loadpatents
Patent applications and USPTO patent grants for Baker; Jay DeAvis.The latest application filed is for "high frequency antenna".
Patent | Date |
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System and method for mounting electronic components onto flexible substrates Grant 7,156,279 - Goenke , et al. January 2, 2 | 2007-01-02 |
Integrated light and accessory assembly Grant 7,048,423 - Stepanenko , et al. May 23, 2 | 2006-05-23 |
High frequency antenna disposed on the surface of a three dimensional substrate Grant 7,015,869 - Marlow , et al. March 21, 2 | 2006-03-21 |
Instrument panel with integrated HVAC and electronic systems Grant 7,000,969 - Baker , et al. February 21, 2 | 2006-02-21 |
Method for attaching a die with a low melting metal Grant 6,826,829 - Pham , et al. December 7, 2 | 2004-12-07 |
Vehicle lamp and vehicle illumination and data transmission system incorporating same Grant 6,821,003 - Baker , et al. November 23, 2 | 2004-11-23 |
Optically controlled IPCS circuitry Grant 6,772,733 - Shi , et al. August 10, 2 | 2004-08-10 |
High frequency antenna App 20040095214 - Marlow, C. Allen ;   et al. | 2004-05-20 |
System and method for mounting electronic components onto flexible substrates App 20040094607 - Goenka, Lakhi N. ;   et al. | 2004-05-20 |
Instrument panel with integrated HVAC and electronic systems App 20040041432 - Baker, Jay DeAvis ;   et al. | 2004-03-04 |
Vehicle lamp and vehicle illumination and data transmission system incorporating same App 20040012973 - Baker, Jay DeAvis ;   et al. | 2004-01-22 |
Braking assembly and system Grant 6,655,504 - Glovatsky , et al. December 2, 2 | 2003-12-02 |
Method for attaching a die with a low melting metal App 20030167630 - Pham, Cuong Van ;   et al. | 2003-09-11 |
Method for the connection and repair of flex and other circuits Grant 6,601,292 - Li , et al. August 5, 2 | 2003-08-05 |
Void-free die attachment method with low melting metal Grant 6,601,753 - Baker , et al. August 5, 2 | 2003-08-05 |
Optically controlled IPCS circuitry App 20030089335 - Shi, Zhong-You ;   et al. | 2003-05-15 |
Multi-layer printed circuit board and method of making same Grant 6,555,015 - Dailey , et al. April 29, 2 | 2003-04-29 |
Container holder that utilizes moldline structures Grant 6,547,117 - Glovatsky , et al. April 15, 2 | 2003-04-15 |
Integrated light and accessory assembly App 20030063477 - Stepanenko, Walter Kuzma ;   et al. | 2003-04-03 |
Void-free die attachment method with low melting metal App 20020170944 - Baker, Jay DeAvis ;   et al. | 2002-11-21 |
Method for making an electronic circuit assembly Grant 6,381,837 - Baker , et al. May 7, 2 | 2002-05-07 |
Braking assembly and system App 20020043434 - Glovatsky, Andrew Zachary ;   et al. | 2002-04-18 |
Flexible mirror assembly App 20020015243 - Glovatsky, Andrew Zachary ;   et al. | 2002-02-07 |
Integrated vehicle jacks and jacking system App 20020008231 - Glovatsky, Andrew Zachary ;   et al. | 2002-01-24 |
Concealed air vents App 20020007852 - Glovatsky, Andrew Zachary ;   et al. | 2002-01-24 |
Container holder that utilizes moldline structures App 20020008127 - Glovatsky, Andrew Zachary ;   et al. | 2002-01-24 |
Method for making an electronic circuit assembly App 20020000331 - Jairazbhoy, Vivek Amir ;   et al. | 2002-01-03 |
Environmentally-sealed electronic assembly and method of making same Grant 6,320,128 - Glovatsky , et al. November 20, 2 | 2001-11-20 |
Method and article for the connection and repair of flex and other circuits App 20010035301 - Li, Delin ;   et al. | 2001-11-01 |
Interposer for mounting semiconductor dice on substrates Grant 6,303,992 - Van Pham , et al. October 16, 2 | 2001-10-16 |
Multi-connectable Printed Circuit Board App 20010001747 - LI, DELIN ;   et al. | 2001-05-24 |
Apparatus for routing electrical signals in an engine Grant 6,186,106 - Glovatsky , et al. February 13, 2 | 2001-02-13 |
Magnetic bulk feeder for electronic components Grant 6,152,281 - Bednarz , et al. November 28, 2 | 2000-11-28 |
Intake manifold for an internal combustion engine Grant 6,053,148 - Glovatsky , et al. April 25, 2 | 2000-04-25 |
Method of manufacturing a circuit assembly from two or more layers of flexible film Grant 5,979,043 - Baker , et al. November 9, 1 | 1999-11-09 |
Heat spreader mounting pad configurations for laser soldering Grant 5,920,462 - Glovatsky , et al. July 6, 1 | 1999-07-06 |
Spray nozzle for fluid deposition Grant 5,901,908 - Goenka , et al. May 11, 1 | 1999-05-11 |
Method for adhering a metallization to a substrate Grant 5,882,954 - Raghava , et al. March 16, 1 | 1999-03-16 |
Apparatus for storing and cooling electronic devices and/or modules in a vehicle Grant 5,669,813 - Jairazbhoy , et al. September 23, 1 | 1997-09-23 |
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