861,345 - Ball , et al. March 1, 2	2005-03-01
Bondhead lead clamp apparatus Grant 6,845,898 - Ball , et al. January 25, 2	2005-01-25
Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux Grant 6,844,216 - Cobbley , et al. January 18, 2	2005-01-18
Method of fabrication of stacked semiconductor devices App 20050009236 - Ball, Michael B.	2005-01-13
Bondhead lead clamp apparatus and method Grant 6,837,418 - Ball , et al. January 4, 2	2005-01-04
Method for clamping and wire-bonding the leads of a lead frame one set at a time Grant 6,786,387 - Ball , et al. September 7, 2	2004-09-07
Method of fabrication of stacked semiconductor devices Grant 6,784,023 - Ball August 31, 2	2004-08-31
Lead penetrating clamping system Grant 6,732,902 - Ball May 11, 2	2004-05-11
Bondhead lead clamp apparatus and method App 20040065719 - Ball, Michael B. ; et al.	2004-04-08
Apparatus for clamping semiconductor devices using sliding finger supports Grant 6,715,659 - Ball April 6, 2	2004-04-06
Apparatus of clamping semiconductor devices using sliding finger supports App 20040035913 - Ball, Michael B.	2004-02-26
Methods for lead penetrating clamping system App 20040026483 - Ball, Michael B.	2004-02-12
Bondhead lead clamp apparatus App 20040026478 - Ball, Michael B. ; et al.	2004-02-12
Bondhead lead clamp apparatus Grant 6,662,993 - Ball , et al. December 16, 2	2003-12-16
Wafer dicing blade consisting of multiple layers Grant 6,641,381 - Ball November 4, 2	2003-11-04
Method for conserving a resource by flow interruption Grant 6,641,459 - Ball November 4, 2	2003-11-04
Apparatus of clamping semiconductor devices using sliding finger supports Grant 6,637,636 - Ball October 28, 2	2003-10-28
Method for routing die interconnections using intermediate connection elements secured to the die face Grant 6,630,372 - Ball October 7, 2	2003-10-07
Method of improving interconnect of semiconductor devices by utilizing a flattened ball bond Grant 6,624,059 - Ball September 23, 2	2003-09-23
In-process device with grooved coating layer on a semiconductor wafer for relieving surface tension Grant 6,621,147 - Ball September 16, 2	2003-09-16
Quick change precisor Grant 6,607,121 - Fogal , et al. August 19, 2	2003-08-19
Bondhead lead clamp apparatus and method Grant 6,604,671 - Ball , et al. August 12, 2	2003-08-12
Lead penetrating clamping system Grant 6,604,670 - Ball August 12, 2	2003-08-12
Apparatus and methods for coupling conductive leads of semiconductor assemblies Grant 6,602,778 - Manning , et al. August 5, 2	2003-08-05
Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux App 20030121957 - Cobbley, Chad A. ; et al.	2003-07-03
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux App 20030111508 - Cobbley, Chad A. ; et al.	2003-06-19
Method of locating conductive spheres utilizing screen and hopper of solder balls App 20030110626 - Cobbley, Chad A. ; et al.	2003-06-19
Angularly offset and recessed stacked die multichip device and method of manufacture Grant 6,563,205 - Fogal , et al. May 13, 2	2003-05-13
Apparatus and method of clamping semiconductor devices using sliding finger supports App 20030057252 - Ball, Michael B.	2003-03-27
Method and apparatus for routing die interconnections using intermediate connection elements secured to the die face App 20030057570 - Ball, Michael B.	2003-03-27
Wafer dicing blade consisting of multiple layers App 20030024522 - Ball, Michael B.	2003-02-06
Bondhead lead clamp apparatus App 20020185519 - Ball, Michael B. ; et al.	2002-12-12
Lead penetrating clamping system App 20020185520 - Ball, Michael B.	2002-12-12
Bondhead lead clamp apparatus and method App 20020179687 - Ball, Michael B. ; et al.	2002-12-05
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time App 20020179691 - Ball, Michael B. ; et al.	2002-12-05
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time App 20020179675 - Ball, Michael B. ; et al.	2002-12-05
Method of improving interconnect of semiconductor devices by utilizing a flattened ball bond App 20020177296 - Ball, Michael B.	2002-11-28
Using backgrind wafer tape to enable wafer mounting of bumped wafers App 20020166625 - Ball, Michael B. ; et al.	2002-11-14
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time Grant 6,478,211 - Ball , et al. November 12, 2	2002-11-12
Method of relieving surface tension on a semiconductor wafer App 20020151187 - Ball, Michael B.	2002-10-17
Quick change precisor App 20020125296 - Fogal, Rich ; et al.	2002-09-12
Lead penetrating clamping system App 20020092893 - Ball, Michael B.	2002-07-18
Method of improving interconnect of semiconductor devices by using a flattened ball bond Grant 6,420,256 - Ball July 16, 2	2002-07-16
Apparatus and methods for coupling conductive leads of semiconductor assemblies App 20020089070 - Manning, Troy A. ; et al.	2002-07-11
Wafer dicing blade consisting of multiple layers App 20020077043 - Ball, Michael B.	2002-06-20
Multi-chip device utilizing a flip chip and wire bond assembly Grant 6,407,456 - Ball June 18, 2	2002-06-18
Method of relieving surface tension on a semiconductor wafer Grant 6,403,449 - Ball June 11, 2	2002-06-11
Apparatus and methods for coupling conductive leads of semiconductor assemblies Grant 6,380,635 - Manning , et al. April 30, 2	2002-04-30
Flip Chip And Conventional Stack App 20020045290 - BALL, MICHAEL B.	2002-04-18
Method and apparatus for routing die interconnections using intermediate connection elements secured to the die face App 20020041026 - Ball, Michael B.	2002-04-11
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time App 20020040921 - Ball, Michael B. ; et al.	2002-04-11
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time App 20020030088 - Ball, Michael B. ; et al.	2002-03-14
Method of fabrication of stacked semiconductor devices App 20020031864 - Ball, Michael B.	2002-03-14
Bondhead lead clamp apparatus and method App 20020023944 - Ball, Michael B. ; et al.	2002-02-28
Bondhead lead clamp apparatus and method App 20020023940 - Ball, Michael B. ; et al.	2002-02-28
Method of fabrication of stacked semiconductor devices Grant 6,337,227 - Ball January 8, 2	2002-01-08
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time Grant 6,334,566 - Ball , et al. January 1, 2	2002-01-01
Method for conserving a resource by flow interruption App 20010041500 - Ball, Michael B.	2001-11-15
Method of locating conductive spheres utilizing screen and hopper of solder balls App 20010041437 - Cobbley, Chad A. ; et al.	2001-11-15
Lead penetrating clamping system App 20010027988 - Ball, Michael B.	2001-10-11
Apparatus and method of clamping semiconductor devices using sliding finger supports App 20010027989 - Ball, Michael B.	2001-10-11
Apparatus and method of clamping semiconductor devices using sliding finger supports Grant 6,299,057 - Ball October 9, 2	2001-10-09
Method for conserving a resource by flow interruption App 20010025660 - Ball, Michael B.	2001-10-04
Method and apparatus for screen printing App 20010025574 - Ball, Michael B.	2001-10-04
Quick change precisor App 20010025872 - Fogal, Rich ; et al.	2001-10-04
Wafer handling device having conforming perimeter seal Grant 6,279,976 - Ball August 28, 2	2001-08-28
Apparatus and method of clamping semiconductor devices using sliding finger supports App 20010013531 - Ball, Michael B.	2001-08-16
Apparatus and method of clamping semiconductor devices using sliding finger supports Grant 6,267,287 - Ball July 31, 2	2001-07-31
Method of locating conductive spheres utilizing screen and hopper of solder balls Grant 6,268,275 - Cobbley , et al. July 31, 2	2001-07-31
Lead penetrating clamping system App 20010008248 - Ball, Michael B.	2001-07-19
Method for conserving a resource by flow interruption Grant 6,240,942 - Ball June 5, 2	2001-06-05
Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed App 20010002044 - Ball, Michael B. ; et al.	2001-05-31
Method for positioning the bond head in a wire bonding machine Grant 6,196,445 - Fogal , et al. March 6, 2	2001-03-06
Method for electrically coupling bond pads of a microelectronic device Grant 6,192,578 - Manning , et al. February 27, 2	2001-02-27
Method of fabrication of stacked semiconductor devices Grant 6,165,815 - Ball December 26, 2	2000-12-26
Die interconnections using intermediate connection elements secured to the die face Grant 6,097,098 - Ball August 1, 2	2000-08-01
Combination of semiconductor interconnect Grant 6,080,264 - Ball June 27, 2	2000-06-27
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time Grant 6,068,174 - Ball , et al. May 30, 2	2000-05-30
Angularly offset stacked die multichip device and method of manufacture Grant 6,051,886 - Fogal , et al. April 18, 2	2000-04-18
Lead finger clamp assembly and method of stabilizing lead frame elements Grant 6,047,468 - Fogal , et al. April 11, 2	2000-04-11
Multi-chip stacked devices Grant RE36,613 - Ball March 14, 2	2000-03-14
Method of improving interconnect of semiconductor device by utilizing a flattened ball bond Grant 5,976,964 - Ball November 2, 1	1999-11-02
Quick change precisor Grant 5,971,256 - Fogal , et al. October 26, 1	1999-10-26
Angularly offset stacked die multichip device and method of manufacture Grant 5,963,794 - Fogal , et al. October 5, 1	1999-10-05
Lead finger clamp assembly Grant 5,954,842 - Fogal , et al. September 21, 1	1999-09-21
Stacked semiconductor devices Grant 5,952,725 - Ball September 14, 1	1999-09-14
Combination of semiconductor interconnect Grant 5,917,242 - Ball June 29, 1	1999-06-29
Multi-chip device and method of fabrication employing leads over and under processes Grant 5,898,220 - Ball April 27, 1	1999-04-27
Apparatus and method of clamping semiconductor devices using sliding finger supports Grant 5,890,644 - Ball April 6, 1	1999-04-06
Angularly offset and recessed stacked die multichip device Grant 5,886,412 - Fogal , et al. March 23, 1	1999-03-23
Angularly offset stacked die multichip device and method of manufacture Grant 5,874,781 - Fogal , et al. February 23, 1	1999-02-23
Method and apparatus for grinding wafers Grant 5,827,112 - Ball October 27, 1	1998-10-27
Method and apparatus for grinding wafers Grant 5,827,111 - Ball October 27, 1	1998-10-27
Conductive lines on the back side of wafers and dice for semiconductor interconnects Grant 5,801,448 - Ball September 1, 1	1998-09-01
Mechanical vision system using selective wavelength and brightness illumination Grant 5,758,942 - Fogal , et al. June 2, 1	1998-06-02
Angularly offset stacked die multichip device and method of manufacture Grant 5,721,452 - Fogal , et al. February 24, 1	1998-02-24
Multi-chip device and method of fabrication employing leads over and under processes Grant 5,689,135 - Ball November 18, 1	1997-11-18
Lead penetrating clamping system Grant 5,673,845 - Ball October 7, 1	1997-10-07
Multichip module having a stacked chip arrangement Grant 5,323,060 - Fogal , et al. June 21, 1	1994-06-21
Multi-chip stacked devices Grant 5,291,061 - Ball March 1, 1	1994-03-01