| Patent | Date |
|---|
Semiconductor device and method of fabricating the same
Grant 9,831,164 - Moon , et al. November 28, 2 | 2017-11-28 |
Semiconductor device and method of fabricating the same
Grant 9,530,726 - Moon , et al. December 27, 2 | 2016-12-27 |
Semiconductor devices having optical transceiver
Grant 9,103,974 - Kang , et al. August 11, 2 | 2015-08-11 |
Image sensors
Grant 8,958,002 - Choi , et al. February 17, 2 | 2015-02-17 |
Buried-type optical input/output devices and methods of manufacturing the same
Grant 8,873,901 - Kang , et al. October 28, 2 | 2014-10-28 |
Optical input/output device for photo-electric integrated circuit device and method of fabricating same
Grant 8,867,882 - Kang , et al. October 21, 2 | 2014-10-21 |
Semiconductor Device and Method of Fabricating the Same
App 20140217603 - Moon; Kwang-jin ; et al. | 2014-08-07 |
Optical waveguide and coupler apparatus and method of manufacturing the same
Grant 8,791,405 - Ji , et al. July 29, 2 | 2014-07-29 |
Methods of selectively forming silicon-on-insulator structures using selective expitaxial growth process
Grant 8,735,265 - Kang , et al. May 27, 2 | 2014-05-27 |
Image Sensors
App 20140048853 - Choi; Sang-Jun ; et al. | 2014-02-20 |
Semiconductor Device and Method of Fabricating the Same
App 20140035164 - Moon; Kwang-jin ; et al. | 2014-02-06 |
Image sensors and methods of manufacturing image sensors
Grant 8,570,409 - Choi , et al. October 29, 2 | 2013-10-29 |
Method for forming light guide layer in semiconductor substrate
Grant 8,546,162 - Bae , et al. October 1, 2 | 2013-10-01 |
Optical Input/output Device For Photo-electric Integrated Circuit Device And Method Of Fabricating Same
App 20130224935 - KANG; Pil-Kyu ; et al. | 2013-08-29 |
Optical input/output device for photo-electric integrated circuit device and method of fabricating same
Grant 8,422,845 - Kang , et al. April 16, 2 | 2013-04-16 |
Semiconductor device and method of fabricating the same
Grant 8,390,120 - Moon , et al. March 5, 2 | 2013-03-05 |
Stacked Integrated Circuit Packages That Include Monolithic Conductive Vias
App 20130049225 - KANG; Pil-kyu ; et al. | 2013-02-28 |
Conductive layer buried-type substrate, method of forming the conductive layer buried-type substrate, and method of fabricating semiconductor device using the conductive layer buried-type substrate
Grant 8,354,308 - Kang , et al. January 15, 2 | 2013-01-15 |
Wafer temporary bonding method using silicon direct bonding
Grant 8,343,851 - Kim , et al. January 1, 2 | 2013-01-01 |
Semiconductor Devices Having Optical Transceiver
App 20120314991 - Kang; Pil-Kyu ; et al. | 2012-12-13 |
Buried-type Optical Input/output Devices And Methods Of Manufacturing The Same
App 20120314993 - Kang; Pil-Kyu ; et al. | 2012-12-13 |
Methods of manufacturing buried wiring type substrate and semiconductor device incorporating buried wiring type substrate
Grant 8,324,055 - Kang , et al. December 4, 2 | 2012-12-04 |
Stacked integrated circuit package having recessed sidewalls
Grant 8,319,329 - Kang , et al. November 27, 2 | 2012-11-27 |
Semiconductor Devices And Methods Of Manufacturing The Same
App 20120132986 - Kang; Pil-Kyu ; et al. | 2012-05-31 |
Stacked Integrated Circuit Package Fabrication Methods That Use Vias Formed And Filled After Stacking, And Related Stacked Integrated Circuit Package Structures
App 20120119383 - Kang; Pil-kyu ; et al. | 2012-05-17 |
Substrate Structure Having Buried Wiring And Method For Manufacturing The Same, And Semiconductor Device And Method For Manufacturing The Same Using The Substrate Structure
App 20120108034 - Bae; Dae-Lok ; et al. | 2012-05-03 |
Method For Forming Light Guide Layer In Semiconductor Substrate
App 20120088323 - BAE; DAE-LOK ; et al. | 2012-04-12 |
Stacked integrated circuit packages that include monolithic conductive vias
Grant 8,129,833 - Kang , et al. March 6, 2 | 2012-03-06 |
Conductive Layer Buried-type Substrate, Method Of Forming The Conductive Layer Buried-type Substrate, And Method Of Fabricating Semiconductor Device Using The Conductive Layer Buried-type Substrate
App 20120052635 - Kang; Pil-kyu ; et al. | 2012-03-01 |
Semiconductor Device and Method of Fabricating the Same
App 20110316168 - Moon; Kwang-Jin ; et al. | 2011-12-29 |
Methods Of Selectively Forming Silicon-on-insulator Structures Using Selective Expitaxial Growth Process
App 20110250738 - Kang; Pil-Kyu ; et al. | 2011-10-13 |
Methods Of Manufacturing Buried Wiring Type Substrate And Semiconductor Device Incorporating Buried Wiring Type Substrate
App 20110223725 - KANG; Pil-Kyu ; et al. | 2011-09-15 |
Optical Input/output Device For Photo-electric Integrated Circuit Device And Method Of Fabricating Same
App 20110188828 - KANG; Pil-Kyu ; et al. | 2011-08-04 |
Optical waveguide and coupler apparatus and method of manufacturing the same
App 20110133063 - Ji; Ho-chul ; et al. | 2011-06-09 |
Image Sensors and Methods of Manufacturing Image Sensors
App 20110096215 - Choi; Sang-Jun ; et al. | 2011-04-28 |
Methods of forming stacked semiconductor devices with single-crystal semiconductor regions
Grant 7,932,163 - Lim , et al. April 26, 2 | 2011-04-26 |
Methods of fabricating semiconductor devices having isolation regions formed from annealed oxygen ion implanted regions
Grant 7,781,302 - Cha , et al. August 24, 2 | 2010-08-24 |
Stacked Integrated Circuit Package Fabrication Methods That Use Vias Formed And Filled After Stacking, And Related Stacked Integrated Circuit Package Structures
App 20100109164 - Kang; Pil-kyu ; et al. | 2010-05-06 |
Wafer temporary bonding method using silicon direct bonding
App 20100068868 - Kim; Jung-ho ; et al. | 2010-03-18 |
Methods of manufacturing a three-dimensional semiconductor device and semiconductor devices fabricated thereby
Grant 7,605,022 - Cha , et al. October 20, 2 | 2009-10-20 |
Methods of Fabricating Silicon on Insulator (SOI) Wafers
App 20090221133 - Choi; Seung-Woo ; et al. | 2009-09-03 |
Method Of Fabricating Semiconductor Wafer
App 20080213982 - Park; Young-Soo ; et al. | 2008-09-04 |
Methods of Forming Stacked Semiconductor Devices with Single-Crystal Semiconductor Regions
App 20080200009 - Lim; Jong-Heun ; et al. | 2008-08-21 |
Methods Of Recycling A Substrate Including Using A Chemical Mechanical Polishing Process
App 20080124930 - Lim; Jong Heun ; et al. | 2008-05-29 |
Methods of fabricating semiconductor devices having isolation regions formed from annealed oxygen ion implanted regions
App 20070269957 - Cha; Yong-Won ; et al. | 2007-11-22 |
Methods Of Manufacturing A Three-dimensional Semiconductor Device And Semiconductor Devices Fabricated Thereby
App 20070158831 - CHA; Yong-Won ; et al. | 2007-07-12 |
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