| Patent | Date |
|---|
Mechanically flexible interconnects, methods of making the same, and methods of use
Grant 10,636,731 - Bakir , et al. | 2020-04-28 |
Mixed-signal substrate with integrated through-substrate vias
Grant 10,330,874 - Thadesar , et al. | 2019-06-25 |
Mechanically Flexible Interconnects, Methods Of Making The Same, And Methods Of Use
App 20190006271 - BAKIR; Muhannad S. ; et al. | 2019-01-03 |
Vertically Curved Mechanically Flexible Interconnects, Methods Of Making The Same, And Methods Of Use
App 20180294211 - BAKIR; MUHANNAD S. ; et al. | 2018-10-11 |
Mixed-Signal Substrate with Integrated Through-Substrate Vias
App 20170223825 - Thadesar; Paragkumar ; et al. | 2017-08-03 |
Air-gap C4 fluidic I/O interconnects and methods of fabricating same
Grant 8,563,365 - King, Jr. , et al. October 22, 2 | 2013-10-22 |
3-D ICs equipped with double sided power, coolant, and data features
Grant 8,546,930 - Bakir , et al. October 1, 2 | 2013-10-01 |
Air-gap C4 Fluidic I/o Interconnects And Methods Of Fabricating Same
App 20120228779 - King, JR.; Calvin Richard ; et al. | 2012-09-13 |
3-D ICs with microfluidic interconnects and methods of constructing same
Grant 7,928,563 - Bakir , et al. April 19, 2 | 2011-04-19 |
3-D ICs EQUIPPED WITH DOUBLE SIDED POWER, COOLANT, AND DATA FEATURES
App 20100187683 - BAKIR; MUHANNAD S. ; et al. | 2010-07-29 |
3-D ICs WITH MICROFLUIDIC INTERCONNECTS AND METHODS OF CONSTRUCTING SAME
App 20090294954 - Bakir; Muhannad S. ; et al. | 2009-12-03 |
Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof
Grant 7,468,558 - Bakir , et al. December 23, 2 | 2008-12-23 |
Microfluidic, optical, and electrical input output interconnects, methods of fabrication thereof, and methods of use thereof
Grant 7,266,267 - Bakir , et al. September 4, 2 | 2007-09-04 |
Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof
Grant 7,135,777 - Bakir , et al. November 14, 2 | 2006-11-14 |
Devices having compliant wafer-level packages with pillars and methods of fabrication
Grant 7,132,736 - Bakir , et al. November 7, 2 | 2006-11-07 |
Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof
App 20060209519 - Bakir; Muhannad S. ; et al. | 2006-09-21 |
Dual-mode/function optical and electrical interconnects, methods of fabrication thereof, and methods of use thereof
Grant 7,099,525 - Bakir , et al. August 29, 2 | 2006-08-29 |
Microfluidic, optical, and electrical input output interconnects, methods of fabrication thereof, and methods of use thereof
App 20060104566 - Bakir; Muhannad S. ; et al. | 2006-05-18 |
Dual-mode/function optical and electrical interconnects, methods of fabrication thereof, and methods of use thereof
App 20040184703 - Bakir, Muhannad S. ; et al. | 2004-09-23 |
Curved metal-polymer dual-mode/function optical and electrical interconnects, methods of fabrication thereof, and uses thereof
App 20040184704 - Bakir, Muhannad S. ; et al. | 2004-09-23 |
Compliant wafer-level packaging devices and methods of fabrication
Grant 6,690,081 - Bakir , et al. February 10, 2 | 2004-02-10 |
Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof
App 20030206680 - Bakir, Muhannad S. ; et al. | 2003-11-06 |
Devices having compliant wafer-level packages with pillars and methods of fabrication
App 20030122229 - Bakir, Muhannad S. ; et al. | 2003-07-03 |
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