AUBRY; Pascal

Patent Applications and Registrations

Patent applications and USPTO patent grants for AUBRY; Pascal.The latest application filed is for "protection of wire-bond ball grid array packaged integrated circuit chips".

Company Profile

0.2.9

AUBRY; Pascal - Cheseaux-sur-Lausanne CH
AUBRY; Pascal - Paris FR
Aubry; Pascal - Cormondreche CH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Protection Of Wire-bond Ball Grid Array Packaged Integrated Circuit Chips App 20210358837 - AUBRY; Pascal ; et al.	2021-11-18
Process For The Manufacture Of An Optimised Steel Material App 20210138543 - MASKROT; Hicham ; et al.	2021-05-13
Optimized Steel Material App 20210140022 - Chniouel; Aziz ; et al.	2021-05-13
Process For The Treatment Of An Optimised Steel Material App 20210138544 - CHNIOUEL; Aziz ; et al.	2021-05-13
Part Comprising An Optimized Steel Material And Its Manufacturing Process App 20210140025 - HERCHER; Olivier ; et al.	2021-05-13
Integrated Circuit Device App 20190148313 - JULLIAN; Stephane ; et al.	2019-05-16
Integrated circuit chip protection against physical and/or electrical alterations Grant 10,135,239 - Aubry , et al. November 20, 2	2018-11-20
Integrated Circuit Chip Protection Against Physical And/or Electrical Alterations App 20180102643 - AUBRY; Pascal ; et al.	2018-04-12
Method for the Anti-Corrosion Processing of a Part by Deposition of a Zirconium and/or Zirconium Alloy Layer App 20110097504 - David; Thierry ; et al.	2011-04-28
Welding unit with miniaturized laser beam Grant 7,038,161 - Aubry , et al. May 2, 2	2006-05-02
Welding unit with miniaturised laser beam App 20040238504 - Aubry, Pascal ; et al.	2004-12-02

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