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Patent applications and USPTO patent grants for Bailey; Fred D..The latest application filed is for "method of producing a thin film resistor in an integrated circuit".
Patent | Date |
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Integrated circuit having a thin film resistor located within a multilevel dielectric between an upper and lower metal interconnect layer Grant 6,921,962 - Bailey , et al. July 26, 2 | 2005-07-26 |
Method of integrating a thin film resistor in a multi-level metal tungsten-plug interconnect Grant 6,737,326 - Steinmann , et al. May 18, 2 | 2004-05-18 |
Method of producing a thin film resistor in an integrated circuit Grant 6,645,821 - Bailey , et al. November 11, 2 | 2003-11-11 |
Method of producing a thin film resistor in an integrated circuit App 20020102806 - Bailey, Fred D. ;   et al. | 2002-08-01 |
Method of integrating a thin film resistor in a multi-level metal tungsten-plug interconnect App 20010049199 - Steinmann, Philipp ;   et al. | 2001-12-06 |
Method of producing a laser trimmable thin film resistor in an integrated circuit Grant 6,326,256 - Bailey , et al. December 4, 2 | 2001-12-04 |
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