Azdasht; Ghassem

Patent Applications and Registrations

Patent applications and USPTO patent grants for Azdasht; Ghassem.The latest application filed is for "assembly and method for applying solder balls to a substrate".

Company Profile

3.49.44

Azdasht; Ghassem - Berlin DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Device for the separate application of solder material deposits Grant 11,224,928 - Azdasht January 18, 2	2022-01-18
Assembly and Method for Applying Solder Balls to a Substrate App 20210379683 - Azdasht; Ghassem	2021-12-09
Method And Laser Arrangement For Fusing A Solder Material Deposit By Means Of Laser Energy App 20210220934 - Azdasht; Ghassem	2021-07-22
Solder Ball Feeding Device App 20200269336 - Azdasht; Ghassem	2020-08-27
Device for the separate application of bonding material deposits Grant 10,695,853 - Azdasht , et al.	2020-06-30
Device for removing a test contact of a test contact arrangement Grant 10,634,699 - Krause , et al.	2020-04-28
Method for producing a chip module Grant 10,354,971 - Azdasht , et al. July 16, 2	2019-07-16
Device for the separate application of connecting material deposits Grant 10,286,470 - Azdasht	2019-05-14
Method for forming solder deposits Grant 10,118,240 - Azdasht November 6, 2	2018-11-06
Device for the separate application of solder material deposits Grant 10,081,068 - Azdasht September 25, 2	2018-09-25
Device For Removing A Test Contact Of A Test Contact Arrangement App 20180259554 - Krause; Thorsten ; et al.	2018-09-13
Method for Forming Solder Deposits App 20170320155 - Azdasht; Ghassem	2017-11-09
Semiconductor chip assembly and method for manufacturing the same Grant 9,685,423 - Azdasht June 20, 2	2017-06-20
Device For The Separate Application Of Bonding Material Deposits App 20170165773 - Azdasht; Ghassem ; et al.	2017-06-15
Solder Ball Feeding Device App 20170165772 - Azdasht; Ghassem	2017-06-15
Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium Grant 9,649,711 - Azdasht May 16, 2	2017-05-16
Method For Producing A Chip Module App 20170133340 - Azdasht; Ghassem ; et al.	2017-05-11
Device For The Separate Application Of Solder Material Deposits App 20160354853 - Azdasht; Ghassem	2016-12-08
Device For The Separate Application Of Solder Material Deposits App 20160279725 - Azdasht; Ghassem	2016-09-29
Device for the Separate Application of Connecting Material Deposits App 20160250704 - Azdasht; Ghassem	2016-09-01
Method and device for transferring a chip to a contact substrate Grant 9,401,298 - Zakel , et al. July 26, 2	2016-07-26
Method and device for contacting, positioning and impinging a solder ball formation with laser energy Grant 9,327,360 - Azdasht May 3, 2	2016-05-03
Semiconductor Chip Assembly and Method for Manufacturing the Same App 20150364446 - Azdasht; Ghassem	2015-12-17
Test contact arrangement Grant 8,988,094 - Azdasht March 24, 2	2015-03-24
Diode array and method for producing a diode array Grant 8,742,571 - Zakel , et al. June 3, 2	2014-06-03
Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium App 20140027418 - Azdasht; Ghassem	2014-01-30
Device for positioning and contacting test contacts Grant 8,480,298 - Azdasht July 9, 2	2013-07-09
Method and Device for Forming Solder Deposits App 20130087539 - Azdasht; Ghassem	2013-04-11
Method for alternately contacting two wafers Grant 8,361,881 - Zakel , et al. January 29, 2	2013-01-29
Method and device for removing solder material deposits from a substrate Grant 8,330,076 - Azdasht December 11, 2	2012-12-11
Transfer device for receiving and transferring a solder ball arrangement Grant 8,328,068 - Azdasht , et al. December 11, 2	2012-12-11
Diode Array and Method for Producing a Diode Array App 20120228772 - Zakel; Elke ; et al.	2012-09-13
Method and device for drying circuit substrates Grant 8,256,131 - Zakel , et al. September 4, 2	2012-09-04
Device for applying an electronic component Grant 8,205,325 - Azdasht June 26, 2	2012-06-26
Contact Array for Substrate Contacting App 20120126410 - Zakel; Elke ; et al.	2012-05-24
Method of manufacturing a contact arrangement between a microelectronic component and a carrier Grant 8,087,163 - Azdasht January 3, 2	2012-01-03
Method And Device For Alternately Contacting Two Wafers App 20110244651 - Zakel; Elke ; et al.	2011-10-06
Device for Positioning and Contacting Test Contacts App 20110235681 - Azdasht; Ghassem	2011-09-29
Device for alternately contacting two wafers Grant 7,932,611 - Zakel , et al. April 26, 2	2011-04-26
Test Contact Arrangement App 20110089963 - Azdasht; Ghassem	2011-04-21
Method and device for transferring a solder deposit configuration Grant 7,926,699 - Zakel , et al. April 19, 2	2011-04-19
Method and device for mutual contacting of two wafers Grant 7,882,997 - Zakel , et al. February 8, 2	2011-02-08
Transfer Device For Receiving And Transferring A Solder Ball Arrangement App 20100213243 - Azdasht; Ghassem ; et al.	2010-08-26
Method and device for transferring a solder deposit configuration Grant 7,762,446 - Zakel , et al. July 27, 2	2010-07-27
Method And Device For Removing Solder Material Deposits From A Substrate App 20100181295 - Azdasht; Ghassem	2010-07-22
Method for the production of a soldered joint Grant 7,726,543 - Azdasht June 1, 2	2010-06-01
Method and device for applying a solder to a substrate Grant 7,717,316 - Azdasht , et al. May 18, 2	2010-05-18
Method And Device For Contacting, Positioning And Impinging A Solder Ball Formation With Laser Energy App 20100051589 - Azdasht; Ghassem	2010-03-04
Method And Device For Transferring A Solder Deposit Configuration App 20100051673 - Zakel; Elke ; et al.	2010-03-04
Method And Device For Applying An Electronic Component App 20090249620 - Azdasht; Ghassem	2009-10-08
Method For Manufacturing A Contact Arrangement Between A Microelectronic Component And A Carrier Substrate As Well As An Assembly Unit Manufactured By This Method App 20090032296 - Azdasht; Ghassem	2009-02-05
Method and Device for Transferring a Solder Deposit Configuration App 20080302863 - Zakel; Elke ; et al.	2008-12-11
Method and Device For Drying Circuit Substrates App 20080282574 - Zakel; Elke ; et al.	2008-11-20
Optical System App 20080260370 - Zakel; Elke ; et al.	2008-10-23
Method and Device for Transferring a Chip to a Contact Substrate App 20080210368 - Zakel; Elke ; et al.	2008-09-04
Method and Device For Mutual Contacting of Two Wafers App 20080171404 - Zakel; Elke ; et al.	2008-07-17
Method For The Production Of A Soldered Joint App 20080142576 - Azdasht; Ghassem	2008-06-19
Method for the production of a soldered connection Grant 7,360,679 - Azdasht April 22, 2	2008-04-22
Method And Device For Alternately Contacting Two Wafers App 20070272991 - Zakel; Elke ; et al.	2007-11-29
Method and device for applying a solder to a substrate App 20070257090 - Azdasht; Ghassem ; et al.	2007-11-08
Chip module and chip card module for producing a chip card Grant 7,106,599 - Azdasht September 12, 2	2006-09-12
Process for the formation of a spatial chip arrangement and spatial chip arrangement Grant 7,087,442 - Oppermann , et al. August 8, 2	2006-08-08
Method for producing a contact substrate and corresponding contact substrate Grant 7,049,213 - Zakel , et al. May 23, 2	2006-05-23
Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumps Grant 6,983,539 - Akhavain , et al. January 10, 2	2006-01-10
Method for producing a substrate arrangement Grant 6,955,943 - Zakel , et al. October 18, 2	2005-10-18
Device for applying solder globules Grant 6,915,940 - Zakel , et al. July 12, 2	2005-07-12
Method and device for placing and remelting shaped pieces consisting of solder material Grant 6,769,599 - Momeni , et al. August 3, 2	2004-08-03
Device for applying solder globules App 20040094600 - Zakel, Elke ; et al.	2004-05-20
Chip module and chip card module for producing a chip card App 20040080902 - Azdasht, Ghassem	2004-04-29
Method and device for applying a solder to a substrate App 20040069758 - Azdasht, Ghassem ; et al.	2004-04-15
Method for the production of a soldered connection App 20040060971 - Azdasht, Ghassem	2004-04-01
Method and device for thermally connecting the contact surfaces of two substrates Grant 6,713,714 - Azdasht March 30, 2	2004-03-30
Method for producing a substrate arrangement App 20030235976 - Zakel, Elke ; et al.	2003-12-25
Method for producing a contact substrate and corresponding contact substrate App 20030186527 - Zakel, Elke ; et al.	2003-10-02
Connection of electrical contacts utilizing a combination laser and fiber optic push connect system App 20030041455 - Akhavain, Mohammad ; et al.	2003-03-06
Process for the formation of a spatial chip arrangement and spatial chip arrangement App 20020009828 - Oppermann, Hans-Hermann ; et al.	2002-01-24
Chips arranged in plurality of planes and electrically connected to one another Grant 6,281,577 - Oppermann , et al. August 28, 2	2001-08-28
Device for producing connections between two respective contact elements by means of laser energy Grant 6,072,148 - Azdasht June 6, 2	2000-06-06
Method of attaching a component to a plate-shaped support Grant 6,056,188 - Azdasht , et al. May 2, 2	2000-05-02
Thermal connecting structure for connecting materials with different expansion coefficients Grant 6,043,985 - Azdasht , et al. March 28, 2	2000-03-28
Multi-wavelength laser soldering device with substrate cleaning beam Grant 5,977,512 - Azdasht , et al. November 2, 1	1999-11-02
Method and apparatus for the bonding of a contact element Grant 5,938,951 - Azdasht August 17, 1	1999-08-17
Process and apparatus for producing a bonded metal coating Grant 5,653,381 - Azdasht August 5, 1	1997-08-05

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