Azeroual; Dan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Azeroual; Dan.The latest application filed is for "ic package with top-side memory module".
- Azeroual; Dan - Kiriat Ata IL
- Azeroual; Dan - Kiryat Ata IL
| Patent | Date |
|---|---|
| Package system having laterally offset and ovelapping chip packages Grant 11,088,123 - Azeroual , et al. August 10, 2 | 2021-08-10 |
| Polygonal BGA semiconductor package Grant 11,004,778 - Azeroual , et al. May 11, 2 | 2021-05-11 |
| Ic Package With Top-side Memory Module App 20200388598 - AZEROUAL; Dan ; et al. | 2020-12-10 |
| Pcb Module On Package App 20190244903 - Azeroual; Dan ; et al. | 2019-08-08 |
| Ic Package App 20190051587 - AZEROUAL; Dan ; et al. | 2019-02-14 |
| Ball-out for differential signals Grant 9,089,060 - Azeroual , et al. July 21, 2 | 2015-07-21 |
| Method and apparatus for tuning delay Grant 9,083,348 - Azeroual , et al. July 14, 2 | 2015-07-14 |
| Bump out for differential signals Grant 8,803,339 - Azeroual August 12, 2 | 2014-08-12 |
| Method and apparatus for tuning delay Grant 8,164,348 - Azeroual , et al. April 24, 2 | 2012-04-24 |
| Circuit board layout Grant 7,838,778 - Hasko , et al. November 23, 2 | 2010-11-23 |
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