Bajka; Imre
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bajka; Imre.The latest application filed is for "apparatus for removing solder from the drill holes of empty printed circuit boards coated with solder".
- Bajka; Imre - Niederglatt CH
| Patent | Date |
|---|---|
| Apparatus for removing solder from the drill holes of empty printed circuit boards coated with solder Grant 4,703,714 - Bajka , et al. November 3, 1 | 1987-11-03 |
| Method for removing solder from the drill holes of empty printed circuit boards coated with solder Grant 4,501,770 - Bajka , et al. February 26, 1 | 1985-02-26 |
| Apparatus for applying solder to a printed-circuit board Grant 4,465,014 - Bajka , et al. August 14, 1 | 1984-08-14 |
| Arrangement for making contact between the conductor tracks of printed circuit boards with contact pins Grant 4,431,891 - Forstner , et al. February 14, 1 | 1984-02-14 |
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