Bae; Jong-Suk
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bae; Jong-Suk.The latest application filed is for "printed circuit board using bump and method for manufacturing thereof".
- Bae; Jong-Suk - Busan N/A KR
- Bae; Jong-Suk - Yeonje-gu KR
| Patent | Date |
|---|---|
| Printed circuit board using bump and method for manufacturing thereof Grant 8,549,744 - Shin , et al. October 8, 2 | 2013-10-08 |
| Printed circuit board using bump and method for manufacturing thereof App 20070235220 - Shin; Hee-Bum ; et al. | 2007-10-11 |
| Method of manufacturing package substrate with fine circuit pattern using anodic oxidation Grant 7,169,707 - Maeng , et al. January 30, 2 | 2007-01-30 |
| Method of fabricating package substrate using electroless nickel plating App 20060060558 - Maeng; Duck Young ; et al. | 2006-03-23 |
| Method of manufacturing package substrate with fine circuit pattern using anodic oxidation App 20060046485 - Maeng; Duck Young ; et al. | 2006-03-02 |
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