Bai; Yao-Wen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bai; Yao-Wen.The latest application filed is for "electromagnetic shielding composite".

Company Profile

0.17.19

Bai; Yao-Wen - Beijing CN
Bai; Yao-Wen - Huaian N/A CN
Bai; Yao-Wen - Shenzhen CN
Bai; Yao-Wen - Bei-Jing CN
BAI; YAO-WEN - Shenzhen City CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electromagnetic shielding composite Grant 9,398,733 - Lin , et al. July 19, 2	2016-07-19
Method for making conductive wires Grant 9,247,650 - Bai , et al. January 26, 2	2016-01-26
Etching device and method for manufacturing printed circuit board using same Grant 8,685,202 - Bai April 1, 2	2014-04-01
Method for forming electrical traces on substrate Grant 8,475,867 - Bai , et al. July 2, 2	2013-07-02
Pre-plating solutions for making printed circuit boards and methods for preparing the same Grant 8,440,158 - Lin , et al. May 14, 2	2013-05-14
Apparatus for wet processing substrate Grant 8,388,800 - Bai , et al. March 5, 2	2013-03-05
Method for manufacturing printed circuit board with thick traces Grant 8,377,317 - Bai , et al. February 19, 2	2013-02-19
Electromagnetic Shielding Composite App 20120237721 - LIN; CHENG-HSIEN ; et al.	2012-09-20
Electromagnetic shielding composite and method for making the same Grant 8,211,267 - Lin , et al. July 3, 2	2012-07-03
Etching Device And Method For Manufacturing Printed Circuit Board Using Same App 20120031873 - BAI; YAO-WEN	2012-02-09
Printed circuit board and method for manufacturing same Grant 8,071,887 - Liou , et al. December 6, 2	2011-12-06
Method For Manufacturing Printed Circuit Board With Thick Traces App 20110215069 - BAI; YAO-WEN ; et al.	2011-09-08
Electroplating method Grant 7,998,332 - Liou , et al. August 16, 2	2011-08-16
Printed Circuit Board With Carbon Nanotube Bundle App 20110186339 - BAI; YAO-WEN ; et al.	2011-08-04
Apparatus For Wet Processing Substrate App 20110024042 - Bai; Yao-Wen ; et al.	2011-02-03
Carbon nanotube metal nanoparticle composite and method for making the same App 20100255290 - Bai; Yao-Wen ; et al.	2010-10-07
Inkjet ink and method for making conductive wires using the same App 20100173095 - Bai; Yao-Wen ; et al.	2010-07-08
Method for making conductive wires App 20100151120 - Bai; Yao-Wen ; et al.	2010-06-17
Method For Forming Electrical Traces On Substrate App 20100129532 - BAI; YAO-WEN ; et al.	2010-05-27
Method Of Forming Electrical Traces App 20100021652 - LIN; CHENG-HSIEN ; et al.	2010-01-28
Method Of Forming Electrical Traces On Substrate App 20100021653 - LIN; CHENG-HSIEN ; et al.	2010-01-28
Ink, Method Of Forming Electrical Traces Using The Same And Circuit Board App 20090301763 - LIN; CHENG-HSIEN ; et al.	2009-12-10
Method Of Forming Circuits On Circuit Board App 20090304911 - LIN; CHENG-HSIEN ; et al.	2009-12-10
Ink And Method Of Forming Electrical Traces Using The Same App 20090291230 - LIN; CHENG-HSIEN ; et al.	2009-11-26
Ink And Method Of Forming Electrical Traces Using The Same App 20090286006 - LIN; CHENG-HSIEN ; et al.	2009-11-19
Printed Circuit Board And Method For Manufacturing Same App 20090242246 - LIOU; SHING-TZA ; et al.	2009-10-01
Electroplating Method App 20090159452 - LIOU; SHING-TZA ; et al.	2009-06-25
Electromagnetic shielding composite and method for making the same App 20090092813 - Lin; Cheng-Hsien ; et al.	2009-04-09
Pre-plating Solutions For Making Printed Circuit Boards And Methods For Preparing The Same App 20090078578 - Lin; Cheng-Hsien ; et al.	2009-03-26

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