Bakir; Muhannad

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bakir; Muhannad.The latest application filed is for "methods of forming stacked integrated circuits using selective thermal atomic layer deposition on conductive contacts and structures formed using the same".

Company Profile

0.7.9

Bakir; Muhannad - Atlanta GA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods Of Forming Stacked Integrated Circuits Using Selective Thermal Atomic Layer Deposition On Conductive Contacts And Structures Formed Using The Same App 20220077104 - Breeden; Mike ; et al.	2022-03-10
Modular nano and microscale sensors Grant 8,803,509 - Ravindran , et al. August 12, 2	2014-08-12
Modular Nano And Microscale Sensors App 20110291643 - RAVINDRAN; RAMASAMY ; et al.	2011-12-01
Integrated circuit interconnects with coaxial conductors Grant 7,798,817 - Kohl , et al. September 21, 2	2010-09-21
High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use Grant 7,554,347 - Mule' , et al. June 30, 2	2009-06-30
High Performance Interconnect Devices & Structures App 20070105429 - KOHL; PAUL A. ; et al.	2007-05-10
Systems and methods for three-dimensional lithography and nano-indentation App 20050257709 - Mule, Tony ; et al.	2005-11-24
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package Grant 6,954,576 - Mule' , et al. October 11, 2	2005-10-11
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package App 20040264840 - Mule, Tony ; et al.	2004-12-30
Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication Grant 6,788,867 - Mule' , et al. September 7, 2	2004-09-07
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package Grant 6,785,458 - Mule' , et al. August 31, 2	2004-08-31
Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication App 20040126076 - Mule, Tony ; et al.	2004-07-01
High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use App 20040017215 - Mule, Tony ; et al.	2004-01-29
Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication App 20030012539 - Mule', Tony ; et al.	2003-01-16
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package App 20020136481 - Mule', Tony ; et al.	2002-09-26

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