Balanon; Gerry

Patent Applications and Registrations

Patent applications and USPTO patent grants for Balanon; Gerry.The latest application filed is for "heat spreader interconnect for thermally enhanced pbga packages".

Company Profile

0.5.4

Balanon; Gerry - Singapore SG
Balanon; Gerry - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package with heat sink Grant 7,446,408 - Shim , et al. November 4, 2	2008-11-04
Heat spreader interconnect for thermally enhanced PBGA packages Grant 6,818,981 - Shim , et al. November 16, 2	2004-11-16
Heat spreader interconnect for thermally enhanced PBGA packages App 20040155338 - Shim, Il Kwon ; et al.	2004-08-12
Heat spreader interconnect methodology for thermally enhanced PBGA packages Grant 6,706,563 - Shim , et al. March 16, 2	2004-03-16
PBGA substrate for anchoring heat sink App 20030216024 - Shim, Il Kwon ; et al.	2003-11-20
Heat spreader interconnect methodology for thermally enhanced PBGA packages App 20030197195 - Shim, Il Kwon ; et al.	2003-10-23
PBGA substrate for anchoring heat sink Grant 6,599,779 - Shim , et al. July 29, 2	2003-07-29
PBGA substrate for anchoring heat sink App 20030057545 - Shim, IL Kwon ; et al.	2003-03-27
Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package Grant 6,534,859 - Shim , et al. March 18, 2	2003-03-18

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