Bachman; Mark A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bachman; Mark A..The latest application filed is for "stacked interconnect heat sink".

Company Profile

0.15.14

Bachman; Mark A. - Sinking Spring PA
Bachman; Mark A - Sinking Spring PA
Bachman; Mark A. - Sinking Springs PA US
Bachman; Mark A. - Allentown PA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integration of shallow trench isolation and through-substrate vias into integrated circuit designs Grant 9,613,847 - Bachman , et al. April 4, 2	2017-04-04
Stacked Interconnect Heat Sink App 20150214130 - Bachman; Mark A. ; et al.	2015-07-30
Stacked interconnect heat sink Grant 9,054,064 - Bachman , et al. June 9, 2	2015-06-09
Method of fabrication of through-substrate vias Grant 8,987,137 - Bachman , et al. March 24, 2	2015-03-24
Integration Of Shallow Trench Isolation And Through-substrate Vias Into Integrated Circuit Designs App 20140220760 - Bachman; Mark A. ; et al.	2014-08-07
Integration of shallow trench isolation and through-substrate vias into integrated circuit designs Grant 8,742,535 - Bachman , et al. June 3, 2	2014-06-03
Contact Support Pillar Structure For Flip Chip Semiconductor Devices And Method Of Manufacture Therefore App 20140015127 - Bachman; Mark A. ; et al.	2014-01-16
Solder interconnect by addition of copper Grant 8,580,621 - Bachman , et al. November 12, 2	2013-11-12
Stacked Interconnect Heat Sink App 20130280864 - Bachman; Mark A. ; et al.	2013-10-24
Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore Grant 8,507,317 - Bachman , et al. August 13, 2	2013-08-13
Stacked interconnect heat sink Grant 8,492,911 - Bachman , et al. July 23, 2	2013-07-23
Solder Interconnect By Addition Of Copper App 20130149857 - Bachman; Mark A. ; et al.	2013-06-13
Routing Under Bond Pad For The Replacement Of An Interconnect Layer App 20130056868 - Archer, III; Vance D. ; et al.	2013-03-07
Solder interconnect by addition of copper Grant 8,378,485 - Bachman , et al. February 19, 2	2013-02-19
Routing under bond pad for the replacement of an interconnect layer Grant 8,319,343 - Archer, III , et al. November 27, 2	2012-11-27
Integration Of Shallow Trench Isolation And Through-substrate Vias Into Integrated Circuit Designs App 20120153430 - Bachman; Mark A. ; et al.	2012-06-21
Method Of Fabrication Of Through-substrate Vias App 20120153492 - Bachman; Mark A. ; et al.	2012-06-21
Stacked Interconnect Heat Sink App 20120020028 - Bachman; Mark A. ; et al.	2012-01-26
Solder Bump Structure For Flip Chip Semiconductor Devices And Method Of Manufacture Therefor App 20110195544 - Bachman; Mark A. ; et al.	2011-08-11
Solder bump structure for flip chip semiconductor devices and method of manufacture therefore Grant 7,952,206 - Bachman , et al. May 31, 2	2011-05-31
Suppressing Fractures In Diced Integrated Circuits App 20110006389 - Bachman; Mark A. ; et al.	2011-01-13
Solder Interconnect By Addition Of Copper App 20110006415 - Bachman; Mark A. ; et al.	2011-01-13
Solder Bump Structure For Flip Chip Semiconductor Devices And Method Of Manufacture Therefore App 20070069394 - Bachman; Mark A. ; et al.	2007-03-29
Routing Under Bond Pad For The Replacement Of An Interconnect Layer App 20070063352 - Archer; Vance D. III ; et al.	2007-03-22

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.