Patent | Date |
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Semiconductor device and method of forming SIP module over film layer Grant 11309193 - | 2022-04-19 |
Feed-forward current compensation for CMOS signal path Grant 11296687 - | 2022-04-05 |
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units Grant 11024561 - | 2021-06-01 |
Semiconductor device and method of using a standardized carrier in semiconductor packaging Grant 11011423 - | 2021-05-18 |
Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die Grant 10998248 - | 2021-05-04 |
Composition and method for making converter-dissolver composition for dissolving metal sulfate scales from surfaces Grant 10982129 - | 2021-04-20 |
Shielded semiconductor packages with open terminals and methods of making via two-step process Grant 10985109 - | 2021-04-20 |
Spare tire carrier Grant 10974777 - | 2021-04-13 |
Signal detection for GPON optical line terminal Grant 10972815 - | 2021-04-06 |
Molded laser package with electromagnetic interference shield and method of making Grant 10937741 - | 2021-03-02 |
Configurable laser monitor photodiode in optical modulation amplitude controller Grant 10914627 - | 2021-02-09 |
Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more EWLB packages per wafer with encapsulant deposited under temperature and pressure Grant 10916482 - | 2021-02-09 |
Box target Grant 10907941 - | 2021-02-02 |
Shielded semiconductor package with open terminal and methods of making Grant 10910322 - | 2021-02-02 |
Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die Grant 10903183 - | 2021-01-26 |
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect Grant RE048408 - | 2021-01-26 |
Semiconductor device and method of forming inductor over insulating material filled trench in substrate Grant 10903304 - | 2021-01-26 |
Effects control module and method of magnetic closure for battery door Grant 10892450 - | 2021-01-12 |
Side-solderable leadless package Grant 10892211 - | 2021-01-12 |
Signal detector for GPON optical line terminal Grant 10892745 - | 2021-01-12 |
Hole protector device for mechanical, plumbing, and electrical (MPE) systems Grant 10865572 - | 2020-12-15 |
Dynamic time constant for quick decision level acquisition Grant 10862466 - | 2020-12-08 |
Bridge mono-saddle for stringed musical instrument Grant 10818272 - | 2020-10-27 |
Semiconductor devices and methods of making the same Grant 10818495 - | 2020-10-27 |
EMI shielding for flip chip package with exposed die backside Grant 10804217 - | 2020-10-13 |
Method of forming SIP module over film layer Grant 10804119 - | 2020-10-13 |
Semiconductor device and method to minimize stress on stack via Grant 10804153 - | 2020-10-13 |
System-in-package with double-sided molding Grant 10797024 - | 2020-10-06 |
Semiconductor device and method of forming a 3D interposer system-in-package module Grant 10797039 - | 2020-10-06 |
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern Grant 10790158 - | 2020-09-29 |
Feed-forward current compensation for CMOS signal path Grant 10790809 - | 2020-09-29 |
Semiconductor device and method of forming a 3D integrated system-in-package module Grant 10790268 - | 2020-09-29 |
Treatment compound and method of application for hoof or foot disease in animals Grant 10779525 - | 2020-09-22 |
Semiconductor device with partial EMI shielding removal using laser ablation Grant 10784210 - | 2020-09-22 |
Personal augmentation suit and method for assisted human motion Grant 10772785 - | 2020-09-15 |
Semiconductor device and method of forming embedded wafer level chip scale packages Grant 10777528 - | 2020-09-15 |
Passive dynamic biasing for MOSFET cascode Grant 10778207 - | 2020-09-15 |
Automatic gain control for passive optical network Grant 10778170 - | 2020-09-15 |
Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB Grant 10741416 - | 2020-08-11 |
Semiconductor device and method of forming MEMS package Grant 10730745 - | 2020-08-04 |
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units Grant 10707150 - | 2020-07-07 |
Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration Grant 10692836 - | 2020-06-23 |
Method and device for electrical overstress and electrostatic discharge protection Grant 10692854 - | 2020-06-23 |
Digital implementation of closed loop optical modulation amplitude controller for laser diode Grant 10680715 - | 2020-06-09 |
Dimmable universal voltage LED power supply with regenerating power source circuitry and non-isolated load Grant 10681782 - | 2020-06-09 |
Semiconductor device and method of forming microelectromechanical systems (MEMS) package Grant 10662056 - | 2020-05-26 |
Semiconductor device and method of forming substrate including embedded component with symmetrical structure Grant 10665662 - | 2020-05-26 |
Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package Grant 10665534 - | 2020-05-26 |
Lightweight body construction for stringed musical instruments Grant 10657931 - | 2020-05-19 |
Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages Grant 10658330 - | 2020-05-19 |
Semiconductor device and method of forming wafer level ground plane and power ring Grant 10651139 - | 2020-05-12 |
Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die Grant 10643952 - | 2020-05-05 |
Semiconductor device and method of forming protrusion E-bar for 3D SIP Grant 10636756 - | 2020-04-28 |
Antenna in embedded wafer-level ball-grid array package Grant 10636753 - | 2020-04-28 |
System-in-package with double-sided molding Grant 10636765 - | 2020-04-28 |
Semiconductor device and method of forming a 3D integrated system-in-package module Grant 10636774 - | 2020-04-28 |
Semiconductor device and method of fabricating 3D package with short cycle time and high yield Grant 10629531 - | 2020-04-21 |
Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) Grant 10622293 - | 2020-04-14 |
Multiplexed integrating amplifier for loss of signal detection Grant 10608589 - | 2020-03-31 |
Method and device for improved accuracy of proximity and touch detection in mobile devices Grant 10606411 - | 2020-03-31 |
Semiconductor device and method of forming interconnect substrate for FO-WLCSP Grant 10607946 - | 2020-03-31 |
Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps Grant RE047923 - | 2020-03-31 |
Mid-sole cleat Grant D0879443 - | 2020-03-31 |
Firearm mounting system and method thereof Grant 10584935 - | 2020-03-10 |
Schottky device and method of manufacturing the same Grant 10586876 - | 2020-03-10 |
Semiconductor device and method of forming high routing density interconnect sites on substrate Grant 10580749 - | 2020-03-03 |
Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP Grant 10573600 - | 2020-02-25 |
Grinder Grant D0874886 - | 2020-02-11 |
Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation Grant 10553487 - | 2020-02-04 |
Bowling ball launcher Grant 10532261 - | 2020-01-14 |
Firearm and method of forming channels to contain compressible material Grant 10514218 - | 2019-12-24 |
Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP Grant 10515828 - | 2019-12-24 |
Method of packaging thin die and semiconductor device including thin die Grant 10510632 - | 2019-12-17 |
Transient voltage suppression diodes with reduced harmonics, and methods of making and using Grant 10510741 - | 2019-12-17 |
Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package Grant 10510703 - | 2019-12-17 |
Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing Grant 10504845 - | 2019-12-10 |
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Grant 10475779 - | 2019-11-12 |
Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same Grant 10468384 - | 2019-11-05 |
Semiconductor device and method of forming double-sided fan-out wafer level package Grant 10453785 - | 2019-10-22 |
System and method of bidirectional compliant joint torque actuation Grant 10449105 - | 2019-10-22 |
Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP) Grant 10446459 - | 2019-10-15 |
Public speaking trainer with 3-D simulation and real-time feedback Grant 10446055 - | 2019-10-15 |
Semiconductor device and method of forming a PoP device with embedded vertical interconnect units Grant 10446479 - | 2019-10-15 |
Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP Grant 10446523 - | 2019-10-15 |
Semiconductor device and method of forming dual fan-out semiconductor package Grant 10418298 - | 2019-09-17 |
Semiconductor device and method of forming partition fence and shielding layer around semiconductor components Grant 10418332 - | 2019-09-17 |
Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant Grant 10418341 - | 2019-09-17 |
Single-shot encapsulation Grant 10410988 - | 2019-09-10 |
Semiconductor device and method of forming electrical interconnect with stress relief void Grant RE047600 - | 2019-09-10 |
Wall panels, barrier wall constructed from same, and methods of making both Grant 10400402 - | 2019-09-03 |
System and method for connecting and controlling musical related instruments over communication network Grant 10403252 - | 2019-09-03 |
Method and device for capacitive near-field communication in mobile devices Grant 10396855 - | 2019-08-27 |
Semiconductor device and method of forming Fo-WLCSP with recessed interconnect area in peripheral region of semiconductor die Grant 10388584 - | 2019-08-20 |
Semiconductor device and method of forming magnetic field shielding with ferromagnetic material Grant 10388611 - | 2019-08-20 |
Semiconductor device and method of forming a 3D interposer system-in-package module Grant 10388637 - | 2019-08-20 |
Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits Grant 10388612 - | 2019-08-20 |
Semiconductor device and method of forming flipchip interconnect structure Grant 10388626 - | 2019-08-20 |
Current-based feedback control for voltage regulators Grant 10345837 - | 2019-07-09 |
Method and device for reducing radio frequency interference of proximity and touch detection in mobile devices Grant 10345963 - | 2019-07-09 |
Dummy conductive structures for EMI shielding Grant 10319684 - | 2019-06-11 |
Survival platform Grant 10308331 - | 2019-06-04 |
Semiconductor device and method of forming build-up interconnect structures over a temporary substrate Grant 10304817 - | 2019-05-28 |
Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package Grant 10297518 - | 2019-05-21 |
Semiconductor device and method of forming PoP semiconductor device with RDL over top package Grant 10297519 - | 2019-05-21 |
Semiconductor device and method of controlling warpage in reconstituted wafer Grant 10297556 - | 2019-05-21 |
Method and device for improved accuracy of proximity and touch detection in mobile devices Grant 10282028 - | 2019-05-07 |
Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package Grant 10242948 - | 2019-03-26 |
Semiconductor device and method of making embedded wafer level chip scale packages Grant 10242887 - | 2019-03-26 |
Semiconductor device and method of forming substrate including embedded component with symmetrical structure Grant 10236337 - | 2019-03-19 |
Wall panels, barrier wall constructed from same, and methods of making both Grant 10221529 - | 2019-03-05 |
Semiconductor device and method of forming an embedded SoP fan-out package Grant 10217702 - | 2019-02-26 |
Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus Grant 10217873 - | 2019-02-26 |
Antenna in embedded wafer-level ball-grid array package Grant 10211171 - | 2019-02-19 |
Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels Grant 10211183 - | 2019-02-19 |
Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation Grant 10204866 - | 2019-02-12 |
Semiconductor device and method of forming wafer-level interconnect structures with advanced dielectric characteristics Grant 10204879 - | 2019-02-12 |
Semiconductor device and method of forming microelectromechanical systems (MEMS) package Grant 10189702 - | 2019-01-29 |
Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound Grant 10192801 - | 2019-01-29 |
Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP Grant 10192796 - | 2019-01-29 |
Semiconductor device and method of using a standardized carrier in semiconductor packaging Grant 10181423 - | 2019-01-15 |
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern Grant 10177010 - | 2019-01-08 |
Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP Grant 10170385 - | 2019-01-01 |
Semiconductor package and method of forming similar structure for top and bottom bonding pads Grant 08921983 - | 2014-12-30 |
Digital controlled oscillator and method thereof Grant 5,495,205 - Parker , et al. February 27, 1 | 1996-02-27 |