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Patent applications and USPTO patent grants for Bakshi; Abhaya Kumar.The latest application filed is for "abrasive grain powder".
Patent | Date |
---|---|
In-situ wafer processing system and method Grant 8,261,730 - Bakshi , et al. September 11, 2 | 2012-09-11 |
Method and apparatus for cutting and cleaning wafers in a wire saw Grant 8,065,995 - Bakshi , et al. November 29, 2 | 2011-11-29 |
Abrasive grain powder Grant 8,002,861 - Boussant-Roux , et al. August 23, 2 | 2011-08-23 |
Abrasive Grain Powder App 20110100346 - Boussant-Roux; Yves ;   et al. | 2011-05-05 |
Method And Apparatus For Cutting Wafers By Wire Sawing App 20100126488 - Bakshi; Abhaya Kumar ;   et al. | 2010-05-27 |
In-situ Wafer Processing System And Method App 20100126489 - Bakshi; Abhaya Kumar ;   et al. | 2010-05-27 |
Method And Apparatus For Cutting And Cleaning Wafers In A Wire Saw App 20100126490 - BAKSHI; ABHAYA KUMAR ;   et al. | 2010-05-27 |
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