loadpatents
name:-0.0044400691986084
name:-0.0037190914154053
name:-0.00052380561828613
Aung; Kyaw Oo Patent Filings

Aung; Kyaw Oo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Aung; Kyaw Oo.The latest application filed is for "system for different bond pads in an integrated circuit package".

Company Profile
0.4.3
  • Aung; Kyaw Oo - Singapore N/A SG
  • Aung; Kyaw Oo - Clementi SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Integrated circuit through-substrate via system with a buffer layer and method of manufacture thereof
Grant 9,281,274 - Zhao , et al. March 8, 2
2016-03-08
System for different bond pads in an integrated circuit package
Grant 7,443,039 - Zhao , et al. October 28, 2
2008-10-28
System For Different Bond Pads In An Integrated Circuit Package
App 20060197223 - Zhao; Lun ;   et al.
2006-09-07
Under bump metallurgy in integrated circuits
App 20060160267 - Hur; Hyeong Ryeol ;   et al.
2006-07-20
Method of manufacturing different bond pads on the same substrate of an integrated circuit package
Grant 7,005,370 - Zhao , et al. February 28, 2
2006-02-28
Method Of Manufacturing Different Bond Pads On The Same Substrate Of An Integrated Circuit Package
App 20050253262 - Zhao, Lun ;   et al.
2005-11-17

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