Bai; Yadong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bai; Yadong.The latest application filed is for "chip power supply system, chip, pcb, and computer device".
- Bai; Yadong - Dongguan CN
- Bai; Yadong - Shenzhen CN
| Patent | Date |
|---|---|
| Chip power supply system, chip, PCB, and computer device Grant 11,387,226 - Bai , et al. July 12, 2 | 2022-07-12 |
| Chip Power Supply System, Chip, Pcb, And Computer Device App 20210143141 - Bai; Yadong ; et al. | 2021-05-13 |
| Electronic component package structure and electronic device Grant 10,091,915 - Yu , et al. October 2, 2 | 2018-10-02 |
| Electronic Component Package Structure and Electronic Device App 20180049351 - Yu; Xuequan ; et al. | 2018-02-15 |
| Electronic component package structure and electronic device Grant 9,839,167 - Yu , et al. December 5, 2 | 2017-12-05 |
| Chip package and packaging method Grant 9,484,311 - Yu , et al. November 1, 2 | 2016-11-01 |
| Electronic Component Package Structure and Electronic Device App 20150305210 - Yu; Xuequan ; et al. | 2015-10-22 |
| Magnetic integration double-ended converter Grant 9,160,244 - Lu , et al. October 13, 2 | 2015-10-13 |
| Chip Package And Packaging Method App 20150102473 - Yu; Xuequan ; et al. | 2015-04-16 |
| Magnetic Integration Double-Ended Converter App 20140362607 - Lu; Zengyi ; et al. | 2014-12-11 |
| Magnetic integration double-ended converter Grant 8,848,397 - Lu , et al. September 30, 2 | 2014-09-30 |
| Magnetic Integration Double-ended Converter App 20120201053 - LU; Zengyi ; et al. | 2012-08-09 |
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