Au; Yuk Cheung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Au; Yuk Cheung.The latest application filed is for "die bonding apparatus comprising an inert gas environment".
- Au; Yuk Cheung - Kwai Chung HK
- Au, Yuk Cheung - Hong Kong HK
- Au, Yuk Cheung - Kowloon HK
| Patent | Date |
|---|---|
| Die bonding apparatus comprising an inert gas environment Grant 10,475,763 - Lau , et al. Nov | 2019-11-12 |
| Die Bonding Apparatus Comprising An Inert Gas Environment App 20160351527 - LAU; Siu Wing ; et al. | 2016-12-01 |
| Fluid Dispenser With Self-aligning Nozzle App 20150251195 - LIAO; Dazhang ; et al. | 2015-09-10 |
| Universal die detachment apparatus Grant 8,470,130 - Chong , et al. June 25, 2 | 2013-06-25 |
| Device for thin die detachment and pick-up Grant 8,141,612 - Chan , et al. March 27, 2 | 2012-03-27 |
| Universal Die Detachment Apparatus App 20110088845 - CHONG; Chi Ming ; et al. | 2011-04-21 |
| Device For Thin Die Detachment And Pick-up App 20100252205 - CHAN; Man Wai ; et al. | 2010-10-07 |
| Apparatus for generating amplified cooling air flows Grant 7,667,355 - Au , et al. February 23, 2 | 2010-02-23 |
| Apparatus For Generating Amplified Cooling Air Flows App 20090195088 - AU; Yuk Cheung ; et al. | 2009-08-06 |
| Apparatus and method for alignment of a bonding tool Grant 7,240,711 - Chan , et al. July 10, 2 | 2007-07-10 |
| Apparatus and method for alignment of a bonding tool App 20050155712 - Chan, Lai Wa Helen ; et al. | 2005-07-21 |
| Apparatus and method for indexing and severing film App 20050034577 - Au, Yuk Cheung ; et al. | 2005-02-17 |
| Multi-pin epoxy writing apparatus App 20030044534 - Lau, Siu Wing ; et al. | 2003-03-06 |
| Fluid dispensing apparatus Grant 6,367,669 - Au , et al. April 9, 2 | 2002-04-09 |
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