Ayama; Koichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ayama; Koichi.The latest application filed is for "thermosetting resin composition".

Company Profile

0.10.7

Ayama; Koichi - Tokyo JP
Ayama; Koichi - Kumamoto JP
Ayama; Koichi - Minamata JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermosetting resin composition Grant 9,593,240 - Tajima , et al. March 14, 2	2017-03-14
Thermosetting resin composition Grant 9,512,273 - Tajima , et al. December 6, 2	2016-12-06
Thermosetting Resin Composition App 20160264779 - TAJIMA; AKIO ; et al.	2016-09-15
Thermosetting Resin Composition App 20150291737 - Tajima; Akio ; et al.	2015-10-15
Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductor Grant 9,115,243 - Kawabata , et al. August 25, 2	2015-08-25
Compound including organopolysiloxane or silsesquioxane skeleton having isocyanuric skeleton, epoxy group and SiH group, thermosetting resin composition containing the compound as adhesion-imparting agent, hardened material and sealing agent for optical semiconductor Grant 8,987,358 - Kawabata , et al. March 24, 2	2015-03-24
New Organosilicon Compound, Thermosetting Resin Composition Containing The Organosilicon Compound, Hardening Resin And Encapsulation Material For Optical Semiconductor App 20150065643 - KAWABATA; KIICHI ; et al.	2015-03-05
Organosilicon compound, thermosetting resin composition containing the organosilicon compound, hardening resin and encapsulation material for optical semiconductor Grant 8,946,357 - Kawabata , et al. February 3, 2	2015-02-03
Compound Including Organopolysiloxane Or Silsesquioxane Skeleton Having Isocyanuric Skeleton, Epoxy Group And Sih Group, Thermosetting Resin Composition Containing The Compound As Adhesion-imparting Agent, Hardened Material And Sealing Agent For Optical Semiconductor App 20140148536 - Kawabata; Kiichi ; et al.	2014-05-29
New Organosilicon Compound, Thermosetting Resin Composition Containing The Organosilicon Compound, Hardening Resin And Encapsulation Material For Optical Semiconductor App 20130096249 - Kawabata; Kiichi ; et al.	2013-04-18
Polyurethane coating resin composition Grant 5,952,444 - Ayama September 14, 1	1999-09-14
Fluorine-containing siloxane compound and process for production thereof Grant 5,831,110 - Isoda , et al. November 3, 1	1998-11-03
New polysilazane and process for production of the same Grant 4,937,304 - Ayama , et al. June 26, 1	1990-06-26

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