| Patent | Date |
|---|
Semiconductor device including one or more stiffening elements
Grant 8,716,849 - Cobbley , et al. May 6, 2 | 2014-05-06 |
Electronic devices
Grant 8,508,034 - Bolken , et al. August 13, 2 | 2013-08-13 |
Molded Stiffener for Thin Substrates
App 20120187552 - Cobbley; Chad A. ; et al. | 2012-07-26 |
Electronic Devices
App 20120126386 - Bolken; Todd O. ; et al. | 2012-05-24 |
Molded stiffener for thin substrates
Grant 8,148,803 - Cobbley , et al. April 3, 2 | 2012-04-03 |
Electronic device package
Grant 8,115,296 - Bolken , et al. February 14, 2 | 2012-02-14 |
Underfilled semiconductor die assemblies and methods of forming the same
Grant 8,093,730 - Hall , et al. January 10, 2 | 2012-01-10 |
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
Grant 7,851,907 - Hall , et al. December 14, 2 | 2010-12-14 |
Electronic Device Package
App 20100264532 - Bolken; Todd O. ; et al. | 2010-10-21 |
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
Grant 7,468,559 - Hall , et al. December 23, 2 | 2008-12-23 |
Stackable ball grid array
Grant 7,459,773 - Bolken , et al. December 2, 2 | 2008-12-02 |
Molded stiffener for thin substrates
Grant 7,423,331 - Cobbley , et al. September 9, 2 | 2008-09-09 |
Semiconductor Integrated Circuit Package Having Electrically Disconnected Solder Balls For Mounting
App 20080142950 - Hall; Frank L. ; et al. | 2008-06-19 |
Integrated circuit device having reduced bow and method for making same
Grant 7,344,921 - Tandy , et al. March 18, 2 | 2008-03-18 |
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
Grant 7,342,319 - Hall , et al. March 11, 2 | 2008-03-11 |
Molded stiffener for thin substrates
Grant 7,288,431 - Cobbley , et al. October 30, 2 | 2007-10-30 |
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
Grant 7,276,802 - Hall , et al. October 2, 2 | 2007-10-02 |
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
Grant 7,268,067 - Hall , et al. September 11, 2 | 2007-09-11 |
Methods of fabricating underfilled, encapsulated semiconductor die assemblies
Grant 7,262,074 - Hall , et al. August 28, 2 | 2007-08-28 |
Packages for semiconductor die
Grant 7,239,029 - Bolken , et al. July 3, 2 | 2007-07-03 |
Underfilled semiconductor die assemblies and methods of forming the same
App 20070040264 - Hall; Frank L. ; et al. | 2007-02-22 |
Molded stiffener for thin substrates
App 20060290011 - Cobbley; Chad A. ; et al. | 2006-12-28 |
Packages for semiconductor die
Grant 7,144,245 - Bolken , et al. December 5, 2 | 2006-12-05 |
Semiconductor Integrated Circuit Package Having Electrically Disconnected Solder Balls For Mounting
App 20060237844 - Hall; Frank L. ; et al. | 2006-10-26 |
Semiconductor Integrated Circuit Package Having Electrically Disconnected Solder Balls For Mounting
App 20060237845 - Hall; Frank L. ; et al. | 2006-10-26 |
Underfilled, encapsulated semiconductor die assemblies and methods of fabrication
Grant 7,116,000 - Hall , et al. October 3, 2 | 2006-10-03 |
Method of manufacturing a stackable ball grid array
Grant 7,101,730 - Bolken , et al. September 5, 2 | 2006-09-05 |
Integrated circuit device having reduced bow and method for making same
Grant 7,095,097 - Tandy , et al. August 22, 2 | 2006-08-22 |
Circuit and substrate encapsulation methods
Grant 7,091,060 - Bolken , et al. August 15, 2 | 2006-08-15 |
Molding tool and a method of forming an electronic device package
App 20060169490 - Bolken; Todd O. ; et al. | 2006-08-03 |
Integrated circuit device having reduced bow and method for making same
App 20060141673 - Tandy; William D. ; et al. | 2006-06-29 |
Moisture-resistant electronic device package and methods of assembly
Grant 7,026,548 - Bolken , et al. April 11, 2 | 2006-04-11 |
Molded stiffener for thin substrates
App 20060068527 - Cobbley; Chad A. ; et al. | 2006-03-30 |
Stackable ball grid array
Grant 7,019,408 - Bolken , et al. March 28, 2 | 2006-03-28 |
Stackable ball grid array
App 20060055020 - Bolken; Todd O. ; et al. | 2006-03-16 |
Moisture-resistant Electronic Device Package And Methods Of Assembly
App 20050263312 - Bolken, Todd O. ; et al. | 2005-12-01 |
Moisture-resistant electronic device package and methods of assembly
Grant 6,953,891 - Bolken , et al. October 11, 2 | 2005-10-11 |
Method for making an integrated circuit package having reduced bow
Grant 6,887,740 - Tandy , et al. May 3, 2 | 2005-05-03 |
Moisture-resistant electronic device package and methods of assembly
App 20050057883 - Bolken, Todd O. ; et al. | 2005-03-17 |
Molded stiffener for thin substrates
App 20050029549 - Cobbley, Chad A. ; et al. | 2005-02-10 |
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
App 20050026327 - Hall, Frank L. ; et al. | 2005-02-03 |
Integrated circuit device having reduced bow and method for making same
App 20050023653 - Tandy, William D. ; et al. | 2005-02-03 |
Method of manufacturing a stackable ball grid array
App 20050019983 - Bolken, Todd O. ; et al. | 2005-01-27 |
Underfilled, encapsulated semiconductor die assemblies and methods of fabrication
App 20040164413 - Hall, Frank L. ; et al. | 2004-08-26 |
Stackable ball grid array
App 20040164412 - Bolken, Todd O. ; et al. | 2004-08-26 |
Stackable ball grid array
Grant 6,778,404 - Bolken , et al. August 17, 2 | 2004-08-17 |
Packages for semiconductor die
App 20040119173 - Bolken, Todd O. ; et al. | 2004-06-24 |
Underfilled, encapsulated semiconductor die assemblies and methods of fabrication
App 20040004294 - Hall, Frank L. ; et al. | 2004-01-08 |
Apparatus for reduced flash encapsulation of microelectronic devices
Grant 6,644,949 - Rumsey , et al. November 11, 2 | 2003-11-11 |
Packages for semiconductor die
App 20030201526 - Bolken, Todd O. ; et al. | 2003-10-30 |
Integrated circuit device having reduced bow and method for making same
App 20030201547 - Tandy, William D. ; et al. | 2003-10-30 |
Method and apparatus for reduced flash encapsulation of microelectronic devices
Grant 6,638,595 - Rumsey , et al. October 28, 2 | 2003-10-28 |
Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
App 20030193088 - Hall, Frank L. ; et al. | 2003-10-16 |
Molded stiffener for thin substrates
App 20030155636 - Cobbley, Chad A. ; et al. | 2003-08-21 |
Packages for semiconductor die
App 20030098514 - Bolken, Todd O. ; et al. | 2003-05-29 |
Packages for semiconductor die
Grant 6,518,654 - Bolken , et al. February 11, 2 | 2003-02-11 |
Method and apparatus for reduced flash encapsulation of microelectronic devices
App 20020000675 - Rumsey, Brad D. ; et al. | 2002-01-03 |
Method and apparatus for reduced flash encapsulation of microelectronic devices
App 20020001883 - Rumsey, Brad D. ; et al. | 2002-01-03 |
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