Balisky; Todd

Patent Applications and Registrations

Patent applications and USPTO patent grants for Balisky; Todd.The latest application filed is for "method and apparatus for wafer electroless plating".

Company Profile

0.7.6

Balisky; Todd - Corona CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for wafer electroless plating Grant 9,287,110 - Thie , et al. March 15, 2	2016-03-15
Fluid handling system for wafer electroless plating and associated methods Grant 8,844,461 - Thie , et al. September 30, 2	2014-09-30
Method and Apparatus for Wafer Electroless Plating App 20130280917 - Thie; William ; et al.	2013-10-24
Method and apparatus for wafer electroless plating Grant 8,485,120 - Thie , et al. July 16, 2	2013-07-16
Wafer electroless plating system and associated methods Grant 8,314,027 - Thie , et al. November 20, 2	2012-11-20
Wafer Electroless Plating System and Associated Methods App 20120045897 - Thie; William ; et al.	2012-02-23
Wafer electroless plating system and associated methods Grant 8,069,813 - Thie , et al. December 6, 2	2011-12-06
Fluid Handling System for Wafer Electroless Plating and Associated Methods App 20080251148 - Thie; William ; et al.	2008-10-16
Method and Apparatus for Wafer Electroless Plating App 20080254225 - Thie; William ; et al.	2008-10-16
Wafer Electroless Plating System and Associated Methods App 20080254621 - Thie; William ; et al.	2008-10-16
Point of use mixing and aging system for chemicals used in a film forming apparatus App 20020127875 - Weidman, Timothy ; et al.	2002-09-12

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