Bai; Jin-Chuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bai; Jin-Chuan.The latest application filed is for "semiconductor device and method for fabricating the same".

Company Profile

0.9.18

Bai; Jin-Chuan - Hsinchu TW
Bai; Jin-Chuan - Taipei TW
Bai, Jin-Chuan - Hsin-Chu TW
Bai; Jin-Chuan - Sanzhong City Taipei Hsien TW
Bai, Jin-Chuan - Taipei Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fabrication method of circuit board Grant 6,968,613 - Tsai , et al. November 29, 2	2005-11-29
Semiconductor device and method for fabricating the same Grant 6,964,888 - Bai November 15, 2	2005-11-15
Test fixture for semiconductor package and test method of using the same Grant 6,859,056 - Bai , et al. February 22, 2	2005-02-22
Semiconductor device and method for fabricating the same App 20040266067 - Bai, Jin-Chuan	2004-12-30
Window-type ball grid array semiconductor package Grant 6,822,337 - Bai November 23, 2	2004-11-23
Semiconductor device and method for fabricating the same Grant 6,790,712 - Bai September 14, 2	2004-09-14
Fabrication method for circuit board Grant 6,740,540 - Tsai , et al. May 25, 2	2004-05-25
Window-type ball grid array semiconductor package App 20040061222 - Bai, Jin-Chuan	2004-04-01
Window-type Ball Grid Array Semiconductor Package App 20040061239 - Bai, Jin-Chuan	2004-04-01
Window-type Semiconductor Package And Fabrication Method Thereof App 20040061243 - Bai, Jin-Chuan	2004-04-01
Window-type semiconductor package and fabrication method thereof Grant 6,710,434 - Bai March 23, 2	2004-03-23
Circuit board for flip-chip semiconductor package and fabrication method thereof App 20040003940 - Bai, Jin-Chuan ; et al.	2004-01-08
Semiconductor package with heat sink App 20040004281 - Bai, Jin-Chuan ; et al.	2004-01-08
Semiconductor package with reinforced substrate and fabrication method of the substrate App 20040004277 - Tsai, Chung-Che ; et al.	2004-01-08
Fabrication method of circuit board App 20030182797 - Tsai, Chung-Che ; et al.	2003-10-02
Circuit board free of photo-sensitive material and fabrication method of the same App 20030184979 - Tsai, Chung-Che ; et al.	2003-10-02
Fabrication method for circuit board App 20030173331 - Tsai, Chung-Che ; et al.	2003-09-18
Test fixture for semiconductor package and test method of using the same App 20030151420 - Bai, Jin-Chuan ; et al.	2003-08-14
Chip photoelectric sensor assembly and method for making same Grant 6,531,333 - Lin , et al. March 11, 2	2003-03-11
Semiconductor device without use of chip carrier and method for making the same App 20030020183 - Bai, Jin Chuan	2003-01-30
Semiconductor device and method for fabricating the same App 20020192860 - Bai, Jin-Chuan	2002-12-19
Packaging process for semiconductor package App 20020187591 - Bai, Jin Chuan	2002-12-12
Chip photoelectric sensor assembly and method for making same App 20020153581 - Lin, Hong-Ming ; et al.	2002-10-24
Semiconductor device and method for fabricating the same Grant 6,459,163 - Bai October 1, 2	2002-10-01
Semiconductor Device And Method For Fabricating Same App 20020135080 - Bai, Jin-Chuan	2002-09-26
Semiconductor device without use of chip carrier and method for making the same App 20020041039 - Bai, Jin Chuan	2002-04-11
Chip photoelectric sensor assembly and method for making same App 20010029059 - Lin, Hong-Ming ; et al.	2001-10-11

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