Bai; Jingyi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bai; Jingyi.The latest application filed is for "back side illuminated cmos image sensor arrays".

Company Profile

0.24.17

Bai; Jingyi - San Jose CA
Bai; Jingyi - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Back side illuminated CMOS image sensor arrays Grant 10,741,602 - Komori , et al. A	2020-08-11
Back Side Illuminated Cmos Image Sensor Arrays App 20180097025 - Komori; Hirofumi ; et al.	2018-04-05
Back side illuminated CMOS image sensor arrays Grant 9,876,045 - Komori , et al. January 23, 2	2018-01-23
Back Side Illuminated Cmos Image Sensor Arrays App 20160329367 - KOMORI; HIROFUMI ; et al.	2016-11-10
Global shutter pixel with improved efficiency Grant 8,878,264 - Velichko , et al. November 4, 2	2014-11-04
Method to reduce charge buildup during high aspect ratio contact etch Grant 8,673,787 - Sandhu , et al. March 18, 2	2014-03-18
Integrated circuit having pitch reduced patterns relative to photoithography features Grant 8,598,632 - Tran , et al. December 3, 2	2013-12-03
Global Shutter Pixel With Improved Efficiency App 20120273854 - Velichko; Sergey ; et al.	2012-11-01
Pitch reduced patterns relative to photolithography features Grant 8,207,576 - Tran , et al. June 26, 2	2012-06-26
Prevention of photoresist scumming Grant 8,129,093 - Yin , et al. March 6, 2	2012-03-06
Multiple deposition for integration of spacers in pitch multiplication process Grant 8,123,968 - Bai , et al. February 28, 2	2012-02-28
Pitch reduced patterns relative to photolithography features Grant 8,119,535 - Tran , et al. February 21, 2	2012-02-21
Pitch reduced patterns relative to photolithography features Grant 8,048,812 - Tran , et al. November 1, 2	2011-11-01
Method to Reduce Charge Buildup During High Aspect Ratio Contact Etch App 20110250759 - Sandhu; Gurtej S. ; et al.	2011-10-13
Method to reduce charge buildup during high aspect ratio contact etch Grant 7,985,692 - Sandhu , et al. July 26, 2	2011-07-26
Multiple Deposition For Integration Of Spacers In Pitch Multiplication Process App 20110117743 - Bai; Jingyi ; et al.	2011-05-19
Multiple deposition for integration of spacers in pitch multiplication process Grant 7,884,022 - Bai , et al. February 8, 2	2011-02-08
Prevention Of Photoresist Scumming App 20100196807 - Yin; Zhiping ; et al.	2010-08-05
Pitch reduced patterns relative to photolithography features Grant 7,718,540 - Tran , et al. May 18, 2	2010-05-18
Prevention of photoresist scumming Grant 7,704,673 - Yin , et al. April 27, 2	2010-04-27
Pitch Reduced Patterns Relative To Photolithography Features App 20100092891 - Tran; Luan ; et al.	2010-04-15
Pitch reduced patterns relative to photolithography features Grant 7,651,951 - Tran , et al. January 26, 2	2010-01-26
Multiple Deposition For Integration Of Spacers In Pitch Multiplication Process App 20080149593 - Bai; Jingyi ; et al.	2008-06-26
Multiple deposition for integration of spacers in pitch multiplication process Grant 7,390,746 - Bai , et al. June 24, 2	2008-06-24
Method To Reduce Charge Buildup During High Aspect Ratio Contact Etch App 20080128389 - Sandhu; Gurtej S. ; et al.	2008-06-05
Method to reduce charge buildup during high aspect ratio contact etch Grant 7,344,975 - Sandhu , et al. March 18, 2	2008-03-18
Prevention Of Photoresist Scumming App 20080008942 - Yin; Zhiping ; et al.	2008-01-10
Prevention of photoresist scumming Grant 7,270,917 - Yin , et al. September 18, 2	2007-09-18
Methods for filling high aspect ratio trenches in semiconductor layers Grant 7,259,079 - Bai , et al. August 21, 2	2007-08-21
Multiple Deposition For Integration Of Spacers In Pitch Multiplication Process App 20070117310 - Bai; Jingyi ; et al.	2007-05-24
Method to reduce charge buildup during high aspect ratio contact etch App 20070049018 - Sandhu; Gurtej S. ; et al.	2007-03-01
Multiple deposition for integration of spacers in pitch multiplication process App 20070049040 - Bai; Jingyi ; et al.	2007-03-01
Prevention of photoresist scumming Grant 7,175,944 - Yin , et al. February 13, 2	2007-02-13
Prevention of photoresist scumming App 20060240340 - Yin; Zhiping ; et al.	2006-10-26
Prevention of photoresist scumming App 20060046161 - Yin; Zhiping ; et al.	2006-03-02
Methods for filling high aspect ratio trenches in semiconductor layers Grant 6,982,207 - Bai , et al. January 3, 2	2006-01-03
Methods for filling high aspect ratio trenches in semiconductor layers App 20050158965 - Bai, Jingyi ; et al.	2005-07-21
Methods for filling high aspect ratio trenches in semiconductor layers App 20050009291 - Bai, Jingyi ; et al.	2005-01-13

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