Aw; Kok Leong William
Patent Applications and Registrations
Patent applications and USPTO patent grants for Aw; Kok Leong William.The latest application filed is for "multiple layer panels having reduced levels of edge defects".
- Aw; Kok Leong William - Singapore SG
| Patent | Date |
|---|---|
| Multiple layer panels having reduced levels of edge defects Grant 10,946,621 - Lu , et al. March 16, 2 | 2021-03-16 |
| Multiple Layer Panels Having Reduced Levels Of Edge Defects App 20180281354 - LU; Jun ; et al. | 2018-10-04 |
| Multiple layer panels having reduced levels of edge defects Grant 9,994,000 - Lu , et al. June 12, 2 | 2018-06-12 |
| Multiple Layer Panels Having Reduced Levels Of Edge Defects App 20150099132 - Lu; Jun ; et al. | 2015-04-09 |
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