| Patent | Date |
|---|
Magnetic coils in locally thinned silicon bridges and methods of assembling same
Grant 11,456,116 - Augustin , et al. September 27, 2 | 2022-09-27 |
Patch Antennas Stitched To Systems In Packages And Methods Of Assembling Same
App 20220294115 - Augustin; Andreas ; et al. | 2022-09-15 |
Patch antennas stitched to systems in packages and methods of assembling same
Grant 11,374,323 - Augustin , et al. June 28, 2 | 2022-06-28 |
Semiconductor inductors
Grant 11,127,813 - Seidemann , et al. September 21, 2 | 2021-09-21 |
Antenna With Graded Dielectirc And Method Of Making The Same
App 20210273342 - Maruthamuthu; Saravana ; et al. | 2021-09-02 |
Under Sleeper Pad
App 20210212491 - AUGUSTIN; Andreas | 2021-07-15 |
Antenna with graded dielectirc and method of making the same
Grant 11,031,699 - Maruthamuthu , et al. June 8, 2 | 2021-06-08 |
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory
Grant 11,018,114 - Waidhas , et al. May 25, 2 | 2021-05-25 |
Resonant Lc Tank Package And Method Of Manufacture
App 20210104359 - Maruthamuthu; Saravana ; et al. | 2021-04-08 |
Resonant LC tank package and method of manufacture
Grant 10,896,780 - Maruthamuthu , et al. January 19, 2 | 2021-01-19 |
Component magnetic shielding for microelectronic devices
Grant 10,867,934 - Maruthamuthu , et al. December 15, 2 | 2020-12-15 |
Single Metal Cavity Antenna In Package Connected To An Integrated Transceiver Front-end
App 20200373259 - KOLLER; Sonja ; et al. | 2020-11-26 |
Package Integrated Cavity Resonator Antenna
App 20200365996 - ROTH; Kilian ; et al. | 2020-11-19 |
Semiconductor Packages, and Methods for Forming Semiconductor Packages
App 20200227388 - Waidhas; Bernd ; et al. | 2020-07-16 |
Semiconductor Inductors
App 20200185490 - Seidemann; Georg ; et al. | 2020-06-11 |
Patch Antennas Stitched To Systems In Packages And Methods Of Assembling Same
App 20200144723 - Augustin; Andreas ; et al. | 2020-05-07 |
Magnetic Coils In Locally Thinned Silicon Bridges And Methods Of Assembling Same
App 20200111607 - Augustin; Andreas ; et al. | 2020-04-09 |
Sleeper pad
Grant 10,597,826 - Augustin , et al. | 2020-03-24 |
Techniques for data compression
Grant 10,560,125 - Talwar , et al. Feb | 2020-02-11 |
Through-silicon Via Pillars For Connecting Dice And Methods Of Assembling Same
App 20200006272 - Augustin; Andreas ; et al. | 2020-01-02 |
Monolithic Silicon Bridge Stack Including A Hybrid Baseband Die Supporting Processors And Memory
App 20190341371 - Waidhas; Bernd ; et al. | 2019-11-07 |
Component Magnetic Shielding For Microelectronic Devices
App 20190304922 - Maruthamuthu; Saravana ; et al. | 2019-10-03 |
Resonant Lc Tank Package And Method Of Manufacture
App 20190272950 - Maruthamuthu; Saravana ; et al. | 2019-09-05 |
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory
Grant 10,403,602 - Waidhas , et al. Sep | 2019-09-03 |
Antenna With Graded Dielectirc And Method Of Making The Same
App 20190252792 - Maruthamuthu; Saravana ; et al. | 2019-08-15 |
Techniques For Data Compression
App 20190238163 - Talwar; Shilpa ; et al. | 2019-08-01 |
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
Grant 10,301,176 - Ofner , et al. | 2019-05-28 |
Monolithic Silicon Bridge Stack Including A Hybrid Baseband Die Supporting Processors And Memory
App 20190006318 - Waidhas; Bernd ; et al. | 2019-01-03 |
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
Grant 10,150,668 - Ofner , et al. Dec | 2018-12-11 |
Wireless in-chip and chip to chip communication
Grant 10,122,420 - Meyer , et al. November 6, 2 | 2018-11-06 |
Microelectromechanical System (mems) On Application Specific Integrated Circuit (asic)
App 20180186627 - Ofner; Gerald ; et al. | 2018-07-05 |
Sleeper Pad
App 20180127922 - AUGUSTIN; Andreas ; et al. | 2018-05-10 |
Chip arrangement and method for manufacturing a chip arrangement
Grant 9,856,136 - Meyer , et al. January 2, 2 | 2018-01-02 |
Microelectromechanical System (mems) On Application Specific Integrated Circuit (asic)
App 20170217766 - Ofner; Gerald ; et al. | 2017-08-03 |
Wireless In-chip And Chip To Chip Communication
App 20170180014 - Meyer; Thorsten ; et al. | 2017-06-22 |
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
Grant 9,663,353 - Ofner , et al. May 30, 2 | 2017-05-30 |
Stress buffer layer for integrated microelectromechanical systems (MEMS)
Grant 9,550,670 - Geissler , et al. January 24, 2 | 2017-01-24 |
Microelectromechanical System (mems) On Application Specific Integrated Circuit (asic)
App 20160200566 - Ofner; Gerald ; et al. | 2016-07-14 |
Stress Buffer Layer For Integrated Microelectromechanical Systems (mems)
App 20150266728 - Geissler; Christian ; et al. | 2015-09-24 |
Stress buffer layer for integrated microelectromechanical systems (MEMS)
Grant 9,056,763 - Geissler , et al. June 16, 2 | 2015-06-16 |
Stress Buffer Layer For Integrated Microelectromechanical Systems (mems)
App 20150091167 - Geissler; Christian ; et al. | 2015-04-02 |
Chip Arrangement And Method For Manufacturing A Chip Arrangement
App 20140361387 - Meyer; Thorsten ; et al. | 2014-12-11 |
Chip arrangements
Grant 8,907,480 - Meyer , et al. December 9, 2 | 2014-12-09 |
Chip Arrangements
App 20140264832 - Meyer; Thorsten ; et al. | 2014-09-18 |
Semiconductor Devices
App 20140252632 - Barth; Hans-Joachim ; et al. | 2014-09-11 |
High Voltage Dual Gate Cmos Switching Device And Method
App 20080180160 - Augustin; Andreas | 2008-07-31 |
Recording and/or reproducing apparatus with mechanism for damping vibrations of a component part which cooperates with a record carrier in the form of a tape
Grant 6,624,974 - Haupt , et al. September 23, 2 | 2003-09-23 |
Zero mask MIMcap process for a low k BEOL
App 20020155676 - Stetter, Michael ; et al. | 2002-10-24 |
Recording and/or reproducing apparatus having means for damping vibrations of a component part which cooperates with a record carrier in the form of a tape
App 20010026420 - Haupt, Martin ; et al. | 2001-10-04 |
| 