Baello; James Raymond
Patent Applications and Registrations
Patent applications and USPTO patent grants for Baello; James Raymond.The latest application filed is for "making a flip-chip assembly with bond fingers".
- Baello; James Raymond - Baguio PH
- Baello; James Raymond - Baguio City PH
- Baello; James Raymond - Quezon City PH
| Patent | Date |
|---|---|
| Making a flip-chip assembly with bond fingers Grant 9,219,052 - Partosa , et al. December 22, 2 | 2015-12-22 |
| Making A Flip-chip Assembly With Bond Fingers App 20140248746 - Partosa; Raymond Maldan ; et al. | 2014-09-04 |
| Substrate With Bond Fingers App 20140197534 - Partosa; Raymond Maldan ; et al. | 2014-07-17 |
| Substrate with bond fingers Grant 8,766,461 - Partosa , et al. July 1, 2 | 2014-07-01 |
| Bonding a solder bump to a lead using compression and retraction forces Grant 8,381,967 - Masumoto , et al. February 26, 2 | 2013-02-26 |
| Die detection and reference die wafermap alignment App 20080188016 - Pare; Melanie Aquitania ; et al. | 2008-08-07 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 