Baik; Seung-hyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Baik; Seung-hyun.The latest application filed is for "printed circuit boards and semiconductor packages including the same".

Company Profile

0.8.10

Baik; Seung-hyun - Seoul KR
Baik; Seung-Hyun - Suwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat radiation-thermoelectric fin, and thermoelectric module and thermoelectric apparatus including the heat radiation-thermoelectric fin Grant 10,024,585 - Choi , et al. July 17, 2	2018-07-17
Aqueous compositions, methods of producing conductive thin films using the same, conductive thin films produced thereby, and electronic devices including the same Grant 9,969,893 - Kim , et al. May 15, 2	2018-05-15
Thermoelectric material and thermoelectric device including the same Grant 9,871,180 - Choi , et al. January 16, 2	2018-01-16
Printed circuit boards and semiconductor packages including the same Grant 9,773,752 - Baik , et al. September 26, 2	2017-09-26
Printed Circuit Boards and Semiconductor Packages Including the Same App 20170117252 - BAIK; Seung-hyun ; et al.	2017-04-27
Electrical contact materials and method for preparing the same Grant 9,570,207 - Park , et al. February 14, 2	2017-02-14
Conductive carbon nanotube-metal composite ink Grant 9,418,769 - Chung , et al. August 16, 2	2016-08-16
Aqueous Compositions, Methods Of Producing Conductive Thin Films Using The Same, Conductive Thin Films Produced Thereby, And Electronic Devices Including The Same App 20160060468 - KIM; Kwang Hee ; et al.	2016-03-03
Heterogeneous laminate including graphene, and thermoelectric material, thermoelectric module, and thermoelectric apparatus including the heterogeneous laminate Grant 9,070,824 - Choi , et al. June 30, 2	2015-06-30
Electrical Contact Materials And Method For Preparing The Same App 20150155066 - PARK; Ki Hun ; et al.	2015-06-04
Graphene-containing Composite Laminate, Thermoelectric Material, And Thermoelectric Device Including The Thermoelectric Material App 20140230868 - RYU; Chong-joon ; et al.	2014-08-21
Thermoelectric Material And Thermoelectric Device Including The Same App 20140182646 - CHOI; Jae-young ; et al.	2014-07-03
Heat Radiation-thermoelectric Fin, And Thermoelectric Module And Thermoelectric Apparatus Including The Heat Radiation-thermoelectric Fin App 20140060087 - CHOI; Jae-young ; et al.	2014-03-06
Heterogeneous Laminate Including Graphene, And Thermoelectric Material, Thermoelectric Module, And Thermoelectric Apparatus Including The Heterogeneous Laminate App 20130167897 - CHOI; Jae-young ; et al.	2013-07-04
Conductive carbon nanotube-metal composite ink App 20110198542 - Chung; Jae-woo ; et al.	2011-08-18
Conductive Paste And Printed Circuit Board Using The Same App 20090114425 - LEE; Eung-Suek ; et al.	2009-05-07
Method of interconnecting layers of a printed circuit board App 20090083975 - Lee; Eung-Suek ; et al.	2009-04-02

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