| Patent | Date |
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Component carrier with electrically conductive layer structures having windows defined by a conformal mask and tapering at least partially
Grant 11,452,212 - Tuominen , et al. September 20, 2 | 2022-09-20 |
Method for Allocating Resources to Machines of a Production Facility
App 20220283573 - Zhou; Yuan Fang ; et al. | 2022-09-08 |
Resource Allocation System for Maintaining a Production Facility
App 20220283578 - Reid; Wallace ; et al. | 2022-09-08 |
Semi-Flex Component Carrier With Dielectric Material Surrounding an Embedded Component and Having Locally Reduced Young Modulus
App 20220256686 - Tuominen; Mikael ; et al. | 2022-08-11 |
Component carrier and method of manufacturing the same
Grant 11,343,916 - Tuominen May 24, 2 | 2022-05-24 |
Component carrier with embedded large die
Grant 11,330,706 - Tay , et al. May 10, 2 | 2022-05-10 |
Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus
Grant 11,291,119 - Tuominen , et al. March 29, 2 | 2022-03-29 |
Component Carrier With Blind Hole Filled With An Electrically Conductive Medium And Fulfilling A Minimum Thickness Design Rule
App 20220095457 - Tuominen; Mikael | 2022-03-24 |
Component Carrier With Well-Defined Outline Sidewall Cut by Short Laser Pulse and/or Green Laser
App 20220061162 - Tay; Seok Kim ; et al. | 2022-02-24 |
Semi-Flexible Component Carrier With Stepped Layer Structure
App 20220039259 - Xin; Nick ; et al. | 2022-02-03 |
Stress relief opening for reducing warpage of component carriers
Grant 11,219,120 - Tuominen , et al. January 4, 2 | 2022-01-04 |
Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design rule
Grant 11,219,129 - Tuominen January 4, 2 | 2022-01-04 |
Component Carrier With Improved Bending Performance
App 20210368613 - Xin; Nick ; et al. | 2021-11-25 |
Component carrier having a laser via and method of manufacturing
Grant 11,166,385 - Ling , et al. November 2, 2 | 2021-11-02 |
Component carrier with stabilizing structure for interface adhesion
Grant 11,127,670 - Baftiri September 21, 2 | 2021-09-21 |
Component carrier comprising dielectric structures with different physical properties
Grant 11,116,075 - Liu , et al. September 7, 2 | 2021-09-07 |
Electronic component embedded by laminate sheet
Grant 11,116,083 - Tay , et al. September 7, 2 | 2021-09-07 |
Component Carrier Having Component Covered With Ultra-Thin Transition Layer
App 20210227702 - Tuominen; Mikael ; et al. | 2021-07-22 |
Arrangement With Central Carrier And Two Opposing Layer Stacks, Component Carrier and Manufacturing Method
App 20210202427 - Tuominen; Mikael ; et al. | 2021-07-01 |
Component Carrier With Low Shrinkage Dielectric Material
App 20210202355 - Tuominen; Mikael ; et al. | 2021-07-01 |
Component carriers sandwiching a sacrificial structure and having pure dielectric layers next to the sacrificial structure
Grant 11,051,410 - Tay , et al. June 29, 2 | 2021-06-29 |
Thermally highly conductive coating on base structure accommodating a component
Grant 11,051,391 - Tuominen , et al. June 29, 2 | 2021-06-29 |
Component Carrier and Method of Manufacturing the Same
App 20210185816 - Tuominen; Mikael | 2021-06-17 |
Manufacturing holes in component carrier material
Grant 11,039,535 - Tay , et al. June 15, 2 | 2021-06-15 |
Component Carrier With Embedded Component And Horizontally Elongated Via
App 20210127478 - Feng; Gin ; et al. | 2021-04-29 |
Component Carrier With Electrically Conductive Layer Structures Having Windows Defined By a Conformal Mask and Tapering at Least Partially
App 20210127496 - Tuominen; Mikael ; et al. | 2021-04-29 |
Sacrificial structure with dummy core and two sections of separate material thereon for manufacturing component carriers
Grant 10,973,133 - Tay , et al. April 6, 2 | 2021-04-06 |
Traceability of Subsequent Layer Structure Manufacturing of Main Body for Component Carriers by means of Laterally and Verticially Displaced Information Carrying Structures
App 20210084752 - Tay; Seok Kim ; et al. | 2021-03-18 |
Component carrier with improved toughness factor
Grant 10,939,548 - Baftiri , et al. March 2, 2 | 2021-03-02 |
Semi-Flex Component Carrier With Dielectric Material Surrounding an Embedded Component and Having Locally Reduced Young Modulus
App 20210045249 - Tuominen; Mikael ; et al. | 2021-02-11 |
Component carrier with alternatingly vertically stacked layer structures of different electric density
Grant 10,834,831 - Tuominen November 10, 2 | 2020-11-10 |
Component carrier with different surface finishes
Grant 10,806,027 - Tuominen , et al. October 13, 2 | 2020-10-13 |
Semi-finished Product For The Production Of Connection Systems For Electronic Components
App 20200305279 - CHEN; Peiwang ; et al. | 2020-09-24 |
Component embedding in thinner core using dielectric sheet
Grant 10,779,415 - Tay , et al. Sept | 2020-09-15 |
Component Carrier Comprising Dielectric Structures With Different Physical Properties
App 20200281071 - Liu; Kim ; et al. | 2020-09-03 |
Component Carrier With Blind Hole Filled With An Electrically Conductive Medium And Fulfilling A Minimum Thickness Design Rule
App 20200253054 - Kind Code | 2020-08-06 |
Component Carrier With Bridge Structure In Through Hole Fulfilling Minimum Distance Design Rule
App 20200253050 - Kind Code | 2020-08-06 |
Manufacturing Holes In Component Carrier Material
App 20200253051 - Kind Code | 2020-08-06 |
Component Carrier
App 20200243436 - Baftiri; Artan | 2020-07-30 |
Semi-finished product for the production of connection systems for electronic components and method
Grant 10,729,013 - Chen , et al. | 2020-07-28 |
Component Carrier With Improved Toughness Factor
App 20200236781 - Baftiri; Artan ; et al. | 2020-07-23 |
Component carrier comprising a copper filled multiple-diameter laser drilled bore
Grant 10,701,793 - Bauer-Oppinger , et al. | 2020-06-30 |
Component Carrier With Embedded Large Die
App 20200163205 - Tay; Seok Kim ; et al. | 2020-05-21 |
Method of Manufacturing a Component Carrier Using a Separation Component, the Component Carrier, and a Semifinished Product
App 20200163223A1 - | 2020-05-21 |
Component Carrier With Improved Toughness Factor
App 20200163211 - Baftiri; Artan ; et al. | 2020-05-21 |
Component Carrier With Improved Bending Performance
App 20200154558 - Xin; Nick ; et al. | 2020-05-14 |
Component carrier with improved toughness factor
Grant 10,653,009 - Baftiri , et al. | 2020-05-12 |
Electronic device with a plurality of component carrier packages being electrically and mechanically connected
Grant 10,643,928 - Tuominen | 2020-05-05 |
Component Carrier Having a Laser Via and Method of Manufacturing
App 20200137892 - Ling; Yee-Bing ; et al. | 2020-04-30 |
Stress Relief Opening for Reducing Warpage of Component Carriers
App 20200100358 - Tuominen; Mikael ; et al. | 2020-03-26 |
Component carrier and manufacturing method
Grant 10,595,414 - Tuominen | 2020-03-17 |
Component carrier comprising a copper filled mechanical drilled multiple-diameter bore
Grant 10,433,415 - Sun , et al. O | 2019-10-01 |
Electronic Component Embedded by Laminate Sheet
App 20190254169 - TAY; Annie ; et al. | 2019-08-15 |
Component Carrier Comprising a Copper Filled Multiple-Diameter Laser Drilled Bore
App 20190215950 - Bauer-Oppinger; Nikolaus ; et al. | 2019-07-11 |
Component carrier comprising a copper filled multiple-diameter laser drilled bore
Grant 10,278,280 - Bauer-Oppinger , et al. | 2019-04-30 |
Component Embedding in Thinner Core Using Dielectric Sheet
App 20190116671 - TAY; Annie ; et al. | 2019-04-18 |
Electronic Device With a Plurality of Component Carrier Packages Being Electrically and Mechanically Connected
App 20180350725 - Tuominen; Mikael | 2018-12-06 |
Component Carrier With Alternatingly Vertically Stacked Layer Structures of Different Electric Density
App 20180343751 - Tuominen; Mikael | 2018-11-29 |
Component Carrier and Manufacturing Method
App 20180288879 - Tuominen; Mikael | 2018-10-04 |
Component Carriers Sandwiching a Sacrificial Structure and Having Pure Dielectric Layers Next to the Sacrificial Structure
App 20180255650 - Tay; Annie ; et al. | 2018-09-06 |
Sacrificial Structure With Dummy Core and Two Sections of Separate Material Thereon for Manufacturing Component Carriers
App 20180255649 - Tay; Annie ; et al. | 2018-09-06 |
Thermally Highly Conductive Coating on Base Structure Accommodating a Component
App 20180213634 - TUOMINEN; Mikael ; et al. | 2018-07-26 |
Component Carrier Comprising a Copper Filled Mechanical Drilled Multiple-Diameter Bore
App 20170223819 - Sun; Sally ; et al. | 2017-08-03 |
Component Carrier Comprising a Copper Filled Multiple-Diameter Laser Drilled Bore
App 20170223820 - Bauer-Oppinger; Nikolaus ; et al. | 2017-08-03 |
Component Carrier With Different Surface Finishes
App 20170196081 - Tuominen; Mikael ; et al. | 2017-07-06 |
Semi-finished Product For The Production Of Connection Systems For Electronic Components And Method
App 20170079145 - CHEN; Peiwang ; et al. | 2017-03-16 |
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