Au; Ching

Patent Applications and Registrations

Patent applications and USPTO patent grants for Au; Ching.The latest application filed is for "apparatus and method for modifying an electrical circuit".

Company Profile

1.11.7

Au; Ching - Garden City NY
Au; Ching - Port Washington NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and method for modifying an electrical circuit Grant 11,411,339 - Peng , et al. August 9, 2	2022-08-09
Apparatus And Method For Modifying An Electrical Circuit App 20210305744 - Peng; David ; et al.	2021-09-30
Method Of Joining A Surface-mount Component To A Substrate With Solder That Has Been Temporarily Secured App 20210082868 - Conte; Robert ; et al.	2021-03-18
Method of joining a surface-mount component to a substrate with solder that has been temporarily secured Grant 10,879,211 - Conte , et al. December 29, 2	2020-12-29
Method Of Joining A Surface-mount Component To A Substrate With Solder That Has Been Temporarily Secured App 20180082975 - Conte; Robert ; et al.	2018-03-22
Surface mount device Grant D803,796 - Au , et al. November 28, 2	2017-11-28
Surface mount device Grant D803,795 - Au , et al. November 28, 2	2017-11-28
Surface mount device Grant D803,798 - Au , et al. November 28, 2	2017-11-28
Surface mount device Grant D803,797 - Au , et al. November 28, 2	2017-11-28
Light emitting diode (LED) assembly and flexible circuit board with improved thermal conductivity Grant 9,648,750 - Au May 9, 2	2017-05-09
Multilayer substrate and method for manufacturing the same Grant 9,558,859 - Au , et al. January 31, 2	2017-01-31
Low cost high strength surface mount package Grant 9,392,713 - Au , et al. July 12, 2	2016-07-12
Low Cost High Strength Surface Mount Package App 20160113138 - Au; Ching ; et al.	2016-04-21
Light Emitting Diode (led) Assembly And Flexible Circuit Board With Improved Thermal Conductivity App 20160095200 - Au; Ching	2016-03-31
Multilayer Substrate And Method For Manufacturing The Same App 20150237724 - Au; Ching ; et al.	2015-08-20
Liquid barrier and method for making a liquid barrier Grant 8,734,657 - Au , et al. May 27, 2	2014-05-27
Liquid Barrier And Method For Making A Liquid Barrier App 20110206912 - Au; Ching ; et al.	2011-08-25

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