Bae; JoHyun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bae; JoHyun.The latest application filed is for "integrated circuit packaging system with package stacking and method of manufacture thereof".

Company Profile

1.36.25

Bae; JoHyun - Seoul N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit packaging system with package stacking Grant 9,349,666 - Bae , et al. May 24, 2	2016-05-24
Integrated circuit package system with multi-chip module Grant 9,330,945 - Song , et al. May 3, 2	2016-05-03
Integrated circuit packaging system with vertical interconnection and method of manufacture thereof Grant 9,093,392 - Cho , et al. July 28, 2	2015-07-28
Integrated circuit packaging system with fan-in package and method of manufacture thereof Grant 9,093,391 - Ahn , et al. July 28, 2	2015-07-28
Integrated circuit package system employing mold flash prevention technology Grant 8,772,916 - Jang , et al. July 8, 2	2014-07-08
Integrated circuit packaging system with stack device Grant 8,698,297 - Bae , et al. April 15, 2	2014-04-15
Integrated circuit packaging system with interposer and method of manufacture thereof Grant 8,699,232 - Choi , et al. April 15, 2	2014-04-15
Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Grant 8,674,516 - Han , et al. March 18, 2	2014-03-18
Integrated circuit packaging system with encapsulation and method of manufacture thereof Grant 8,643,181 - Bae , et al. February 4, 2	2014-02-04
Integrated circuit packaging system with encapsulation and method of manufacture thereof Grant 8,569,869 - Park , et al. October 29, 2	2013-10-29
Integrated circuit package system with dual side connection and method for manufacturing thereof Grant 8,501,535 - Song , et al. August 6, 2	2013-08-06
Semiconductor packaging system with an aligned interconnect and method of manufacture thereof Grant 8,497,575 - Yoon , et al. July 30, 2	2013-07-30
Integrated circuit packaging system with rounded interconnect Grant 8,461,680 - Bae , et al. June 11, 2	2013-06-11
Integrated Circuit Packaging System With Package Stacking And Method Of Manufacture Thereof App 20130075926 - Bae; JoHyun ; et al.	2013-03-28
Integrated Circuit Packaging System With Interposer And Method Of Manufacture Thereof App 20130070438 - Choi; A Leam ; et al.	2013-03-21
Integrated Circuit Packaging System With Vertical Interconnects And Method Of Manufacture Thereof App 20120326331 - Han; Byung Joon ; et al.	2012-12-27
Integrated circuit packaging system with stacked lead and method of manufacture thereof Grant 8,304,900 - Jang , et al. November 6, 2	2012-11-06
Integrated Circuit Package System Employing Mold Flash Prevention Technology App 20120267801 - Jang; Ki Youn ; et al.	2012-10-25
Integrated circuit package system employing mold flash prevention technology Grant 8,252,615 - Jang , et al. August 28, 2	2012-08-28
Integrated circuit packaging system with conductive pillars and method of manufacture thereof Grant 8,232,141 - Choi , et al. July 31, 2	2012-07-31
Integrated Circuit Packaging System With Vertical Interconnection And Method Of Manufacture Thereof App 20120146229 - Cho; SungWon ; et al.	2012-06-14
Mountable integrated circuit package system with substrate having a conductor-free recess Grant 8,129,832 - Carson , et al. March 6, 2	2012-03-06
Integrated Circuit Packaging System With Stacked Lead And Method Of Manufacture Thereof App 20120038040 - Jang; Ki Youn ; et al.	2012-02-16
Integrated Circuit Packaging System With Rounded Interconnect App 20120025374 - Bae; JoHyun ; et al.	2012-02-02
Integrated circuit packaging system with rounded interconnect and method of manufacture thereof Grant 8,039,275 - Bae , et al. October 18, 2	2011-10-18
Integrated Circuit Packaging System With Encapsulation And Method Of Manufacture Thereof App 20110233736 - Park; HyungSang ; et al.	2011-09-29
Integrated Circuit Packaging System With Encapsulation And Method Of Manufacture Thereof App 20110233751 - Bae; JoHyun ; et al.	2011-09-29
Semiconductor Packaging System With An Aligned Interconnect And Method Of Manufacture Thereof App 20110204508 - Yoon; In Sang ; et al.	2011-08-25
Integrated Circuit Packaging System With Conductive Pillars And Method Of Manufacture Thereof App 20110180935 - Choi; DaeSik ; et al.	2011-07-28
Integrated Circuit Package System With Dual Side Connection And Method For Manufacturing Thereof App 20110115098 - Song; Sungmin ; et al.	2011-05-19
Integrated circuit packaging system with conductive pillars and method of manufacture thereof Grant 7,923,304 - Choi , et al. April 12, 2	2011-04-12
Integrated Circuit Packaging System With Fan-in Package And Method Of Manufacture Thereof App 20110062602 - Ahn; SeungYun ; et al.	2011-03-17
Integrated Circuit Packaging System With Conductive Pillars And Method Of Manufacture Thereof App 20110057308 - Choi; DaeSik ; et al.	2011-03-10
Integrated circuit package system with dual side connection Grant 7,884,457 - Song , et al. February 8, 2	2011-02-08
Mountable integrated circuit package system with stacking interposer Grant 7,800,212 - Yoon , et al. September 21, 2	2010-09-21
Multichip package system Grant 7,710,735 - Bae , et al. May 4, 2	2010-05-04
Mountable integrated circuit package-in-package system with adhesive spacing structures Grant 7,687,897 - Ha , et al. March 30, 2	2010-03-30
Integrated Circuit Package System App 20090283889 - Jang; Byoung Wook ; et al.	2009-11-19
Mountable Integrated Circuit Package System With Stacking Interposer App 20090166834 - Yoon; In Sang ; et al.	2009-07-02
Mountable Integrated Circuit Package System With Substrate Having A Conductor-free Recess App 20090108428 - Carson; Flynn ; et al.	2009-04-30
Integrated Circuit Package System With Multi-chip Module App 20090072375 - Song; Sungmin ; et al.	2009-03-19
Integrated Circuit Package System With Dual Side Connection App 20090001612 - Song; Sungmin ; et al.	2009-01-01
Mountable Integrated Circuit Package-in-package System With Adhesive Spacing Structures App 20080157319 - Ha; Jong-Woo ; et al.	2008-07-03
Integrated Circuit Package System Employing Mold Flash Prevention Technology App 20080150119 - Jang; Ki Youn ; et al.	2008-06-26
Spacerless Semiconductor Package Chip Stacking System App 20070268660 - Ahn; Seungyun ; et al.	2007-11-22
Multichip Package System App 20070235216 - Bae; JoHyun ; et al.	2007-10-11

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