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Patent applications and USPTO patent grants for Backhaus; Kuno.The latest application filed is for "arrangement and method for inspecting unpatterned wafers".
Patent | Date |
---|---|
Arrangement and method for inspecting unpatterned wafers Grant 7,084,965 - Wienecke , et al. August 1, 2 | 2006-08-01 |
Optical measurement arrangement, in particular for layer thickness measurement Grant 6,618,154 - Engel , et al. September 9, 2 | 2003-09-09 |
Arrangement and method for inspecting unpatterned wafers App 20030038932 - Wienecke, Joachim ;   et al. | 2003-02-27 |
Method and apparatus for monitoring the light emitted from an illumination apparatus for an optical measuring instrument Grant 6,456,373 - Wienecke , et al. September 24, 2 | 2002-09-24 |
Optical measurement arrangement, in particular for layer thickness measurement App 20020003217 - Engel, Horst ;   et al. | 2002-01-10 |
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