Baars; Dirk M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Baars; Dirk M..The latest application filed is for "dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof".

Company Profile

0.13.9

Baars; Dirk M. - South Windsor CT
Baars; Dirk M. - Brighton MA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof Grant 9,918,384 - Baars , et al. March 13, 2	2018-03-13
Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith Grant 9,265,160 - Paul , et al. February 16, 2	2016-02-16
Dielectric Bond Plies For Circuits And Multilayer Circuits, And Methods Of Manufacture Thereof App 20140318698 - Baars; Dirk M. ; et al.	2014-10-30
Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof Grant 8,809,690 - Baars , et al. August 19, 2	2014-08-19
Dielectric Materials, Methods Of Forming Subassemblies Therefrom, And The Subassemblies Formed Therewith App 20140090767 - Paul; Sankar ; et al.	2014-04-03
Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith Grant 8,632,874 - Paul , et al. January 21, 2	2014-01-21
Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom Grant 8,519,273 - Paul , et al. August 27, 2	2013-08-27
Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom Grant 8,257,820 - Paul , et al. September 4, 2	2012-09-04
Circuit materials, circuits laminates, and method of manufacture thereof Grant 8,187,696 - Paul , et al. May 29, 2	2012-05-29
Dielectric Bond Plies For Circuits And Multilayer Circuits, And Methods Of Manufacture Thereof App 20110214906 - Baars; Dirk M. ; et al.	2011-09-08
Circuit Materials With Improved Bond, Method Of Manufacture Thereof, And Articles Formed Therefrom App 20110031003 - Paul; Sankar ; et al.	2011-02-10
Dielectric Materials, Methods Of Forming Subassemblies Therefrom, And The Subassemblies Formed Therewith App 20100307803 - Paul; Sankar ; et al.	2010-12-09
Circuit Materials, Circuits Laminates, And Method Of Manufacture Thereof App 20100015404 - Paul; Sankar K. ; et al.	2010-01-21
Circuit Materials With Improved Bond, Method Of Manufacture Thereof, And Articles Formed Therefrom App 20090191387 - Paul; Sankar ; et al.	2009-07-30
Circuit board materials with improved bond to conductive metals and methods of the manufacture thereof App 20070093035 - Daigle; Robert C. ; et al.	2007-04-26
Apparatus and method of manufacture of electrochemical cell components Grant 7,138,203 - Baars , et al. November 21, 2	2006-11-21
Apparatus and method of manufacture of electrochemical cell components App 20040076863 - Baars, Dirk M. ; et al.	2004-04-22
Forming biaxially oriented ordered polymer films Grant 4,973,442 - Harvey , et al. November 27, 1	1990-11-27
Biaxially oriented ordered polymer films Grant 4,963,428 - Harvey , et al. October 16, 1	1990-10-16

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