Bachman; Mark Adam
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bachman; Mark Adam.The latest application filed is for "inhibition of copper dissolution for lead-free soldering".
- Bachman; Mark Adam - Sinking Spring PA
| Patent | Date |
|---|---|
| Inhibition Of Copper Dissolution For Lead-free Soldering App 20100319967 - Amin; Ahmed ; et al. | 2010-12-23 |
| Structure and method for fabricating flip chip devices Grant 7,777,333 - Bachman , et al. August 17, 2 | 2010-08-17 |
| Method of making electronic entities Grant 7,724,359 - Amin , et al. May 25, 2 | 2010-05-25 |
| Electronic packages Grant 7,671,436 - Amin , et al. March 2, 2 | 2010-03-02 |
| Method of making electronic entities App 20090298286 - Amin; Ahmed Nur ; et al. | 2009-12-03 |
| Electronic packages App 20090273078 - Amin; Ahmed Nur ; et al. | 2009-11-05 |
| Structure and Method for Fabricating Flip Chip Devices App 20090072393 - Bachman; Mark Adam ; et al. | 2009-03-19 |
| Low thermal resistance assembly for flip chip applications Grant 7,479,695 - Bachman , et al. January 20, 2 | 2009-01-20 |
| Structure and method for bonding to copper interconnect structures Grant 7,328,830 - Bachman , et al. February 12, 2 | 2008-02-12 |
| Low thermal resistance assembly for flip chip applications App 20070216034 - Bachman; Mark Adam ; et al. | 2007-09-20 |
| Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process Grant 7,221,173 - Bachman , et al. May 22, 2 | 2007-05-22 |
| Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process App 20060066327 - Bachman; Mark Adam ; et al. | 2006-03-30 |
| Reinforced bond pad Grant 6,960,836 - Bachman , et al. November 1, 2 | 2005-11-01 |
| Methods and system for reinforcing a bond pad App 20050067709 - Bachman, Mark Adam ; et al. | 2005-03-31 |
| Structure and method for bonding to copper interconnect structures App 20040182915 - Bachman, Mark Adam ; et al. | 2004-09-23 |
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