Badakere Govindaiah; Guruprasad

Patent Applications and Registrations

Patent applications and USPTO patent grants for Badakere Govindaiah; Guruprasad.The latest application filed is for "method for manufacturing integrated circuit package system with under paddle leadfingers".

Company Profile

0.7.4

Badakere Govindaiah; Guruprasad - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit packaging system with cap layer and method of manufacture thereof Grant 8,536,690 - Camacho , et al. September 17, 2	2013-09-17
Method for manufacturing integrated circuit package system with under paddle leadfingers Grant 8,153,478 - Badakere Govindaiah , et al. April 10, 2	2012-04-10
Integrated circuit package system with dual connectivity Grant 8,120,150 - Badakere Govindaiah , et al. February 21, 2	2012-02-21
Integrated circuit package system with shield and tie bar Grant 8,072,047 - Camacho , et al. December 6, 2	2011-12-06
Method For Manufacturing Integrated Circuit Package System With Under Paddle Leadfingers App 20110256670 - Badakere Govindaiah; Guruprasad ; et al.	2011-10-20
Integrated circuit package system with under paddle leadfingers Grant 7,989,931 - Badakere Govindaiah , et al. August 2, 2	2011-08-02
Integrated Circuit Packaging System With Cap Layer And Method Of Manufacture Thereof App 20110068448 - Camacho; Zigmund Ramirez ; et al.	2011-03-24
Integrated circuit package system with shielding Grant 7,714,419 - Camacho , et al. May 11, 2	2010-05-11
Integrated Circuit Package System With Under Paddle Leadfingers App 20090079048 - Badakere Govindaiah; Guruprasad ; et al.	2009-03-26
Integrated Circuit Package System With Dual Connectivity App 20090072366 - Badakere Govindaiah; Guruprasad ; et al.	2009-03-19

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