loadpatents
name:-0.021576166152954
name:-0.017331838607788
name:-0.00085806846618652
Asuke; Shintaro Patent Filings

Asuke; Shintaro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Asuke; Shintaro.The latest application filed is for "method of manufacturing a part of a mems system".

Company Profile
0.17.17
  • Asuke; Shintaro - Nagano-ken N/A JP
  • Asuke; Shintaro - Suwa N/A JP
  • Asuke; Shintaro - Fujimi JP
  • Asuke; Shintaro - Fujimi-machi JP
  • Asuke; Shintaro - Nagano JP
  • Asuke; Shintaro - Suwa-gun JP
  • Asuke, Shintaro - Suwa-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Bonding method and bonded body
Grant 8,679,283 - Yamamoto , et al. March 25, 2
2014-03-25
Bonding method and bonded body
Grant 8,617,340 - Yamamoto , et al. December 31, 2
2013-12-31
Method of manufacturing a part of a MEMS system
Grant 8,486,218 - Asuke July 16, 2
2013-07-16
Method of Manufacturing a Part of a MEMS System
App 20130001810 - Asuke; Shintaro
2013-01-03
Bonding Method and Bonded Body
App 20120315450 - Yamamoto; Takatoshi ;   et al.
2012-12-13
Method of manufacturing liquid crystal device
Grant 8,243,249 - Asuke August 14, 2
2012-08-14
Separating method of bonded body
Grant 8,211,259 - Sato , et al. July 3, 2
2012-07-03
Method of Manufacturing a Part of a MEMS System
App 20120094132 - Asuke; Shintaro
2012-04-19
Method of manufacturing bonded body and bonded body
Grant 8,101,044 - Asuke January 24, 2
2012-01-24
Method Of Manufacturing Liquid Crystal Device
App 20100006538 - ASUKE; Shintaro
2010-01-14
Coating method, liquid supplying head and liquid supplying apparatus
Grant 7,641,943 - Asuke January 5, 2
2010-01-05
Method Of Manufacturing Bonded Body And Bonded Body
App 20090226741 - Asuke; Shintaro
2009-09-10
Bonding Method And Bonded Body
App 20090136767 - YAMAMOTO; Takatoshi ;   et al.
2009-05-28
Separating Method Of Bonded Body
App 20090133820 - SATO; Mitsuru ;   et al.
2009-05-28
Nozzle plate producing method
Grant 7,516,549 - Asuke April 14, 2
2009-04-14
Solvent removal apparatus and method
Grant 7,353,623 - Asuke April 8, 2
2008-04-08
Method and system for evaluating lyophobicity of inner wall of fine tube including lyophobic film
Grant 7,305,868 - Asuke , et al. December 11, 2
2007-12-11
Liquid-repellent film-coated member, constitutive member of liquid-jet device, nozzle plate of liquid-jet head, liquid-jet head, and liquid-jet device
Grant 7,267,426 - Miyajima , et al. September 11, 2
2007-09-11
Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method
Grant 7,148,148 - Mori , et al. December 12, 2
2006-12-12
Method of forming a film of predetermined pattern on a surface as well as device manufactured by employing the same, and method of manufacturing device
Grant 7,098,121 - Mori , et al. August 29, 2
2006-08-29
Nozzle plate producing method, nozzle plate, liquid droplet ejecting head and liquid droplet ejecting apparatus
App 20060152549 - Asuke; Shintaro
2006-07-13
Solvent removal apparatus and method
App 20060137213 - Asuke; Shintaro
2006-06-29
Coating method, liquid supplying head and liquid supplying apparatus
App 20060141167 - Asuke; Shintaro
2006-06-29
Method and system for evaluating lyophobicity of inner wall of fine tube including lyophobic film
App 20050214948 - Asuke, Shintaro ;   et al.
2005-09-29
Plasma processing apparatus and plasma processing system with reduced feeding loss, and method for stabilizing the apparatus and system
Grant 6,899,787 - Nakano , et al. May 31, 2
2005-05-31
Liquid-repellent film-coated member, constitutive member of liquid-jet device, nozzle plate of liquid-jet head, liquid-jet head, and liquid-jet device
App 20050001879 - Miyajima, Hiroo ;   et al.
2005-01-06
Continuous-treatment apparatus and continuous-treatment method
App 20040221616 - Asuke, Shintaro ;   et al.
2004-11-11
Pattern forming method and apparatus used for semiconductor device, electric circuit, display module, and light emitting device
App 20040209190 - Mori, Yoshiaki ;   et al.
2004-10-21
Film formation method as well as device manufactured by employing the same, and method of manufacturing device
App 20040082163 - Mori, Yoshiaki ;   et al.
2004-04-29
Mask forming and removing method, and a semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method
App 20030143845 - Mori, Yoshiaki ;   et al.
2003-07-31
Plasma processing apparatus and plasma processing system with reduced feeding loss, and method for stabilizing the apparatus and system
App 20030056901 - Nakano, Akira ;   et al.
2003-03-27

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