Aspar; Bernard

Patent Applications and Registrations

Patent applications and USPTO patent grants for Aspar; Bernard.The latest application filed is for "structure for radio frequency applications".

Company Profile

4.73.68

Aspar; Bernard - Saint-Ismier FR
Aspar; Bernard - Rives FR
Aspar; Bernard - St. Ismier N/A FR
Aspar; Bernard - Rivers FR
Aspar, Bernard - Riues FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure For Radio Frequency Applications App 20210280990 - Desbonnets; Eric ; et al.	2021-09-09
Structure for radio frequency applications Grant 11,043,756 - Desbonnets , et al. June 22, 2	2021-06-22
Heterostructure And Method Of Fabrication App 20210058058 - Castex; Arnaud ; et al.	2021-02-25
Heterostructure and method of fabrication Grant 10,826,459 - Castex , et al. November 3, 2	2020-11-03
Heterostructure And Method Of Fabrication App 20200280298 - Castex; Arnaud ; et al.	2020-09-03
Structure For A Radio Frequency Application App 20190372243 - Desbonnets; Eric ; et al.	2019-12-05
Heterostructure And Method Of Fabrication App 20180159498 - Castex; Arnaud ; et al.	2018-06-07
Methods for fabrication of semiconductor structures using laser lift-off process, and related semiconductor structures Grant 9,728,458 - Sadaka , et al. August 8, 2	2017-08-08
Methods of forming semiconductor structures including MEMS devices and integrated circuits on common sides of substrates, and related structures and devices Grant 9,511,996 - Sadaka , et al. December 6, 2	2016-12-06
Methods of forming semiconductor structures including MEMS devices and integrated circuits on opposing sides of substrates, and related structures and devices Grant 9,481,566 - Sadaka , et al. November 1, 2	2016-11-01
Methods Of Forming Semiconductor Structures Including Mems Devices And Integrated Circuits On Common Sides Of Substrates, And Related Structures And Devices App 20150210540 - Sadaka; Mariam ; et al.	2015-07-30
Methods Of Forming Semiconductor Structures Including Mems Devices And Integrated Circuits On Opposing Sides Of Substrates, And Related Structures And Devices App 20150191344 - Sadaka; Mariam ; et al.	2015-07-09
Methods For Fabrication Of Semiconductor Structures Using Laser Lift-off Process, And Related Semiconductor Structures App 20150179520 - Sadaka; Mariam ; et al.	2015-06-25
Process of treating defects during the bonding of wafers Grant 8,722,515 - Lagahe , et al. May 13, 2	2014-05-13
Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate Grant 8,679,946 - Moriceau , et al. March 25, 2	2014-03-25
Method for trimming a structure obtained by the assembly of two plates Grant 8,628,674 - Zussy , et al. January 14, 2	2014-01-14
Process for the transfer of a thin film comprising an inclusion creation step Grant 8,609,514 - Moriceau , et al. December 17, 2	2013-12-17
Process Of Treating Defects During The Bonding Of Wafers App 20130323861 - Lagahe; Chrystelle ; et al.	2013-12-05
Method for fabricating a semiconductor substrate Grant 8,575,010 - Drouin , et al. November 5, 2	2013-11-05
Process For The Transfer Of A Thin Film Comprising An Inclusion Creation Step App 20130273713 - MORICEAU; Hubert ; et al.	2013-10-17
Process of treating defects during the bonding of wafers Grant 8,530,334 - Lagahe , et al. September 10, 2	2013-09-10
Manufacturing Process For A Stacked Structure Comprising A Thin Layer Bonding To A Target Substrate App 20130230967 - Moriceau; Hubert ; et al.	2013-09-05
Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate Grant 8,481,409 - Moriceau , et al. July 9, 2	2013-07-09
Methods of making substrate structures having a weakened intermediate layer Grant 8,475,693 - Bruel , et al. July 2, 2	2013-07-02
Process for the transfer of a thin film comprising an inclusion creation step Grant 8,470,712 - Moriceau , et al. June 25, 2	2013-06-25
Method For Trimming A Structure Obtained By The Assembly Of Two Plates App 20130078785 - Zussy; Marc ; et al.	2013-03-28
Structure For Microelectronics And Microsystem And Manufacturing Process App 20130012024 - Aspar; Bernard	2013-01-10
Method for trimming a structure obtained by the assembly of two plates Grant 8,329,048 - Zussy , et al. December 11, 2	2012-12-11
Method of transferring a circuit onto a ground plane Grant 8,298,915 - Aspar October 30, 2	2012-10-30
Surface roughening process Grant 8,268,703 - Aspar , et al. September 18, 2	2012-09-18
Process for assembling wafers by means of molecular adhesion Grant 8,232,130 - Broekaart , et al. July 31, 2	2012-07-31
Stacked structure and production method thereof Grant 8,193,069 - Moriceau , et al. June 5, 2	2012-06-05
Method Of Producing A Thin Layer Of Semiconductor Material App 20120133028 - Aspar; Bernard ; et al.	2012-05-31
Annealing process for annealing a structure Grant 8,158,487 - Sousbie , et al. April 17, 2	2012-04-17
Method of producing a thin layer of semiconductor material Grant 8,101,503 - Aspar , et al. January 24, 2	2012-01-24
Method for producing partial SOI structures comprising zones connecting a superficial layer and a substrate Grant 8,044,465 - Aspar , et al. October 25, 2	2011-10-25
Methods Of Making Substrate Structures Having A Weakened Intermediate Layer App 20110250416 - Bruel; Michel ; et al.	2011-10-13
Annealing Process For Annealing A Structure App 20110183495 - Sousbie; Nicolas ; et al.	2011-07-28
Process For The Transfer Of A Thin Film Comprising An Inclusion Creation Step App 20110092051 - Moriceau; Hubert ; et al.	2011-04-21
Detachable substrate with controlled mechanical strength and method of producing same Grant 7,902,038 - Aspar , et al. March 8, 2	2011-03-08
Process for the transfer of a thin film Grant 7,883,994 - Moriceau , et al. February 8, 2	2011-02-08
Method For Fabricating A Semiconductor Substrate App 20110024868 - Drouin; Alexis ; et al.	2011-02-03
Process Of Treating Defects During The Bonding Of Wafers App 20100285213 - Lagahe; Chrystelle ; et al.	2010-11-11
Method for transferring wafers Grant 7,807,482 - Aspar , et al. October 5, 2	2010-10-05
Process of forming and controlling rough interfaces Grant 7,807,548 - Aspar , et al. October 5, 2	2010-10-05
Method For Producing Partial Soi Structures Comprising Zones Connecting A Superficial Layer And A Substrate App 20100176397 - ASPAR; Bernard ; et al.	2010-07-15
Process for the collective fabrication of microstructures consisting of superposed elements Grant 7,737,000 - Rommeveaux , et al. June 15, 2	2010-06-15
Detachable substrate or detachable structure and method for the production thereof Grant 7,713,369 - Aspar , et al. May 11, 2	2010-05-11
Method for producing partial SOI structures comprising zones connecting a superficial layer and a substrate Grant 7,709,305 - Aspar , et al. May 4, 2	2010-05-04
Method For Producing Self-supporting Membranes App 20100032085 - Sousbie; Nicolas ; et al.	2010-02-11
Compliant Substrate In Particular For Hetero-Epitaxial Depositing App 20090311477 - ASPAR; Bernard ; et al.	2009-12-17
Method for Making a Plate-Like Detachable Structure, in Particular Made of Silicon, and Use of Said Method App 20090301995 - Aspar; Bernard ; et al.	2009-12-10
Process for assembling wafers by means of molecular adhesion App 20090280595 - Broekaart; Marcel ; et al.	2009-11-12
Method for making thin layers containing microcomponents Grant 7,615,463 - Aspar , et al. November 10, 2	2009-11-10
Process For The Collective Fabrication Of Microstructures Consisting Of Superposed Elements App 20090275152 - Rommeveaux; Philippe ; et al.	2009-11-05
Method Of Producing A Thin Layer Of Semiconductor Material App 20090130392 - Aspar; Bernard ; et al.	2009-05-21
Method For Trimming A Structure Obtained By The Assembly Of Two Plates App 20090095399 - Zussy; Marc ; et al.	2009-04-16
Method of producing a thin layer of semiconductor material Grant 7,498,234 - Aspar , et al. March 3, 2	2009-03-03
Embrittled substrate and method for making same Grant 7,498,245 - Aspar , et al. March 3, 2	2009-03-03
Method of producing mixed substrates and structure thus obtained Grant 7,494,897 - Fournel , et al. February 24, 2	2009-02-24
Method for Transferring Wafers App 20080254596 - Aspar; Bernard ; et al.	2008-10-16
Surface roughening process App 20080176381 - Aspar; Bernard ; et al.	2008-07-24
Process of forming and controlling rough interfaces App 20080176382 - Aspar; Bernard ; et al.	2008-07-24
Method of Transferring a Circuit Onto a Ground Plane App 20080128868 - Aspar; Bernard	2008-06-05
Intermediate suction support and its utilisation for producing a thin film structure Grant 7,368,030 - Jaussaud , et al. May 6, 2	2008-05-06
New Structure for Microelectronics and Microsystem and Manufacturing Process App 20080036039 - Aspar; Bernard	2008-02-14
Process For The Transfer Of A Thin Film App 20070232025 - Moriceau; Hubert ; et al.	2007-10-04
Method for separating wafers bonded together to form a stacked structure Grant 7,264,996 - Moriceau , et al. September 4, 2	2007-09-04
Method For Producing Partial Soi Structures Comprising Zones Connecting A Superficial Layer And A Substrate App 20070200144 - ASPAR; Bernard ; et al.	2007-08-30
Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure Grant 7,258,743 - Fournel , et al. August 21, 2	2007-08-21
Formation of a semiconductor substrate that may be dismantled and obtaining a semiconductor element Grant 7,238,598 - Lagahe , et al. July 3, 2	2007-07-03
Process for the transfer of a thin film Grant 7,229,899 - Moriceau , et al. June 12, 2	2007-06-12
Method for handling semiconductor layers in such a way as to thin same Grant 7,205,211 - Aspar , et al. April 17, 2	2007-04-17
Method for preparing and assembling substrates App 20070072393 - Aspar; Bernard ; et al.	2007-03-29
Method for forming a brittle zone in a substrate by co-implantation App 20070037363 - Aspar; Bernard ; et al.	2007-02-15
Stacked structure and production method thereof App 20060281212 - Moriceau; Hubert ; et al.	2006-12-14
Process for cutting out a block of material and formation of a thin film App 20060191627 - Aspar; Bernard ; et al.	2006-08-31
Method of producing mixed substrates and structure thus obtained App 20060166461 - Fournel; Franck ; et al.	2006-07-27
Method of producing a thin layer of semiconductor material Grant 7,067,396 - Aspar , et al. June 27, 2	2006-06-27
Layer transfer method Grant 7,060,590 - Bressot , et al. June 13, 2	2006-06-13
Method of producing a thin layer of semiconductor material App 20060115961 - Aspar; Bernard ; et al.	2006-06-01
Method for cutting a block of material and forming a thin film Grant 7,029,548 - Aspar , et al. April 18, 2	2006-04-18
Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate App 20060079071 - Moriceau; Hubert ; et al.	2006-04-13
Method for making a detachable semiconductor substrate and for obtaining a semiconductor element App 20060019476 - Lagahe; Chrystelle ; et al.	2006-01-26
Method for making a stacked comprising a thin film adhering to a target substrate Grant 6,974,759 - Moriceau , et al. December 13, 2	2005-12-13
Intermediate suction support and its utilisation for producing a thin film structure App 20050270867 - Jaussaud, Claude ; et al.	2005-12-08
Method for selectively transferring at least an element from an initial support onto a final support Grant 6,959,863 - Figuet , et al. November 1, 2	2005-11-01
Method for making thin layers containing microcomponents App 20050221583 - Aspar, Bernard ; et al.	2005-10-06
Method for producing a thin film comprising introduction of gaseous species Grant 6,946,365 - Aspar , et al. September 20, 2	2005-09-20
Method for producing thin layers on a specific support and an application thereof Grant 6,939,782 - Aspar , et al. September 6, 2	2005-09-06
Method for transferring elements between substrates App 20050178495 - Aspar, Bernard ; et al.	2005-08-18
Photolithography mask comprising absorber/phase-shifter elements App 20050158634 - Thony, Philippe ; et al.	2005-07-21
Layer transfer methods Grant 6,913,971 - Aspar , et al. July 5, 2	2005-07-05
High density element structure formed by assembly of layers and method for making same Grant 6,909,445 - Baleras , et al. June 21, 2	2005-06-21
Method for handling semiconductor layers in such a way as to thin same App 20050124138 - Aspar, Bernard ; et al.	2005-06-09
Method for separating wafers bonded together to form a stacked structure App 20050112847 - Moriceau, Hubert ; et al.	2005-05-26
Detachable substrate or detachable structure and method for the production thereof App 20050029224 - Aspar, Bernard ; et al.	2005-02-10
Flat liquid crystal, screen operating in reflective mode and method for manufacturing this screen Grant 6,853,414 - Aspar , et al. February 8, 2	2005-02-08
Multilayer monolithic electronic device and method for producing such a device App 20040252931 - Belleville, Marc ; et al.	2004-12-16
Method for separating two elements and a device therefor Grant 6,821,376 - Rayssac , et al. November 23, 2	2004-11-23
Detachable substrate with controlled mechanical hold and method for production thereof App 20040222500 - Aspar, Bernard ; et al.	2004-11-11
Method for producing a buried layer of material in another material Grant 6,808,967 - Aspar , et al. October 26, 2	2004-10-26
Method for making a thin film using pressurization Grant 6,809,044 - Aspar , et al. October 26, 2	2004-10-26
Method of producing a thin layer of semiconductor material Grant 6,809,009 - Aspar , et al. October 26, 2	2004-10-26
Layer transfer method App 20040166649 - Bressot, Severine ; et al.	2004-08-26
A Method Of Producing A Thin Layer Of Semiconductor Material App 20040166651 - ASPAR, BERNARD ; et al.	2004-08-26
Multilayer structure with controlled internal stresses and making same Grant 6,756,285 - Moriceau , et al. June 29, 2	2004-06-29
Method for transferring a thin film comprising a step of generating inclusions Grant 6,756,286 - Moriceau , et al. June 29, 2	2004-06-29
Method for producing thin layers on a specific support and an application thereof App 20040110320 - Aspar, Bernard ; et al.	2004-06-10
Method for selectively transferring at least an element from an initial support onto a final support App 20040104272 - Figuet, Christophe ; et al.	2004-06-03
Method for producing a thin film comprising introduction of gaseous species App 20040092087 - Aspar, Bernard ; et al.	2004-05-13
Flat liquid crystal display operating in reflective mode and method for making same App 20040084401 - Aspar, Bernard ; et al.	2004-05-06
Layer transfer methods App 20040082147 - Aspar, Bernard ; et al.	2004-04-29
Process for the transfer of a thin film comprising an inclusion creation step App 20040058555 - Moriceau, Hubert ; et al.	2004-03-25
Method for making a stacked structure comprising a thin film adhering to a target substrate App 20040014299 - Moriceau, Hubert ; et al.	2004-01-22
Method for cutting a block of material and forming a thin film App 20030234075 - Aspar, Bernard ; et al.	2003-12-25
Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structure App 20030175531 - Fournel, Frank ; et al.	2003-09-18
Embrittled substrate and method for making same App 20030077885 - Aspar, Bernard ; et al.	2003-04-24
High density element structure formed by assembly of layers and method for making same App 20030052945 - Baleras, Francois ; et al.	2003-03-20
Intermediate suction support and its utilisation or producing a thin film structure App 20030047289 - Jaussaud, Claude ; et al.	2003-03-13
Method for producing a thin membrane and resulting structure with membrane Grant 6,465,327 - Aspar , et al. October 15, 2	2002-10-15
Treatment process for molecular bonding and unbonding of two structures Grant 6,429,094 - Maleville , et al. August 6, 2	2002-08-06
Thin layer structure made up of conductive and insulative zones App 20020094668 - Aspar, Bernard ; et al.	2002-07-18
Heat treatment method for semiconductor substrates Grant 6,403,450 - Maleville , et al. June 11, 2	2002-06-11
Structure comprising a thin layer of material made up of conductive zones and insulating zones and a method of manufacturing such a structure Grant 6,362,077 - Aspar , et al. March 26, 2	2002-03-26
Treatment Process For Molecular Bonding And Unbonding Of Two Structures App 20020022337 - MALEVILLE, CHRISTOPHE ; et al.	2002-02-21
Method for making a thin film on a support and resulting structure including an additional thinning stage before heat treatment causes micro-cavities to separate substrate element Grant 6,335,258 - Aspar , et al. January 1, 2	2002-01-01
Method for obtaining a thin film in particular semiconductor, comprising a protected ion zone and involving an ion implantation Grant 6,316,333 - Bruel , et al. November 13, 2	2001-11-13
Method for making a thin film of solid material Grant 6,303,468 - Aspar , et al. October 16, 2	2001-10-16
Method of producing a thin layer of semiconductor material App 20010007789 - Aspar, Bernard ; et al.	2001-07-12
Method of producing a thin layer of semiconductor material Grant 6,225,192 - Aspar , et al. May 1, 2	2001-05-01
Selective transfer of elements from one support to another support Grant 6,204,079 - Aspar , et al. March 20, 2	2001-03-20
Process for the manufacture of passive and active components on the same insulating substrate Grant 6,197,695 - Joly , et al. March 6, 2	2001-03-06
Method for achieving a thin film of solid material and applications of this method Grant 6,190,998 - Bruel , et al. February 20, 2	2001-02-20
Method of obtaining a thin film of semiconductor material Grant 6,103,597 - Aspar , et al. August 15, 2	2000-08-15
Method of producing a thin layer of semiconductor material Grant 6,020,252 - Aspar , et al. February 1, 2	2000-02-01