Awata; Hideaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Awata; Hideaki.The latest application filed is for "oxide sintered material, method of producing oxide sintered material, sputtering target, and method of producing semiconductor d".

Company Profile

10.11.21

Awata; Hideaki - Itami JP
AWATA; Hideaki - Itami-shi JP
AWATA; Hideaki - Osaka-shi JP
- Itami JP
Awata; Hideaki - Hyogo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method for manufacturing the same Grant 11,024,744 - Miyanaga , et al. June 1, 2	2021-06-01
Oxide sintered material and method for manufacturing the same, sputtering target, and method for manufacturing semiconductor device Grant 10,894,744 - Miyanaga , et al. January 19, 2	2021-01-19
Oxide sintered material and method of manufacturing the same, sputtering target, and method of manufacturing semiconductor device Grant 10,822,276 - Watatani , et al. November 3, 2	2020-11-03
Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor device Grant 10,811,238 - Miyanaga , et al. October 20, 2	2020-10-20
Oxide Sintered Material, Method of Producing Oxide Sintered Material, Sputtering Target, and Method of Producing Semiconductor D App 20200232085 - MIYANAGA; Miki ; et al.	2020-07-23
Oxide Sintered Material, Method of Producing Oxide Sintered Material, Sputtering Target, and Method of Producing Semiconductor D App 20200235242 - MIYANAGA; Miki ; et al.	2020-07-23
Oxide sintered material, method of producing oxide sintered material, sputtering target, and method of producing semiconductor device Grant 10,655,213 - Miyanaga , et al.	2020-05-19
Oxide Sintered Material And Method Of Manufacturing The Same, Sputtering Target, Oxide Semiconductor Film, And Method Of Manufac App 20200126790 - MIYANAGA; Miki ; et al.	2020-04-23
Oxide Sintered Material And Method For Manufacturing The Same, Sputtering Target, And Method For Manufacturing Semiconductor Dev App 20200062651 - MIYANAGA; Miki ; et al.	2020-02-27
Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor device Grant 10,475,631 - Miyanaga , et al. Nov	2019-11-12
Semiconductor Device and Method for Manufacturing the Same App 20190319132 - MIYANAGA; Miki ; et al.	2019-10-17
Oxide Sintered Material And Method Of Manufacturing The Same, Sputtering Target, And Method Of Manufacturing Semiconductor Devic App 20190292103 - Watatani; Kenichi ; et al.	2019-09-26
Oxide Sintered Body And Method For Manufacturing The Same, Sputtering Target, And Semiconductor Device App 20190259588 - Miyanaga; Miki ; et al.	2019-08-22
Aqueous Solution Composition and Method for Manufacturing the Same, Oxide Powder and Method for Manufacturing the Same, Carbide App 20190194784 - Onoki; Takamasa ; et al.	2019-06-27
Semiconductor Device And Method For Manufacturing Same App 20190140104 - Miyanaga; Miki ; et al.	2019-05-09
Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor device Grant 10262844 -	2019-04-16
Oxide semiconductor film including indium, tungsten and zinc and thin film transistor device Grant 10,192,994 - Miyanaga , et al. Ja	2019-01-29
Oxide sintered body and semiconductor device Grant 10,087,517 - Miyanaga , et al. October 2, 2	2018-10-02
Oxide Sintered Material, Method Of Producing Oxide Sintered Material, Sputtering Target, And Method Of Producing Semiconductor Device App 20180023188 - Miyanaga; Miki ; et al.	2018-01-25
Semiconductor Device And Method For Manufacturing The Same App 20170222058 - Miyanaga; Miki ; et al.	2017-08-03
AlN SINTERED COMPACT, AlN SUBSTRATE AND METHOD OF PRODUCING AlN SUBSTRATE App 20170152425 - Awata; Hideaki ; et al.	2017-06-01
Oxide Sintered Body And Method For Manufacturing The Same, Sputtering Target, And Semiconductor Device App 20170069474 - Miyanaga; Miki ; et al.	2017-03-09
Oxide Sintered Body And Semiconductor Device App 20170029933 - Miyanaga; Miki ; et al.	2017-02-02
Oxide Semiconductor Film And Semiconductor Device App 20170012133 - Miyanaga; Miki ; et al.	2017-01-12
Oxide Sintered Body And Method For Manufacturing The Same, Sputtering Target, And Semiconductor Device App 20160251264 - Miyanaga; Miki ; et al.	2016-09-01
Battery Grant 8,142,923 - Emura , et al. March 27, 2	2012-03-27
Coating layer thickness measurement mechanism and coating layer forming apparatus using the same Grant 7,946,247 - Awata , et al. May 24, 2	2011-05-24
Feeding Mechanism For Continuous Processing Of Elongate Base Material, Processing Apparatus And Thin Film Forming Apparatus Using The Same, And Elongate Member Produced Thereby App 20110095121 - AWATA; Hideaki ; et al.	2011-04-28
Method of operating vacuum deposition apparatus and vacuum deposition apparatus Grant 7,871,667 - Awata , et al. January 18, 2	2011-01-18
Battery App 20100028775 - Emura; Katsuji ; et al.	2010-02-04
Feeding mechanism for continuous processing of elongate base material, processing apparatus and thin film forming apparatus using the same, and elongate member produced thereby App 20080083506 - Awata; Hideaki ; et al.	2008-04-10
Coating layer thickness measurement mechanism and coating layer forming apparatus using the same App 20070261638 - Awata; Hideaki ; et al.	2007-11-15
Method of operating vacuum deposition apparatus and vacuum deposition apparatus App 20070110892 - Awata; Hideaki ; et al.	2007-05-17

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