Bai; Lei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bai; Lei.The latest application filed is for "touchpad assembly and electronic device".

Company Profile

3.7.13

Bai; Lei - Wuhan CN
BAI; Lei - Beijing CN
BAI; Lei - Shenzhen Guangdong

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Touchpad Assembly and Electronic Device App 20220291763 - Zhang; Yingchun ; et al.	2022-09-15
Device with opening and closing performance Grant 11,409,334 - Kato , et al. August 9, 2	2022-08-09
Method For Characterizing Property Characteristic Of Transmission Source Of Segmented Gamma Scanning Measurement System App 20220011245 - WANG; Zhongqi ; et al.	2022-01-13
Keyboard and electronic device Grant 11,211,212 - Huang , et al. December 28, 2	2021-12-28
Device with Opening and Closing Performance App 20210247818 - Kato; Hideo ; et al.	2021-08-12
Keyboard And Electronic Device App 20210249204 - HUANG; Weiyong ; et al.	2021-08-12
Opening And Closing Mechanism And Electronic Device App 20210018960 - KATO; Hideo ; et al.	2021-01-21
Fabrication method and fabrication assembly for flexible display substrate Grant 10,797,253 - Bi , et al. October 6, 2	2020-10-06
Fabrication Method And Fabrication Assembly For Flexible Display Substrate App 20200106030 - BI; Jianqiang ; et al.	2020-04-02
Fan Grant 10,161,420 - Bai , et al. Dec	2018-12-25
Grinding Table Apparatus, Liquid Crystal Display Glass Grinder And Grinding Method App 20170113318 - SHAN; Yajie ; et al.	2017-04-27
PCB plug mechanism, finished board, and subrack Grant 9,370,118 - Li , et al. June 14, 2	2016-06-14
Fan App 20160131160 - Bai; Lei ; et al.	2016-05-12
Cable Assembly Calibration Apparatus App 20160005515 - Wei; Na ; et al.	2016-01-07
Heat dissipation system Grant 9,215,831 - Hao , et al. December 15, 2	2015-12-15
PCB Board Plug Mechanism, Finished Board, and Subrack App 20150070866 - Li; Shuang ; et al.	2015-03-12
Electronic device, electronic system, and circuit board interconnection architecture of the same Grant 8,842,441 - Bai , et al. September 23, 2	2014-09-23
Electronic Device, Electronic System, And Circuit Board Interconnection Architecture Of The Same App 20140220795 - Bai; Lei ; et al.	2014-08-07
Heat Dissipation System App 20140138069 - Hao; Mingliang ; et al.	2014-05-22
Backplane, Cabinet-Level Communication Device, and Method for Replacing Backplane App 20140126170 - Bai; Lei ; et al.	2014-05-08

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.