Avsian; Osher
Patent Applications and Registrations
Patent applications and USPTO patent grants for Avsian; Osher.The latest application filed is for "stack packages using reconstituted wafers".
- Avsian; Osher - Huntersville NC US
- Avsian; Osher - Kiryat Ono IL
| Patent | Date |
|---|---|
| Optical imaging apparatus and methods of making the same Grant 10,147,750 - Kriman , et al. De | 2018-12-04 |
| Stack Packages Using Reconstituted Wafers App 20140027931 - Avsian; Osher ; et al. | 2014-01-30 |
| Stack packages using reconstituted wafers Grant 8,551,815 - Avsian , et al. October 8, 2 | 2013-10-08 |
| Stacked microelectronic assemblies having vias extending through bond pads Grant 8,466,542 - Kriman , et al. June 18, 2 | 2013-06-18 |
| Optical Imaging Apparatus And Methods Of Making The Same App 20110273600 - Kriman; Moshe ; et al. | 2011-11-10 |
| Stack Packages Using Reconstituted Wafers App 20110248410 - Avsian; Osher ; et al. | 2011-10-13 |
| Wafer level chip packaging Grant 7,936,062 - Humpston , et al. May 3, 2 | 2011-05-03 |
| Stacked Microelectronic Assemblies Having Vias Extending Through Bond Pads App 20100230795 - Kriman; Moshe ; et al. | 2010-09-16 |
| Wafer level chip packaging App 20070190691 - Humpston; Giles ; et al. | 2007-08-16 |
| Wafer level packaging to lidded chips App 20070190747 - Humpston; Giles ; et al. | 2007-08-16 |
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