August; Melvin C.
Patent Applications and Registrations
Patent applications and USPTO patent grants for August; Melvin C..The latest application filed is for "method of fabricating metallized chip carries from wafer-shaped substrates".
- August; Melvin C. - Chippewa Falls WI
| Patent | Date |
|---|---|
| Method of fabricating metallized chip carries from wafer-shaped substrates Grant 5,358,826 - Steitz , et al. October 25, 1 | 1994-10-25 |
| Integrated circuit chip carrier lid Grant 5,258,576 - Neumann , et al. November 2, 1 | 1993-11-02 |
| Metallized connector block Grant 5,211,567 - Neumann , et al. May 18, 1 | 1993-05-18 |
| Non-metallized chip carrier Grant H1,153 - August , et al. March 2, 1 | 1993-03-02 |
| High power, high density interconnect apparatus for integrated circuits Grant 5,185,502 - Shepherd , et al. February 9, 1 | 1993-02-09 |
| Method of fabricating metallized chip carriers from wafer-shaped substrates Grant 5,182,420 - Steitz , et al. January 26, 1 | 1993-01-26 |
| Shielded connector block Grant 5,178,549 - Neumann , et al. January 12, 1 | 1993-01-12 |
| Computer signal interconnect apparatus Grant 5,144,691 - August , et al. September 1, 1 | 1992-09-01 |
| Quick disconnect system for circuit board modules Grant 5,131,859 - Bowen , et al. July 21, 1 | 1992-07-21 |
| Flexible automated bonding method and apparatus Grant 5,127,570 - Steitz , et al. July 7, 1 | 1992-07-07 |
| High power, high density interconnect method and apparatus for integrated circuits Grant 5,127,986 - August , et al. July 7, 1 | 1992-07-07 |
| Computer signal interconnect apparatus Grant 5,123,848 - August , et al. June 23, 1 | 1992-06-23 |
| Two-piece edge ZIF connector with sliding block Grant 4,984,993 - Neumann , et al. January 15, 1 | 1991-01-15 |
| Method of making a chip carrier with terminating resistive elements Grant 4,949,453 - Neumann , et al. August 21, 1 | 1990-08-21 |
| Cooling plate with interboard connector apertures for circuit board assemblies Grant 4,884,168 - August , et al. November 28, 1 | 1989-11-28 |
| Circuit module with enhanced heat transfer and distribution Grant 4,628,407 - August , et al. December 9, 1 | 1986-12-09 |
| Circuit module with enhanced heat transfer and distribution Grant 4,535,385 - August , et al. August 13, 1 | 1985-08-13 |
| Interconnected multiple circuit module Grant 4,514,784 - Williams , et al. April 30, 1 | 1985-04-30 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 