Aya; Toshihiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Aya; Toshihiko.The latest application filed is for "thermoplastic aromatic polyamideimide copolymer from polyamide diamine".
- Aya; Toshihiko - Nagoya JP
- Aya; Toshihiko - Otsu Shiga JA
| Patent | Date |
|---|---|
| Thermoplastic aromatic polyamideimide copolymer from polyamide diamine Grant 4,831,104 - Aya , et al. May 16, 1 | 1989-05-16 |
| Heat resistant molding resin composition Grant 4,340,697 - Aya , et al. July 20, 1 | 1982-07-20 |
| Multi-component fiber, the method for making said and polyurethane matrix sheets formed from said Grant 4,008,344 - Okamoto , et al. February 15, 1 | 1977-02-15 |
| Chelating resin and process for preparing the same Grant 3,899,472 - Aya , et al. August 12, 1 | 1975-08-12 |
| Thermoplastic Resin Composition Containing An Ethylene-vinyl Acetate Graft Copolymer Grant 3,742,090 - Kiuchi , et al. June 26, 1 | 1973-06-26 |
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