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name:-0.037730932235718
name:-0.0031619071960449
name:-0.015381813049316
AWANE; Ryo Patent Filings

AWANE; Ryo

Patent Applications and Registrations

Patent applications and USPTO patent grants for AWANE; Ryo.The latest application filed is for "separation and bonding method for adherend".

Company Profile
3.0.5
  • AWANE; Ryo - Ibaraki-shi Osaka
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Separation And Bonding Method For Adherend
App 20220112410 - AWANE; Ryo ;   et al.
2022-04-14
Separation Method And Bonding Method For Adherend
App 20220032600 - AWANE; Ryo ;   et al.
2022-02-03
Electrical Debonding Type Adhesive Sheet, Joined Body, And Debonding Method For Joined Body
App 20210002516 - AKAMATSU; Kaori ;   et al.
2021-01-07
Electrical Debonding Type Adhesive Sheet, Joined Body, And Joining And Separation Method For Adherend
App 20200406582 - AKAMATSU; Kaori ;   et al.
2020-12-31
Electrically Debondable Adhesive Composition, Adhesive Sheet, And Adhered Body
App 20200002581 - AKAMATSU; Kaori ;   et al.
2020-01-02

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