Baek; Yong Ho
Patent Applications and Registrations
Patent applications and USPTO patent grants for Baek; Yong Ho.The latest application filed is for "antenna module".
Company Profile
62.69.92
- Baek; Yong Ho - Suwon-si KR
- Baek; Yong-Ho - Seoul KR
- - Suwon-si KR
- Baek; Yong Ho - Gyeongsangnam-do N/A KR
- Baek; Yong-Ho - Gyeonggi-do KR
- Baek; Yong-Ho - Kyonggi-do KR
Patent Activity
| Patent | Date |
|---|---|
| Printed circuit board Grant 11,439,022 - Cho , et al. September 6, 2 | 2022-09-06 |
| Antenna module and manufacturing method thereof Grant 11,394,103 - Kim , et al. July 19, 2 | 2022-07-19 |
| Antenna Module App 20220059926 - SO; Won Wook ; et al. | 2022-02-24 |
| Antenna module Grant 11,217,543 - Kim , et al. January 4, 2 | 2022-01-04 |
| Antenna module Grant 11,177,551 - So , et al. November 16, 2 | 2021-11-16 |
| Printed Circuit Board And Manufacturing Method Thereof App 20210345491 - PARK; Jung Hyun ; et al. | 2021-11-04 |
| Semiconductor Package App 20210327832 - CHA; Yoo Rim ; et al. | 2021-10-21 |
| Antenna module Grant 11,095,037 - Kim , et al. August 17, 2 | 2021-08-17 |
| Printed circuit board and manufacturing method thereof Grant 11,096,286 - Park , et al. August 17, 2 | 2021-08-17 |
| Semiconductor package Grant 11,075,175 - Cha , et al. July 27, 2 | 2021-07-27 |
| Antenna Module App 20210226328 - Kim; Doo li ; et al. | 2021-07-22 |
| Fan-out sensor package and optical fingerprint sensor module including the same Grant 11,037,971 - Baek , et al. June 15, 2 | 2021-06-15 |
| Antenna module Grant 11,038,279 - Kim , et al. June 15, 2 | 2021-06-15 |
| Antenna module Grant 11,031,675 - Kim , et al. June 8, 2 | 2021-06-08 |
| Board with embedded passive component Grant 10,998,247 - Cho , et al. May 4, 2 | 2021-05-04 |
| Antenna module Grant 10,985,451 - Kim , et al. April 20, 2 | 2021-04-20 |
| Antenna Substrate And Antenna Module Including The Same App 20210076501 - Kim; Doo Il ; et al. | 2021-03-11 |
| Printed Circuit Board App 20210068261 - Cho; Young Il ; et al. | 2021-03-04 |
| Fan-out sensor package and camera module Grant 10,923,521 - Kim , et al. February 16, 2 | 2021-02-16 |
| Antenna substrate and antenna module including the same Grant 10,887,994 - Kim , et al. January 5, 2 | 2021-01-05 |
| Antenna Module App 20200365536 - KIM; Doo II ; et al. | 2020-11-19 |
| Antenna Module App 20200357757 - KIM; Doo Il ; et al. | 2020-11-12 |
| Fan-out semiconductor package Grant 10,832,986 - Cho , et al. November 10, 2 | 2020-11-10 |
| Semiconductor package Grant 10,833,040 - Baek , et al. November 10, 2 | 2020-11-10 |
| Fan-out semiconductor package module Grant 10,833,070 - Gong , et al. November 10, 2 | 2020-11-10 |
| Semiconductor package Grant 10,811,379 - Kim , et al. October 20, 2 | 2020-10-20 |
| Antenna module and manufacturing method thereof Grant 10,790,595 - Kim , et al. September 29, 2 | 2020-09-29 |
| Antenna module Grant 10,763,225 - Kim , et al. Sep | 2020-09-01 |
| Antenna module Grant 10,741,509 - Kim , et al. A | 2020-08-11 |
| Fan-out Sensor Package And Optical Fingerprint Sensor Module Including The Same App 20200235154 - BAEK; Yong Ho ; et al. | 2020-07-23 |
| Printed Circuit Board And Manufacturing Method Thereof App 20200214135 - PARK; Jung Hyun ; et al. | 2020-07-02 |
| Fan-out semiconductor package Grant 10,700,024 - So , et al. | 2020-06-30 |
| Printed circuit board including sub-circuit board Grant 10,701,806 - Baek , et al. | 2020-06-30 |
| Semiconductor package and method of manufacturing the same Grant 10,699,982 - Baek | 2020-06-30 |
| Printed circuit board and manufacturing method thereof Grant 10,674,608 - Park , et al. | 2020-06-02 |
| Antenna Module App 20200144697 - KIM; Doo Il ; et al. | 2020-05-07 |
| Fan-out sensor package and optical fingerprint sensor module including the same Grant 10,644,046 - Baek , et al. | 2020-05-05 |
| Electronic component package and manufacturing method of the same Grant 10,636,743 - Baek , et al. | 2020-04-28 |
| Printed circuit board and manufacturing method thereof Grant 10631411 - | 2020-04-21 |
| Antenna module Grant 10,608,319 - Kim , et al. | 2020-03-31 |
| Board With Embedded Passive Component App 20200058569 - CHO; Jung Hyun ; et al. | 2020-02-20 |
| Semiconductor Package App 20200051933 - CHA; Yoo Rim ; et al. | 2020-02-13 |
| Fan-out Sensor Package And Camera Module App 20200043970 - KIM; Byoung Chan ; et al. | 2020-02-06 |
| Antenna Module Grant 10,547,119 - Kim , et al. Ja | 2020-01-28 |
| Printed Circuit Board Including Sub-circuit Board App 20200029435 - BAEK; Yong-Ho ; et al. | 2020-01-23 |
| Antenna Module App 20200028239 - So; Won Wook ; et al. | 2020-01-23 |
| Semiconductor Package App 20200013743 - KIM; Doo Il ; et al. | 2020-01-09 |
| Antenna Substrate And Antenna Module Including The Same App 20200015357 - Kim; Doo Il ; et al. | 2020-01-09 |
| Fan-out semiconductor package Grant 10,511,080 - So , et al. Dec | 2019-12-17 |
| Fan-out sensor package and camera module Grant 10,475,842 - Kim , et al. Nov | 2019-11-12 |
| Printed circuit board including sub-circuit board Grant 10,477,683 - Baek , et al. Nov | 2019-11-12 |
| Composite antenna substrate and semiconductor package module Grant 10,475,756 - Baek , et al. Nov | 2019-11-12 |
| Fan-out semiconductor package Grant 10,474,868 - Baek , et al. Nov | 2019-11-12 |
| Fan-out Component Package App 20190287938 - KIM; Jong Rok ; et al. | 2019-09-19 |
| Antenna Module App 20190279950 - KIM; Doo Il ; et al. | 2019-09-12 |
| Antenna Module App 20190280374 - KIM; Doo Il ; et al. | 2019-09-12 |
| Fan-out Semiconductor Package Module App 20190273079 - GONG; Jung Chul ; et al. | 2019-09-05 |
| Fan-out semiconductor package module Grant 10,403,562 - Baek , et al. Sep | 2019-09-03 |
| Fan-out fingerprint sensor package Grant 10,395,088 - Kim , et al. A | 2019-08-27 |
| Electronic Component Package And Manufacturing Method Of The Same App 20190229060 - BAEK; Yong Ho ; et al. | 2019-07-25 |
| Fan-out Sensor Package App 20190229055 - SO; Won Wook ; et al. | 2019-07-25 |
| Antenna Module App 20190221917 - KIM; Doo Il ; et al. | 2019-07-18 |
| Composite antenna substrate and semiconductor package module Grant 10,347,598 - Baek , et al. July 9, 2 | 2019-07-09 |
| Fan-out semiconductor package Grant 10,347,613 - Kim , et al. July 9, 2 | 2019-07-09 |
| Fan-out Semiconductor Package App 20190198486 - KIM; Byoung Chan ; et al. | 2019-06-27 |
| Semiconductor Package And Method Of Manufacturing The Same App 20190198410 - BAEK; Yong-Ho | 2019-06-27 |
| Fan-out semiconductor package Grant 10,332,843 - Baek , et al. | 2019-06-25 |
| Semiconductor Package App 20190189583 - BAEK; Yong Ho ; et al. | 2019-06-20 |
| Electronic component package and method of manufacturing the same Grant 10,325,856 - Baek , et al. | 2019-06-18 |
| Fan-out Sensor Package App 20190181172 - KIM; Jong Rok ; et al. | 2019-06-13 |
| Antenna Module App 20190173195 - KIM; Doo Il ; et al. | 2019-06-06 |
| Antenna Module And Manufacturing Method Thereof App 20190173184 - KIM; Doo Il ; et al. | 2019-06-06 |
| Fan-out Semiconductor Package App 20190164863 - CHO; Jung Hyun ; et al. | 2019-05-30 |
| Printed circuit board with dam around cavity and manufacturing method thereof Grant 10,306,778 - Lee , et al. | 2019-05-28 |
| Electronic component package and method of manufacturing the same Grant 10,297,553 - Baek , et al. | 2019-05-21 |
| Antenna Module App 20190139912 - KIM; Doo Il ; et al. | 2019-05-09 |
| Fan-out Sensor Package And Camera Module App 20190140011 - KIM; Byoung Chan ; et al. | 2019-05-09 |
| Fan-out semiconductor package including electromagnetic interference shielding layer Grant 10,283,439 - Cho , et al. | 2019-05-07 |
| Fan-out Semiconductor Package Module App 20190131212 - BAEK; Yong Ho ; et al. | 2019-05-02 |
| Composite Antenna Substrate And Semiconductor Package Module App 20190115310 - BAEK; Yong Ho ; et al. | 2019-04-18 |
| Fan-out semiconductor package Grant 10,256,192 - Yi , et al. | 2019-04-09 |
| Fan-out-semiconductor package module Grant 10,242,973 - Baek , et al. | 2019-03-26 |
| Fan-out Semiconductor Package App 20190057944 - SO; Won Wook ; et al. | 2019-02-21 |
| Fan-out Semiconductor Package App 20190058241 - SO; Won Wook ; et al. | 2019-02-21 |
| Antenna Module App 20190051989 - KIM; DOO IL ; et al. | 2019-02-14 |
| Antenna Module And Manufacturing Method Thereof App 20190027804 - KIM; Doo Il ; et al. | 2019-01-24 |
| Fan-out Semiconductor Package Module App 20190013300 - BAEK; Yong Ho ; et al. | 2019-01-10 |
| Fan-out Semiconductor Package App 20190013282 - YI; Moon Hee ; et al. | 2019-01-10 |
| Fan-out semiconductor package Grant 10,177,103 - Yi , et al. J | 2019-01-08 |
| Image sensor device and image sensor module comprising the same Grant 10,153,235 - Jung , et al. Dec | 2018-12-11 |
| Composite Antenna Substrate And Semiconductor Package Module App 20180337148 - BAEK; Yong Ho ; et al. | 2018-11-22 |
| Embedded board and method of manufacturing the same Grant 10,129,982 - Choi , et al. November 13, 2 | 2018-11-13 |
| Printed Circuit Board And Manufacturing Method Thereof App 20180324952 - PARK; Jung Hyun ; et al. | 2018-11-08 |
| Fan-out Fingerprint Sensor Package App 20180307890 - KIM; Min Keun ; et al. | 2018-10-25 |
| Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package Grant 10,109,541 - Baek , et al. October 23, 2 | 2018-10-23 |
| Fan-out Sensor Package And Optical Fingerprint Sensor Module Including The Same App 20180294299 - BAEK; Yong Ho ; et al. | 2018-10-11 |
| Fan-out semiconductor package Grant 10,096,560 - Kim , et al. October 9, 2 | 2018-10-09 |
| Fan-out semiconductor package Grant 10,096,559 - Kim , et al. October 9, 2 | 2018-10-09 |
| Fan-out Semiconductor Package App 20180286790 - CHO; Jung Hyun ; et al. | 2018-10-04 |
| Board For Electronic Component Package, Electronic Component Package, And Method Of Manufacturing Board For Electronic Component Package App 20180286770 - BAEK; Yong Ho ; et al. | 2018-10-04 |
| Electronic Component Package And Method Of Manufacturing The Same App 20180269156 - BAEK; Yong Ho ; et al. | 2018-09-20 |
| Printed circuit board and manufacturing method thereof Grant 10,076,038 - Park , et al. September 11, 2 | 2018-09-11 |
| Fan-out semiconductor package Grant 10,061,967 - Baek , et al. August 28, 2 | 2018-08-28 |
| Fan-out Semiconductor Package App 20180232556 - BAEK; Yong Ho ; et al. | 2018-08-16 |
| Printed circuit board, package and method of manufacturing the same Grant 10,045,444 - Lee , et al. August 7, 2 | 2018-08-07 |
| Fan-out semiconductor package Grant 10,026,678 - Cho , et al. July 17, 2 | 2018-07-17 |
| Fan-out Semiconductor Package App 20180182691 - CHO; Jung Hyun ; et al. | 2018-06-28 |
| Printed circuit board and method for manufacturing the same Grant 9,999,141 - Baek , et al. June 12, 2 | 2018-06-12 |
| Printed circuit board with embedded electronic component and manufacturing method thereof Grant 9,999,131 - Ko , et al. June 12, 2 | 2018-06-12 |
| Fan-out Semiconductor Package App 20180145033 - YI; Moon Hee ; et al. | 2018-05-24 |
| Image Sensor Device And Image Sensor Module Comprising The Same App 20180130750 - JUNG; Dae Kwon ; et al. | 2018-05-10 |
| Fan-out Semiconductor Package App 20180102332 - KIM; Byoung Chan ; et al. | 2018-04-12 |
| Fan-out Semiconductor Package App 20180076156 - KIM; Byoung Chan ; et al. | 2018-03-15 |
| Board For Electronic Component Package, Electronic Component Package, And Method Of Manufacturing Board For Electronic Component Package App 20180068911 - BAEK; Yong Ho ; et al. | 2018-03-08 |
| Fan-out Semiconductor Package App 20180053036 - BAEK; Yong Ho ; et al. | 2018-02-22 |
| Fan-out Semiconductor Package App 20180053732 - BAEK; Yong Ho ; et al. | 2018-02-22 |
| Printed circuit board and method of manufacturing the same Grant 9,894,764 - Lee , et al. February 13, 2 | 2018-02-13 |
| Printed circuit board and method of manufacturing the same Grant 9,848,492 - Lee , et al. December 19, 2 | 2017-12-19 |
| Chip embedded substrate Grant 9,837,343 - Kim , et al. December 5, 2 | 2017-12-05 |
| Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package Grant 9,831,142 - Baek , et al. November 28, 2 | 2017-11-28 |
| Printed circuit board and method of manufacturing the same Grant 9,736,927 - Cho , et al. August 15, 2 | 2017-08-15 |
| Printed circuit board and method of manufacturing printed circuit board Grant 9,736,939 - Cho , et al. August 15, 2 | 2017-08-15 |
| Electronic Component Package And Method Of Manufacturing The Same App 20170213794 - BAEK; Yong Ho ; et al. | 2017-07-27 |
| Printed Circuit Board App 20170202083 - BAEK; Yong-Ho ; et al. | 2017-07-13 |
| Board For Electronic Component Package, Electronic Component Package, And Method Of Manufacturing Board For Electronic Component Package App 20170133288 - BAEK; Yong Ho ; et al. | 2017-05-11 |
| Printed Circuit Board And Method For Manufacturing The Same App 20170094797 - BAEK; Yong-Ho ; et al. | 2017-03-30 |
| Printed Circuit Board And Manufacturing Method Thereof App 20170079142 - LEE; Jae-Ean ; et al. | 2017-03-16 |
| Element embedded printed circuit board and method of manufacturing the same Grant 9,578,749 - Cho , et al. February 21, 2 | 2017-02-21 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20160381796 - LEE; Sung-Uk ; et al. | 2016-12-29 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20160374196 - LEE; Jae-Ean ; et al. | 2016-12-22 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20160374197 - LEE; Jae-Ean ; et al. | 2016-12-22 |
| Semiconductor Package And Method Of Manufacturing The Same App 20160372411 - BAEK; Yong-Ho | 2016-12-22 |
| Printed Circuit Board And Manufacturing Method Thereof App 20160242277 - LEE; Jae-Ean ; et al. | 2016-08-18 |
| Printed Circuit Board, Semiconductor Package And Method Of Manufacturing The Same App 20160225706 - CHO; Jung-Hyun ; et al. | 2016-08-04 |
| Printed Circuit Board With Embedded Electronic Component And Manufacturing Method Thereof App 20160219712 - Ko; Kyung-Hwan ; et al. | 2016-07-28 |
| Printed Circuit Board, Package And Method Of Manufacturing The Same App 20160205780 - Lee; Jae-Ean ; et al. | 2016-07-14 |
| Element Embedded Printed Circuit Board And Method Of Manufacturing The Same App 20160143142 - CHO; Jung-Hyun ; et al. | 2016-05-19 |
| Printed Circuit Board And Method Of Manufacturing The Same, And Electronic Component Module App 20160143137 - BAEK; Yong Ho ; et al. | 2016-05-19 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20160135289 - CHO; Suk Hyeon ; et al. | 2016-05-12 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20160128186 - CHO; Suk Hyeon ; et al. | 2016-05-05 |
| Embedded Board And Method Of Manufacturing The Same App 20160105967 - CHOI; Jae Hoon ; et al. | 2016-04-14 |
| Printed Circuit Board And Method Of Manufacturing Printed Circuit Board App 20160088742 - CHO; Suk Hyeon ; et al. | 2016-03-24 |
| Printed Circuit Board And Manufacturing Method Thereof App 20160081191 - MOK; Jee-Soo ; et al. | 2016-03-17 |
| Printed Circuit Board And Manufacturing Method Thereof App 20160044788 - PARK; Jung Hyun ; et al. | 2016-02-11 |
| Embedded Board And Method Of Manufacturing The Same App 20160037645 - LEE; Jae Ean ; et al. | 2016-02-04 |
| Carrier Substrate And Method Of Manufacturing Printed Circuit Board Using The Same App 20160037619 - BAEK; Yong Ho ; et al. | 2016-02-04 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20160021744 - BAEK; Yong Ho ; et al. | 2016-01-21 |
| Chip Embedded Substrate And Method Of Manufacturing The Same App 20160007449 - KIM; Joon Sung ; et al. | 2016-01-07 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20150373833 - BAEK; Yong Ho ; et al. | 2015-12-24 |
| Embedded Coreless Substrate And Method For Manufacturing The Same App 20150342054 - BAEK; Yong Ho ; et al. | 2015-11-26 |
| Solder Ball And Circuit Board Including The Same App 20150251278 - LEE; Jae Ean ; et al. | 2015-09-10 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20150195902 - LEE; Eung Suek ; et al. | 2015-07-09 |
| Carrier For Manufacturing Printed Circuit Board And Manufacturing Method Thereof, And Method For Manufacturing Printed Circuit Board App 20150143694 - Lee; Jae Ean ; et al. | 2015-05-28 |
| Lead pin for printed circuit board and printed circuit board using the same Grant 8,796,559 - Baek , et al. August 5, 2 | 2014-08-05 |
| Lead Pin For Package Substrate And Package Substrate Using The Same App 20120120623 - BAEK; Yong Ho ; et al. | 2012-05-17 |
| Lead Pin For Printed Circuit Board And Printed Circuit Board Using The Same App 20120118620 - Baek; Yong Ho ; et al. | 2012-05-17 |
| Process for producing poly-tetrahydrofuran Grant 7,989,582 - Lee , et al. August 2, 2 | 2011-08-02 |
| Process for producing poly-tetrahydrofuran App 20090137776 - Lee; Eun-Ku ; et al. | 2009-05-28 |
| Production of tetrahydrofuran from 1,4-butanediol Grant 7,465,816 - Lee , et al. December 16, 2 | 2008-12-16 |
| Method of preparing tetrahydrofuran Grant 7,396,945 - Lee , et al. July 8, 2 | 2008-07-08 |
| Production of tetrahydrofuran from 1,4-butanediol App 20080161585 - Lee; Eun Ku ; et al. | 2008-07-03 |
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