atkins robert d

Patent Applications and Registrations

Patent applications and USPTO patent grants for atkins robert d.The latest application filed is for "digital controlled oscillator and method thereof".

Company Profile

123.1.0

- unknown
Atkins; Robert D. - Schaumburg IL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming SIP module over film layer Grant 11309193 -	2022-04-19
Feed-forward current compensation for CMOS signal path Grant 11296687 -	2022-04-05
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units Grant 11024561 -	2021-06-01
Semiconductor device and method of using a standardized carrier in semiconductor packaging Grant 11011423 -	2021-05-18
Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die Grant 10998248 -	2021-05-04
Composition and method for making converter-dissolver composition for dissolving metal sulfate scales from surfaces Grant 10982129 -	2021-04-20
Shielded semiconductor packages with open terminals and methods of making via two-step process Grant 10985109 -	2021-04-20
Spare tire carrier Grant 10974777 -	2021-04-13
Signal detection for GPON optical line terminal Grant 10972815 -	2021-04-06
Molded laser package with electromagnetic interference shield and method of making Grant 10937741 -	2021-03-02
Configurable laser monitor photodiode in optical modulation amplitude controller Grant 10914627 -	2021-02-09
Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more EWLB packages per wafer with encapsulant deposited under temperature and pressure Grant 10916482 -	2021-02-09
Box target Grant 10907941 -	2021-02-02
Shielded semiconductor package with open terminal and methods of making Grant 10910322 -	2021-02-02
Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die Grant 10903183 -	2021-01-26
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect Grant RE048408 -	2021-01-26
Semiconductor device and method of forming inductor over insulating material filled trench in substrate Grant 10903304 -	2021-01-26
Effects control module and method of magnetic closure for battery door Grant 10892450 -	2021-01-12
Side-solderable leadless package Grant 10892211 -	2021-01-12
Signal detector for GPON optical line terminal Grant 10892745 -	2021-01-12
Hole protector device for mechanical, plumbing, and electrical (MPE) systems Grant 10865572 -	2020-12-15
Dynamic time constant for quick decision level acquisition Grant 10862466 -	2020-12-08
Bridge mono-saddle for stringed musical instrument Grant 10818272 -	2020-10-27
Semiconductor devices and methods of making the same Grant 10818495 -	2020-10-27
EMI shielding for flip chip package with exposed die backside Grant 10804217 -	2020-10-13
Method of forming SIP module over film layer Grant 10804119 -	2020-10-13
Semiconductor device and method to minimize stress on stack via Grant 10804153 -	2020-10-13
System-in-package with double-sided molding Grant 10797024 -	2020-10-06
Semiconductor device and method of forming a 3D interposer system-in-package module Grant 10797039 -	2020-10-06
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern Grant 10790158 -	2020-09-29
Feed-forward current compensation for CMOS signal path Grant 10790809 -	2020-09-29
Semiconductor device and method of forming a 3D integrated system-in-package module Grant 10790268 -	2020-09-29
Treatment compound and method of application for hoof or foot disease in animals Grant 10779525 -	2020-09-22
Semiconductor device with partial EMI shielding removal using laser ablation Grant 10784210 -	2020-09-22
Personal augmentation suit and method for assisted human motion Grant 10772785 -	2020-09-15
Semiconductor device and method of forming embedded wafer level chip scale packages Grant 10777528 -	2020-09-15
Passive dynamic biasing for MOSFET cascode Grant 10778207 -	2020-09-15
Automatic gain control for passive optical network Grant 10778170 -	2020-09-15
Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB Grant 10741416 -	2020-08-11
Semiconductor device and method of forming MEMS package Grant 10730745 -	2020-08-04
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units Grant 10707150 -	2020-07-07
Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration Grant 10692836 -	2020-06-23
Method and device for electrical overstress and electrostatic discharge protection Grant 10692854 -	2020-06-23
Digital implementation of closed loop optical modulation amplitude controller for laser diode Grant 10680715 -	2020-06-09
Dimmable universal voltage LED power supply with regenerating power source circuitry and non-isolated load Grant 10681782 -	2020-06-09
Semiconductor device and method of forming microelectromechanical systems (MEMS) package Grant 10662056 -	2020-05-26
Semiconductor device and method of forming substrate including embedded component with symmetrical structure Grant 10665662 -	2020-05-26
Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package Grant 10665534 -	2020-05-26
Lightweight body construction for stringed musical instruments Grant 10657931 -	2020-05-19
Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages Grant 10658330 -	2020-05-19
Semiconductor device and method of forming wafer level ground plane and power ring Grant 10651139 -	2020-05-12
Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die Grant 10643952 -	2020-05-05
Semiconductor device and method of forming protrusion E-bar for 3D SIP Grant 10636756 -	2020-04-28
Antenna in embedded wafer-level ball-grid array package Grant 10636753 -	2020-04-28
System-in-package with double-sided molding Grant 10636765 -	2020-04-28
Semiconductor device and method of forming a 3D integrated system-in-package module Grant 10636774 -	2020-04-28
Semiconductor device and method of fabricating 3D package with short cycle time and high yield Grant 10629531 -	2020-04-21
Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) Grant 10622293 -	2020-04-14
Multiplexed integrating amplifier for loss of signal detection Grant 10608589 -	2020-03-31
Method and device for improved accuracy of proximity and touch detection in mobile devices Grant 10606411 -	2020-03-31
Semiconductor device and method of forming interconnect substrate for FO-WLCSP Grant 10607946 -	2020-03-31
Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps Grant RE047923 -	2020-03-31
Mid-sole cleat Grant D0879443 -	2020-03-31
Firearm mounting system and method thereof Grant 10584935 -	2020-03-10
Schottky device and method of manufacturing the same Grant 10586876 -	2020-03-10
Semiconductor device and method of forming high routing density interconnect sites on substrate Grant 10580749 -	2020-03-03
Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP Grant 10573600 -	2020-02-25
Grinder Grant D0874886 -	2020-02-11
Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation Grant 10553487 -	2020-02-04
Bowling ball launcher Grant 10532261 -	2020-01-14
Firearm and method of forming channels to contain compressible material Grant 10514218 -	2019-12-24
Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP Grant 10515828 -	2019-12-24
Method of packaging thin die and semiconductor device including thin die Grant 10510632 -	2019-12-17
Transient voltage suppression diodes with reduced harmonics, and methods of making and using Grant 10510741 -	2019-12-17
Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package Grant 10510703 -	2019-12-17
Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing Grant 10504845 -	2019-12-10
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Grant 10475779 -	2019-11-12
Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same Grant 10468384 -	2019-11-05
Semiconductor device and method of forming double-sided fan-out wafer level package Grant 10453785 -	2019-10-22
System and method of bidirectional compliant joint torque actuation Grant 10449105 -	2019-10-22
Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP) Grant 10446459 -	2019-10-15
Public speaking trainer with 3-D simulation and real-time feedback Grant 10446055 -	2019-10-15
Semiconductor device and method of forming a PoP device with embedded vertical interconnect units Grant 10446479 -	2019-10-15
Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP Grant 10446523 -	2019-10-15
Semiconductor device and method of forming dual fan-out semiconductor package Grant 10418298 -	2019-09-17
Semiconductor device and method of forming partition fence and shielding layer around semiconductor components Grant 10418332 -	2019-09-17
Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant Grant 10418341 -	2019-09-17
Single-shot encapsulation Grant 10410988 -	2019-09-10
Semiconductor device and method of forming electrical interconnect with stress relief void Grant RE047600 -	2019-09-10
Wall panels, barrier wall constructed from same, and methods of making both Grant 10400402 -	2019-09-03
System and method for connecting and controlling musical related instruments over communication network Grant 10403252 -	2019-09-03
Method and device for capacitive near-field communication in mobile devices Grant 10396855 -	2019-08-27
Semiconductor device and method of forming Fo-WLCSP with recessed interconnect area in peripheral region of semiconductor die Grant 10388584 -	2019-08-20
Semiconductor device and method of forming magnetic field shielding with ferromagnetic material Grant 10388611 -	2019-08-20
Semiconductor device and method of forming a 3D interposer system-in-package module Grant 10388637 -	2019-08-20
Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits Grant 10388612 -	2019-08-20
Semiconductor device and method of forming flipchip interconnect structure Grant 10388626 -	2019-08-20
Current-based feedback control for voltage regulators Grant 10345837 -	2019-07-09
Method and device for reducing radio frequency interference of proximity and touch detection in mobile devices Grant 10345963 -	2019-07-09
Dummy conductive structures for EMI shielding Grant 10319684 -	2019-06-11
Survival platform Grant 10308331 -	2019-06-04
Semiconductor device and method of forming build-up interconnect structures over a temporary substrate Grant 10304817 -	2019-05-28
Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package Grant 10297518 -	2019-05-21
Semiconductor device and method of forming PoP semiconductor device with RDL over top package Grant 10297519 -	2019-05-21
Semiconductor device and method of controlling warpage in reconstituted wafer Grant 10297556 -	2019-05-21
Method and device for improved accuracy of proximity and touch detection in mobile devices Grant 10282028 -	2019-05-07
Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package Grant 10242948 -	2019-03-26
Semiconductor device and method of making embedded wafer level chip scale packages Grant 10242887 -	2019-03-26
Semiconductor device and method of forming substrate including embedded component with symmetrical structure Grant 10236337 -	2019-03-19
Wall panels, barrier wall constructed from same, and methods of making both Grant 10221529 -	2019-03-05
Semiconductor device and method of forming an embedded SoP fan-out package Grant 10217702 -	2019-02-26
Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus Grant 10217873 -	2019-02-26
Antenna in embedded wafer-level ball-grid array package Grant 10211171 -	2019-02-19
Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels Grant 10211183 -	2019-02-19
Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation Grant 10204866 -	2019-02-12
Semiconductor device and method of forming wafer-level interconnect structures with advanced dielectric characteristics Grant 10204879 -	2019-02-12
Semiconductor device and method of forming microelectromechanical systems (MEMS) package Grant 10189702 -	2019-01-29
Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound Grant 10192801 -	2019-01-29
Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP Grant 10192796 -	2019-01-29
Semiconductor device and method of using a standardized carrier in semiconductor packaging Grant 10181423 -	2019-01-15
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern Grant 10177010 -	2019-01-08
Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP Grant 10170385 -	2019-01-01
Semiconductor package and method of forming similar structure for top and bottom bonding pads Grant 08921983 -	2014-12-30
Digital controlled oscillator and method thereof Grant 5,495,205 - Parker , et al. February 27, 1	1996-02-27