Ayuba; Shinichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ayuba; Shinichi.The latest application filed is for "thermoplastic resin composition, resin molded article, and method for manufacturing the resin molded article with plating layer".

Company Profile

2.9.9

Ayuba; Shinichi - Kanagawa N/A JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polyamide resin composition Grant 10,273,359 - Ogawa , et al.	2019-04-30
Thermoplastic Resin Composition, Resin Molded Article, And Method For Manufacturing The Resin Molded Article With Plating Layer App 20160215124 - TAKANO; Takahiro ; et al.	2016-07-28
Polyamide Resin App 20150166726 - Ogawa; Shun ; et al.	2015-06-18
Reactive polyamide resins and polyamide resin compositions Grant 8,993,677 - Mitadera , et al. March 31, 2	2015-03-31
Method for producing polyamide Grant 8,835,596 - Kuwahara , et al. September 16, 2	2014-09-16
Reactive Polyamide Resins And Polyamide Resin Compositions App 20130123439 - Mitadera; Jun ; et al.	2013-05-16
Flame-retardant polyamide resin composition Grant 8,440,756 - Ishii , et al. May 14, 2	2013-05-14
Polyamide Resin Composition App 20120177937 - Ogawa; Shun ; et al.	2012-07-12
Flame-retardant Polyamide Resin Composition App 20120172512 - Ishii; Kentaro ; et al.	2012-07-05
Polyamide Resin App 20120065327 - Ogawa; Shun ; et al.	2012-03-15
Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate Grant 8,128,782 - Yonehama , et al. March 6, 2	2012-03-06
Method For Producing Polyamide App 20110245454 - Kuwahara; Hisayuki ; et al.	2011-10-06
Amine Epoxy Resin Curing Agent, Gas Barrier Epoxy Resin Composition Comprising The Curing Agent, Coating Agent, And Adhesive Agent For Laminate App 20100160494 - Yonehama; Shinichi ; et al.	2010-06-24

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