Bai; Shi Jie
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bai; Shi Jie.The latest application filed is for "circuit layout structure".
- Bai; Shi Jie - Singapore SG
- Bai; Shi Jie - Singpore SG
| Patent | Date |
|---|---|
| Circuit layout structure Grant 8,278,761 - Tsai , et al. October 2, 2 | 2012-10-02 |
| Method for forming an opening Grant 8,110,342 - Liu , et al. February 7, 2 | 2012-02-07 |
| Circuit Layout Structure App 20110108991 - Tsai; Ching Long ; et al. | 2011-05-12 |
| Method Of Etching A Multi-layer App 20100326954 - Zhuo; Zhen Yu ; et al. | 2010-12-30 |
| Rework Method Of Metal Hard Mask App 20100190272 - Zhang; Yu ; et al. | 2010-07-29 |
| Via-first interconnection process using gap-fill during trench formation Grant 7,704,870 - Ma , et al. April 27, 2 | 2010-04-27 |
| Method For Forming An Opening App 20100040982 - Liu; Feng ; et al. | 2010-02-18 |
| Two-step method for etching a fuse window on a semiconductor substrate Grant 7,622,395 - Bai , et al. November 24, 2 | 2009-11-24 |
| Interconnection Process App 20090023287 - MA; Hong ; et al. | 2009-01-22 |
| Interconnection Process App 20090023283 - Ma; Hong ; et al. | 2009-01-22 |
| Two-step Method For Etching A Fuse Window On A Semiconductor Substrate App 20080160652 - Bai; Shi-Jie ; et al. | 2008-07-03 |
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